GD25LB16ESIGR Equivalent & Substitute Parts

Part Overview

The GD25LB16ESIGR is a 16Mbit NOR Flash memory IC manufactured by GigaDevice Semiconductor (HK) Limited. This SPI/Quad I/O device operates at 133 MHz with a 6 ns access time and is housed in an 8-SOP package. The part is currently in active production status with 879 units in stock. Finding equivalent substitute parts is necessary to ensure supply chain flexibility, optimize procurement costs, and maintain design continuity when the primary part becomes unavailable or when alternative packaging formats are required.

Substiute Parts

GD25LB16ESIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 984GD25LB16ESIGR Datasheet

Current PartRFQ

GD25LQ16ESIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 3001GD25LQ16ESIGR Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the GD25LB16ESIGR are identified based on strict parametric equivalence across the following critical criteria:

• Memory capacity and organization (16Mbit, 2M x 8)
• Interface protocol (SPI - Quad I/O, QPI)
• Operating frequency (133 MHz)
• Access time (6 ns)
• Write cycle timing (60µs word, 2.4ms page)
• Supply voltage range (1.65V ~ 2.1V)
• Operating temperature range (-40°C ~ 85°C)
• Physical package (8-SOIC, 5.30mm width)
• Surface mount compatibility

The GD25LQ16ESIGR meets all parametric requirements for direct substitution. Differences in packaging format (Cut Tape & Digi-Reel versus Tape & Reel) do not affect electrical or mechanical compatibility and represent only procurement and handling variations.

Parameter Comparison

Engineering Selection Recommendations

Both the GD25LB16ESIGR and GD25LQ16ESIGR are active production parts from the same manufacturer with identical electrical and mechanical specifications. Selection between these parts should be based on the following factors:

Packaging and Procurement Requirements: The GD25LQ16ESIGR is available in Cut Tape and Digi-Reel packaging formats, offering flexibility for different procurement volumes and assembly processes. The GD25LB16ESIGR is supplied in standard Tape & Reel format.

Compliance and Environmental Standards: The GD25LQ16ESIGR carries explicit ROHS3 compliance certification and defined Moisture Sensitivity Level (MSL 3, 168 hours), providing documented environmental compliance for regulated applications. These certifications should be verified for the GD25LB16ESIGR if required by your application or supply chain requirements.

Inventory Availability: The GD25LQ16ESIGR has higher current inventory (2938 units) compared to the GD25LB16ESIGR (879 units), which may influence procurement lead times and cost optimization strategies.

Frequently Asked Questions (FAQ)

Q: Can the GD25LQ16ESIGR be used as a direct replacement for the GD25LB16ESIGR in existing designs?

A: Yes. Both parts are electrically and mechanically identical across all specified parameters including memory capacity, interface protocol, operating frequency, access time, voltage range, temperature range, and physical package dimensions. No circuit modifications are required.

Q: What is the difference between the packaging formats listed for these parts?

A: The GD25LB16ESIGR is supplied in standard Tape & Reel (TR) format. The GD25LQ16ESIGR is available in Cut Tape (CT) and Digi-Reel® formats. These differences affect only the physical delivery and handling method; electrical and mechanical compatibility remain unchanged.

Q: Are there any compliance or certification differences between these parts?

A: The GD25LQ16ESIGR includes documented ROHS3 compliance and Moisture Sensitivity Level (MSL 3, 168 hours) specifications. Compliance documentation for the GD25LB16ESIGR should be obtained directly from GigaDevice Semiconductor if required for your application.

Q: What parameters must remain identical for a part to be considered a true substitute?

A: For NOR Flash memory ICs in this category, the following parameters must be identical: memory capacity (16Mbit), memory organization (2M x 8), interface protocol (SPI - Quad I/O, QPI), clock frequency (133 MHz), access time (6 ns), write cycle timing (60µs/2.4ms), supply voltage range (1.65V ~ 2.1V), operating temperature range (-40°C ~ 85°C), and physical package dimensions (8-SOIC, 5.30mm width).

Q: Can these parts be used interchangeably in high-volume production?

A: Yes, provided that procurement, assembly, and compliance requirements are aligned. The higher inventory availability of the GD25LQ16ESIGR may offer advantages for sustained production runs. Verify packaging format compatibility with your assembly equipment and supply chain processes.