FSFR2100XSL Equivalent & Substitute Parts

Part Overview

The FSFR2100XSL is an offline switching half-bridge power management IC manufactured by onsemi, designed for isolated converter applications with topology support up to 300kHz switching frequency. This component integrates internal switches with comprehensive fault protection including current limiting, over-temperature, and over-voltage monitoring. The part is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and production continuity.

Substiute Parts

FSFR2100XSL

onsemiIn Stock: 1219FSFR2100XSL Datasheet

Current PartRFQ

FSFR2100XS

onsemiIn Stock: 32784FSFR2100XS Datasheet

MFR RecommendedRFQ

FSFR1700XS

Fairchild SemiconductorIn Stock: 1584FSFR1700XS Datasheet

Parametric EquivalentRFQ

FSFR1700XSL

Fairchild SemiconductorIn Stock: 16531FSFR1700XSL Datasheet

Parametric EquivalentRFQ

FSFR1800XS

onsemiIn Stock: 6489FSFR1800XS Datasheet

Parametric EquivalentRFQ

FSFR1800XSL

Fairchild SemiconductorIn Stock: 2665FSFR1800XSL Datasheet

Parametric EquivalentRFQ

TSM900N06CP ROG

Taiwan Semiconductor CorporationIn Stock: 1921TSM900N06CP ROG Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the FSFR2100XSL is determined by the following critical parameters:

Primary Substitution Criteria:

• Topology: Half-Bridge
• Output Isolation: Isolated
• Voltage - Breakdown: 500V
• Voltage - Supply (Vcc/Vdd): 10V ~ 25V
• Voltage - Start Up: 12.5V
• Duty Cycle: 50%
• Frequency - Switching: Up to 300kHz
• Fault Protection: Current Limiting, Over Temperature, Over Voltage
• Control Features: Frequency Control
• Operating Temperature: -40°C ~ 130°C (TJ)
• Mounting Type: Through Hole
• Package / Case: 10-SIP Module, 9 Leads, Formed Leads (or compatible 9-SIP variant)

Power Rating Consideration: The FSFR2100XSL is rated at 400W. Substitute parts with lower power ratings (200W or 260W) are classified as parametric equivalents and may require thermal or application-level design review.

Substitute Categories:

1. MFR Recommended Equivalent: FSFR2100XS (onsemi) - Identical electrical specifications, packaging variant difference only (9-SIP without L forming)

2. Parametric Equivalents: FSFR1700XS, FSFR1700XSL, FSFR1800XS, FSFR1800XSL (Fairchild Semiconductor / onsemi) - Meet all topology and electrical criteria with reduced power ratings (200W or 260W)

3. Similar Category Part: TSM900N06CP ROG (Taiwan Semiconductor Corporation) - Discrete N-Channel MOSFET; different category and application context; not a direct functional substitute

Parameter Comparison

Engineering Selection Recommendations

Primary Selection - FSFR2100XS (onsemi): This part is the manufacturer-recommended equivalent with identical electrical specifications and power rating (400W). The only difference is the packaging variant (9-SIP without L forming versus 9-SIP with L forming). Both are through-hole mounted with compatible pinouts. FSFR2100XS is classified as obsolete but maintains ROHS3 compliance. This is the preferred substitute when form-factor compatibility is achievable.

Secondary Selection - FSFR1800XSL (Fairchild Semiconductor): This part is active and meets all critical electrical parameters including topology, isolation, voltage ratings, switching frequency, fault protection, and operating temperature range. The package is identical (10-SIP Module, 9 Leads, Formed Leads). The power rating is reduced to 260W, which is 65% of the original specification. This part is suitable for applications where the 400W rating is not fully utilized or where thermal design can accommodate the lower rating. Active product status provides better long-term availability.

Tertiary Selection - FSFR1700XSL (Fairchild Semiconductor): This part is active with identical package configuration and meets all critical electrical parameters. The power rating is further reduced to 200W (50% of original). This part is suitable only for applications with significantly lower power requirements or where thermal management can support the reduced rating. Active product status ensures availability.

Not Recommended - TSM900N06CP ROG (Taiwan Semiconductor Corporation): This is a discrete N-Channel MOSFET in a different product category (Transistors, FETs, MOSFETs) with surface-mount packaging (TO-252). It is not a functional equivalent to the integrated half-bridge controller and cannot serve as a direct substitute.

Frequently Asked Questions (FAQ)

Q: Can FSFR2100XS be used as a direct replacement for FSFR2100XSL?

A: Yes. Both parts are manufactured by onsemi with identical electrical specifications and power rating (400W). The difference is packaging: FSFR2100XS uses 9-SIP without L forming, while FSFR2100XSL uses 9-SIP with L forming. If your PCB layout accommodates the non-formed lead variant, this is a direct substitute.

Q: What does "L forming" mean in the package designation?

A: L forming refers to the lead configuration. Formed leads are pre-bent to a specific shape for through-hole insertion, while non-formed leads are straight. Both mount through-hole; the difference affects PCB hole spacing and insertion angle. Verify your PCB design accommodates the specific lead configuration.

Q: Can I use FSFR1800XSL or FSFR1700XSL if my application requires 400W?

A: No. FSFR1800XSL is rated at 260W and FSFR1700XSL at 200W. Using these parts in a 400W application exceeds their power dissipation limits and will cause thermal failure. These parts are suitable only for applications with lower power requirements.

Q: Why is FSFR1800XSL recommended over FSFR1700XSL?

A: FSFR1800XSL has a higher power rating (260W versus 200W) and is therefore suitable for a broader range of applications. Both are active products from Fairchild Semiconductor. Select FSFR1800XSL unless your application power requirement is definitively below 200W.

Q: Are all substitute parts ROHS3 compliant?

A: FSFR2100XSL and FSFR2100XS are explicitly ROHS3 compliant. FSFR1800XSL, FSFR1700XSL, and FSFR1700XS do not have RoHS status specified in the provided data. Verify compliance requirements with your supply chain or manufacturer if ROHS3 certification is mandatory.

Q: What is the difference between FSFR1700XS and FSFR1700XSL?

A: Both are manufactured by Fairchild Semiconductor with identical electrical specifications and 200W power rating. The difference is packaging: FSFR1700XS uses 10-SSIP Module while FSFR1700XSL uses 10-SIP Module with formed leads. Verify your PCB design compatibility with the specific package variant.

Q: Why is TSM900N06CP ROG listed as a similar part?

A: TSM900N06CP ROG is a discrete N-Channel MOSFET, not an integrated half-bridge controller. It is categorized as similar only because it contains switching elements. It cannot replace the FSFR2100XSL, which integrates control logic, gate drivers, and protection circuits. This part is not suitable for direct substitution.

Q: What should I consider when switching from an obsolete part to an active part?

A: When transitioning from obsolete parts (FSFR2100XSL, FSFR2100XS, FSFR1800XS) to active parts (FSFR1800XSL, FSFR1700XSL), verify: (1) electrical parameter compatibility, (2) package and pinout alignment, (3) power rating adequacy for your application, (4) compliance certifications (RoHS, REACH), and (5) long-term availability from your supplier. Active parts provide better supply continuity.