FST16233MTD Equivalent & Substitute Parts

Part Overview

The FST16233MTD is an 8 x 1:2 Multiplexer/Demultiplexer logic IC manufactured by onsemi in a 56-TSSOP package. This component is classified as obsolete, making equivalent substitute parts necessary for new designs and ongoing production support. The part operates across a single supply voltage range of 4V to 5.5V with an operating temperature range of -40°C to 85°C, suitable for industrial and commercial applications requiring multiplexing or demultiplexing functions.

Substiute Parts

FST16233MTD

onsemiIn Stock: 2048FST16233MTD Datasheet

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SN74CBT16233DGG

Texas InstrumentsIn Stock: 807SN74CBT16233DGG Datasheet

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SN74CBT16233DGGR

Texas InstrumentsIn Stock: 2313SN74CBT16233DGGR Datasheet

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SN74CBT16233DGVR

Texas InstrumentsIn Stock: 4115SN74CBT16233DGVR Datasheet

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SN74CBT16233DL

Texas InstrumentsIn Stock: 2291SN74CBT16233DL Datasheet

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SN74CBT16233DLR

Texas InstrumentsIn Stock: 3059SN74CBT16233DLR Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the FST16233MTD are qualified based on the following criteria:

Functional Compatibility: All substitute parts maintain the same multiplexer/demultiplexer function with 2 independent circuits and identical operating temperature range (-40°C ~ 85°C).

Electrical Compatibility: All substitutes operate on single supply voltage with overlapping supply ranges. The FST16233MTD operates at 4V ~ 5.5V, while all Texas Instruments SN74CBT16233 variants operate at 4.75V ~ 5.25V, creating a compatible overlap window of 4.75V ~ 5.25V.

Package Variants: Substitutes are available in three package configurations: 56-TFSOP (0.240", 6.10mm Width), 56-TVSOP (0.173", 4.40mm Width), and 56-BSSOP (0.295", 7.50mm Width). Package selection depends on PCB layout requirements and mechanical constraints.

Packaging Options: Substitutes are available in Tube and Tape & Reel (TR) formats to accommodate different procurement and assembly workflows.

Compliance Status: All substitute parts are ROHS3 compliant and REACH unaffected, meeting modern regulatory requirements.

Parameter Comparison

Engineering Selection Recommendations

For Direct Package Replacement: SN74CBT16233DGG and SN74CBT16233DGGR are the primary substitutes, maintaining the identical 56-TFSOP (0.240", 6.10mm Width) package footprint as the FST16233MTD. Both are manufactured by Texas Instruments and carry Active product status with ROHS3 compliance.

For Space-Constrained Applications: SN74CBT16233DGVR offers a narrower 56-TVSOP (0.173", 4.40mm Width) package, reducing PCB real estate requirements while maintaining electrical compatibility within the overlapping supply voltage window.

For Larger Package Tolerance: SN74CBT16233DL and SN74CBT16233DLR provide a 56-BSSOP (0.295", 7.50mm Width) package option, suitable for applications where increased package size is acceptable or preferred for thermal management.

For Production Workflows: SN74CBT16233DGGR and SN74CBT16233DLR are available in Tape & Reel (TR) packaging for automated assembly processes. SN74CBT16233DL is available in Tube packaging for manual or semi-automated assembly.

All substitute parts are Active products from Texas Instruments, ensuring long-term availability and supply chain stability compared to the obsolete FST16233MTD.

Frequently Asked Questions (FAQ)

Q: Can SN74CBT16233 variants directly replace the FST16233MTD without circuit modifications?

A: Electrical substitution is feasible within the overlapping supply voltage range of 4.75V ~ 5.25V. The FST16233MTD operates at 4V ~ 5.5V, while all SN74CBT16233 variants operate at 4.75V ~ 5.25V. If your design operates below 4.75V, the SN74CBT16233 variants are not suitable. Package footprints differ across variants; verify PCB layout compatibility before selection.

Q: What is the difference between the circuit configurations of 8 x 1:2 and 16 x 1:2?

A: The FST16233MTD provides 8 independent 1:2 multiplexer/demultiplexer channels, while all SN74CBT16233 substitutes provide 16 channels. The increased channel count in substitutes does not prevent functional compatibility; unused channels can remain unconnected in applications requiring only 8 channels.

Q: Which package variant should I select for new PCB designs?

A: Package selection depends on PCB layout constraints and assembly capabilities. The 56-TFSOP (0.240", 6.10mm Width) variants (SN74CBT16233DGG, SN74CBT16233DGGR) maintain the original footprint. The 56-TVSOP (0.173", 4.40mm Width) variant (SN74CBT16233DGVR) reduces board space. The 56-BSSOP (0.295", 7.50mm Width) variants (SN74CBT16233DL, SN74CBT16233DLR) provide larger spacing for manual soldering or thermal considerations.

Q: Are all substitute parts RoHS compliant?

A: All SN74CBT16233 variants are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards. The original FST16233MTD compliance status is not specified in available documentation.

Q: What is the difference between Tape & Reel and Tube packaging?

A: Tape & Reel (TR) packaging is designed for automated pick-and-place assembly equipment, offering higher throughput in production environments. Tube packaging is suitable for manual assembly, lower-volume production, or component storage. Both formats contain identical components; packaging selection depends on assembly methodology.

Q: Is the voltage supply range difference between FST16233MTD and SN74CBT16233 variants critical?

A: The overlapping range of 4.75V ~ 5.25V is the safe operating window for both part families. If your application requires operation below 4.75V or above 5.25V, verify that the SN74CBT16233 variants meet your specific voltage requirements before implementation.