FX604P3 Equivalent & Substitute Parts

Part Overview

The FX604P3 is a V.23 compatible modem interface component manufactured by CML Microcircuits, designed for 1.2k FSK data transmission. This device is classified as obsolete, indicating it is no longer in active production. Due to its obsolete status, identifying functionally equivalent substitute parts is essential for system redesign, maintenance, and component sourcing in applications requiring V.23 modem functionality.

Substiute Parts

FX604P3

CML MicrocircuitsIn Stock: 1902FX604P3 Datasheet

Current PartRFQ

FX604D4

CML MicrocircuitsIn Stock: 1711FX604D4 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the FX604P3 is determined by the following critical parameters:

• Data Format & Protocol: FSK, V.23 compatibility
• Baud Rate: 1.2k transmission speed
• Voltage Supply Range: 3V ~ 5.5V operational window
• Functional Equivalence: Base product number FX604 series

The FX604D4 qualifies as a functional substitute based on identical data format, baud rate, voltage supply range, and base product series. The primary difference is the package type: the FX604D4 uses surface mount (16-SOIC) packaging instead of through-hole (16-DIP) mounting. This substitution requires PCB redesign to accommodate the different mounting technology.

Parameter Comparison

Engineering Selection Recommendations

The FX604D4 is the identified substitute for the FX604P3 based on functional equivalence in data format, baud rate, and voltage supply specifications. Both components share identical electrical characteristics for V.23 modem operation.

Product Status Consideration: The FX604D4 carries a "Not For New Designs" designation, indicating limited availability and no active development support. The FX604P3 is classified as obsolete. Both parts represent legacy technology with restricted sourcing pathways.

Compliance Advantage: The FX604D4 provides ROHS3 compliance and REACH unaffected status, offering regulatory advantages over the FX604P3 for applications subject to environmental compliance requirements.

Package Transition Impact: Substitution requires transition from through-hole (DIP) to surface-mount (SOIC) technology. This necessitates PCB layout redesign, reflow soldering process implementation, and assembly procedure modification.

Frequently Asked Questions (FAQ)

Q: Can the FX604D4 directly replace the FX604P3 without PCB modification?

A: No. The FX604D4 uses 16-SOIC surface-mount packaging, while the FX604P3 uses 16-DIP through-hole packaging. PCB footprint redesign is required.

Q: Are the electrical characteristics identical between FX604P3 and FX604D4?

A: Yes. Both components operate at identical voltage supply ranges (3V ~ 5.5V), support the same data format (FSK, V.23), and transmit at 1.2k baud rates.

Q: What is the significance of the "Not For New Designs" status on the FX604D4?

A: This designation indicates the component is in end-of-life phase with no active manufacturer support for new product development. Availability may be limited, and long-term sourcing cannot be guaranteed.

Q: Does the FX604D4 offer better compliance than the FX604P3?

A: Yes. The FX604D4 is ROHS3 compliant and REACH unaffected, providing regulatory compliance advantages for applications subject to environmental standards.

Q: Are both components classified as obsolete?

A: The FX604P3 is classified as obsolete. The FX604D4 is classified as "Not For New Designs," indicating a later lifecycle stage but still restricted from new design implementation.