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Equivalent & Substitute Parts Reference for FST7345M
Part Overview
The FST7345M, manufactured by GeneSiC Semiconductor, is a Schottky diode array with a 1 Pair Common Cathode configuration, rated at 45 V reverse voltage and 35 A average rectified current per diode, in a D61-3M chassis mount package. The device features fast recovery characteristics and is designed for high current rectification applications. The product is currently classified as obsolete, making the identification of suitable substitutes necessary to ensure continued support for designs utilizing this model.
Substiute Parts
Key Parameters
| Manufacturer Part Number | Technology | Diode Configuration | Voltage - DC Reverse (Vr) (Max) | Current - Average Rectified (Io) (per Diode) | Voltage - Forward (Vf) (Max) @ If | Speed | Current - Reverse Leakage @ Vr | Operating Temperature - Junction | Mounting Type | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|
| FST7345M | Schottky | 1 Pair Common Cathode | 45 V | 35A | 700 mV @ 35 A | Fast Recovery <= 500ns, > 200mA (Io) | 1 mA @ 45 V | -55°C ~ 150°C | Chassis Mount | D61-3M |
Substitute Part Grouping Explanation
Substitutes for FST7345M are identified by matching the essential electrical and mechanical parameters. The primary substitution criteria include: Schottky technology, 1 Pair Common Cathode diode configuration, 45 V DC reverse voltage, high average rectified current per diode, fast recovery speed, chassis mount style, and equivalent package/case type. These parameters ensure proper fit and performance compatibility within the same application category.
Parameter Comparison
| Parameter | FST7345M | 80CNQ045 |
|---|---|---|
| Manufacturer | GeneSiC Semiconductor | SMC Diode Solutions |
| Manufacturer Part Number | FST7345M | 80CNQ045 |
| Category | Diodes, Rectifiers | Diodes, Rectifiers |
| Technology | Schottky | Schottky |
| Diode Configuration | 1 Pair Common Cathode | 1 Pair Common Cathode |
| Voltage - DC Reverse (Vr) (Max) | 45 V | 45 V |
| Current - Average Rectified (Io) (per Diode) | 35A | 40A |
| Voltage - Forward (Vf) (Max) @ If | 700 mV @ 35 A | 660 mV @ 40 A |
| Speed | Fast Recovery <= 500ns, > 200mA (Io) | Fast Recovery <= 500ns, > 200mA (Io) |
| Current - Reverse Leakage @ Vr | 1 mA @ 45 V | 5 mA @ 45 V |
| Operating Temperature - Junction | -55°C ~ 150°C | -55°C ~ 150°C |
| Mounting Type | Chassis Mount | Chassis Mount |
Engineering Selection Recommendations
Selection of a substitute part is justified on the basis of product status and regulatory compliance. FST7345M is obsolete, requiring an alternative for continued design or maintenance. The substitute, 80CNQ045, is listed as active and ROHS3 compliant. Moisture Sensitivity Level (MSL) for both products is rated at 1 (Unlimited), supporting direct interchange in equivalent environmental and regulatory contexts.
Frequently Asked Questions (FAQ)
Q1: What key parameters must be matched for substituting FST7345M?
A1: Substitute selection is based on matching technology (Schottky), diode configuration (1 Pair Common Cathode), voltage rating (45 V DC reverse), average rectified current, speed (fast recovery), mounting type (Chassis Mount), and operating temperature range.
Q2: Is the package/case of the substitute part identical to FST7345M?
A2: FST7345M uses the D61-3M chassis mount package, while 80CNQ045 uses PRM2 chassis mount. Mechanical compatibility depends on direct package matching.
Q3: Are there differences in forward voltage and reverse leakage between the parts?
A3: 80CNQ045 features a forward voltage of 660 mV @ 40 A and reverse leakage of 5 mA @ 45 V. FST7345M specifies 700 mV @ 35 A and 1 mA @ 45 V.
Q4: Does the substitute part offer the same regulatory compliance characteristics?
A4: Both parts carry an MSL rating of 1 (Unlimited). 80CNQ045 is ROHS3 compliant with REACH affected status.
Q5: Can the substitute be used in environments requiring the same operating temperature?
A5: Both the main and substitute parts are rated for -55°C to 150°C junction operating temperature, supporting direct use within the same thermal environments.
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