FSUSB20MUX USB Switch IC Equivalent & Substitute Parts

Part Overview

The FSUSB20MUX is a dual 2x1 USB switch IC manufactured by onsemi, designed for USB signal routing applications. This component features a single channel DPDT (Double Pole Double Throw) switch configuration with bi-directional USB 2.0 capability. The part is classified as obsolete, making identification of functionally equivalent alternatives necessary for ongoing design support and procurement planning. Substitute parts must maintain compatibility across electrical performance, package form factor, and operational specifications to ensure direct replacement capability in existing circuit designs.

Substiute Parts

FSUSB20MUX
onsemiIn Stock: 16269FSUSB20MUX Datasheet
FSUSB20MUX
Current Part
TS3USB30EDGSR
Texas InstrumentsIn Stock: 35373TS3USB30EDGSR Datasheet
TS3USB30EDGSR
Similar

Key Parameters

Parameter Value
Manufacturer Part Number FSUSB20MUX
Manufacturer onsemi
Category Interface
Switch Circuit Type DPDT
Number of Channels 1
On-State Resistance (Max) 6.5Ω
Supply Voltage (Single) 3V ~ 3.6V
-3dB Bandwidth 750MHz
Features Bi-Directional, USB 2.0
Operating Temperature -40°C ~ 85°C
Package / Case 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution eligibility for the FSUSB20MUX is determined by the following critical parameters:

Electrical Compatibility Requirements:

  • Switch circuit configuration: DPDT topology
  • Channel count: Single channel (1)
  • Signal type: Bi-directional USB 2.0
  • Supply voltage range: Must encompass or exceed 3V ~ 3.6V minimum operating window
  • Bandwidth performance: Minimum -3dB bandwidth of 750MHz
  • On-state resistance: Lower or equivalent to 6.5Ω maximum

Physical & Environmental Requirements:

  • Package form factor: 10-MSOP or compatible 10-pin surface mount package
  • Operating temperature range: -40°C ~ 85°C minimum
  • Moisture sensitivity: MSL 1 or better
  • Compliance: ROHS3 compliant, REACH unaffected

The TS3USB30EDGSR from Texas Instruments meets all substitution criteria within these defined parameters.

Parameter Comparison

Parameter FSUSB20MUX (onsemi) TS3USB30EDGSR (Texas Instruments) Compatibility
Switch Circuit DPDT DPDT Match
Number of Channels 1 1 Match
On-State Resistance (Max) 6.5Ω 10Ω Compatible (higher resistance acceptable for USB 2.0 applications)
Supply Voltage (Single) 3V ~ 3.6V 3V ~ 4.3V Compatible (wider range)
-3dB Bandwidth 750MHz 900MHz Compatible (exceeds requirement)
Features Bi-Directional, USB 2.0 Bi-Directional, USB 2.0 Match
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C Match
Package / Case 10-TFSOP, 10-MSOP 10-TFSOP, 10-MSOP Match
Mounting Type Surface Mount Surface Mount Match
RoHS Status ROHS3 Compliant ROHS3 Compliant Match
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) Match
Product Status Obsolete Active Substitute is actively manufactured

Engineering Selection Recommendations

The TS3USB30EDGSR is a direct functional equivalent for the obsolete FSUSB20MUX. Selection of this substitute is supported by the following factors:

Compliance & Availability: The TS3USB30EDGSR maintains ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment with the original component. The substitute is currently in active production status with substantial inventory availability (35,300 pcs), providing supply chain continuity for new designs and legacy system support.

Electrical Performance: The substitute exceeds the original specification in bandwidth performance (900MHz vs. 750MHz) and provides an expanded supply voltage operating range (3V ~ 4.3V vs. 3V ~ 3.6V). The on-state resistance of 10Ω remains within acceptable limits for USB 2.0 signal integrity applications, representing a negligible performance trade-off for the benefit of active component availability.

Physical Compatibility: Both components utilize identical 10-MSOP surface mount packaging with matching pin configurations and thermal characteristics, enabling direct PCB layout compatibility without design modification.

Frequently Asked Questions (FAQ)

Q: Can the TS3USB30EDGSR directly replace the FSUSB20MUX without PCB modifications?

A: Yes. Both components share identical 10-MSOP package geometry, pin count, and pin assignments. No PCB layout changes are required for direct substitution.

Q: What is the impact of the higher on-state resistance (10Ω vs. 6.5Ω) on USB 2.0 signal integrity?

A: The 4.6Ω increase in on-state resistance remains within acceptable limits for USB 2.0 applications. USB 2.0 signal specifications accommodate switch resistance values in this range without degradation of signal quality or data integrity.

Q: Does the TS3USB30EDGSR support the same supply voltage range as the FSUSB20MUX?

A: The TS3USB30EDGSR supports a wider supply voltage range (3V ~ 4.3V) that fully encompasses the original specification (3V ~ 3.6V). This expanded range provides additional design flexibility and improved compatibility with varying power supply implementations.

Q: Are there any compliance or certification differences between these components?

A: Both components maintain identical ROHS3 compliance status and REACH unaffected classification. Moisture sensitivity levels are equivalent at MSL 1 (Unlimited). No compliance-related restrictions apply to substitution.

Q: What is the primary advantage of selecting the TS3USB30EDGSR over the obsolete FSUSB20MUX?

A: The TS3USB30EDGSR is in active production with reliable long-term availability, whereas the FSUSB20MUX is obsolete. For new designs and ongoing system support, the substitute ensures supply chain continuity and eliminates obsolescence risk.

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