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GD25B128EYIGR Equivalent & Substitute Parts
Part Overview
The GD25B128EYIGR is a 128Mbit NOR Flash memory IC manufactured by GigaDevice Semiconductor (HK) Limited. This device operates as a non-volatile storage solution with SPI Quad I/O interface capability, supporting clock frequencies up to 133 MHz. The part is currently in active production status with 797 units available in new original inventory. Substitute parts are identified when equivalent electrical parameters and mechanical compatibility are maintained across the memory interface, capacity, voltage specifications, and operating temperature range.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Memory Size | 128Mbit |
| Memory Organization | 16M x 8 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 133 MHz |
| Access Time | 7 ns |
| Write Cycle Time (Word/Page) | 70µs / 2.4ms |
| Voltage Supply Range | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C |
| Package Type | 8-WDFN Exposed Pad |
| Mounting Type | Surface Mount |
Substitute Part Grouping Explanation
Substitute parts for the GD25B128EYIGR are qualified based on the following electrical and mechanical parameters:
- Memory capacity: 128Mbit
- Memory organization: 16M x 8
- Interface protocol: SPI - Quad I/O
- Clock frequency: 133 MHz
- Access time: 7 ns
- Write cycle timing: 70µs (word) and 2.4ms (page)
- Supply voltage range: 2.7V ~ 3.6V
- Operating temperature range: -40°C ~ 85°C
- Package family: 8-WDFN Exposed Pad (physical dimensions may vary within package family)
- Mounting: Surface Mount
The identified substitutes maintain all critical electrical parameters. Package variations within the 8-WSON family (6x8mm and 5x6mm) are acceptable substitutes provided PCB layout accommodates the physical dimensions.
Parameter Comparison
| Parameter | GD25B128EYIGR | GD25B128EWIGR | GD25Q128EYIGR |
|---|---|---|---|
| Manufacturer | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited |
| Memory Size | 128Mbit | 128Mbit | 128Mbit |
| Memory Organization | 16M x 8 | 16M x 8 | 16M x 8 |
| Memory Interface | SPI - Quad I/O | SPI - Quad I/O | SPI - Quad I/O |
| Clock Frequency | 133 MHz | 133 MHz | 133 MHz |
| Access Time | 7 ns | 7 ns | 7 ns |
| Write Cycle Time (Word/Page) | 70µs / 2.4ms | 70µs / 2.4ms | 70µs / 2.4ms |
| Voltage Supply | 2.7V ~ 3.6V | 2.7V ~ 3.6V | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Package / Case | 8-WDFN Exposed Pad | 8-WDFN Exposed Pad | 8-WDFN Exposed Pad |
| Supplier Device Package | 8-WSON (6x8) | 8-WSON (5x6) | 8-WSON (6x8) |
| Product Status | Active | Active | Active |
| Inventory (New Original) | 797 Pcs | 3751 Pcs | 3764 Pcs |
Engineering Selection Recommendations
All three parts maintain identical electrical specifications and are suitable for direct substitution in applications requiring 128Mbit SPI Quad I/O Flash memory. Selection between GD25B128EYIGR, GD25B128EWIGR, and GD25Q128EYIGR should be based on:
- PCB layout constraints: GD25B128EWIGR uses 5x6mm package; GD25B128EYIGR and GD25Q128EYIGR use 6x8mm package
- Packaging format availability: GD25B128EWIGR is available in Cut Tape and Digi-Reel; GD25B128EYIGR and GD25Q128EYIGR are available in Tape & Reel
- Inventory requirements: GD25B128EWIGR and GD25Q128EYIGR offer higher stock levels (3751 and 3764 units respectively)
- Compliance certifications: GD25B128EWIGR and GD25Q128EYIGR carry RoHS3, REACH, and ECCN documentation
Frequently Asked Questions (FAQ)
Q: Can GD25B128EWIGR replace GD25B128EYIGR directly on the PCB?
A: Electrical substitution is valid. Physical substitution requires PCB layout verification. GD25B128EWIGR uses 5x6mm package dimensions versus 6x8mm for GD25B128EYIGR. Footprint compatibility must be confirmed before assembly.
Q: What is the difference between GD25B128EYIGR and GD25Q128EYIGR?
A: Both parts share identical electrical parameters, memory capacity, interface protocol, and operating specifications. The primary difference is the product line designation (B versus Q series). Both use 6x8mm package dimensions and are electrically interchangeable.
Q: Are all three parts RoHS compliant?
A: GD25B128EYIGR compliance status is not specified in available documentation. GD25B128EWIGR and GD25Q128EYIGR are both RoHS3 compliant with REACH unaffected status.
Q: What packaging formats are available for each part?
A: GD25B128EYIGR is supplied in Tape & Reel format. GD25B128EWIGR is available in Cut Tape and Digi-Reel formats. GD25Q128EYIGR is supplied in Tape & Reel format.
Q: Are moisture sensitivity levels specified for all parts?
A: GD25B128EYIGR moisture sensitivity level is not documented. GD25B128EWIGR and GD25Q128EYIGR both specify MSL 3 (168 Hours).
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