FSFR2100 Equivalent & Substitute Parts

Part Overview

The FSFR2100 is an offline switching half-bridge converter IC manufactured by onsemi, designed for isolated power management applications with topology support up to 300kHz switching frequency and 450W power handling. The device features integrated switches, comprehensive fault protection including current limiting, overload, over-temperature, and over-voltage detection, with a supply voltage range of 11.3V to 25V.

The FSFR2100 is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this component.

Substiute Parts

FSFR2100

onsemiIn Stock: 18461FSFR2100 Datasheet

Current PartRFQ

NCP13992ACDR2G

onsemiIn Stock: 20297NCP13992ACDR2G Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the FSFR2100 is based on the following critical parameters that define functional equivalence:

• Topology: Half-bridge converter architecture
• Output Isolation: Isolated configuration
• Voltage - Supply Range: Operating voltage compatibility
• Duty Cycle: 50% operation
• Fault Protection: Presence of comprehensive protection mechanisms
• RoHS Compliance: ROHS3 compliance for regulatory alignment

The NCP13992ACDR2G qualifies as a substitute based on matching topology (half-bridge), isolated output configuration, 50% duty cycle operation, and equivalent fault protection features. Both devices maintain ROHS3 compliance and are manufactured by onsemi, ensuring design continuity and supply chain compatibility.

Parameter Comparison

Engineering Selection Recommendations

The NCP13992ACDR2G is an active product from onsemi and represents the primary substitute for the obsolete FSFR2100. Both devices maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment for new designs and production continuity.

Key considerations for selection:

• Supply Voltage Compatibility: The FSFR2100 operates at 11.3V ~ 25V, while the NCP13992ACDR2G operates at 7.5V ~ 10V. Circuit design must accommodate this voltage range difference.
• Switching Frequency Range: The NCP13992ACDR2G supports 20kHz ~ 750kHz, providing broader frequency flexibility compared to the FSFR2100's up to 300kHz capability.
• Package and Mounting: The FSFR2100 uses through-hole 10-SIP packaging, while the NCP13992ACDR2G uses surface-mount 16-SOIC packaging. PCB redesign is required for mounting compatibility.
• Operating Temperature: The NCP13992ACDR2G supports -50°C ~ 150°C, extending the lower and upper temperature limits beyond the FSFR2100's -40°C ~ 130°C range.

Frequently Asked Questions (FAQ)

Q: Can the NCP13992ACDR2G directly replace the FSFR2100 without circuit modifications?

A: Direct pin-for-pin replacement is not possible due to different package types (10-SIP through-hole versus 16-SOIC surface-mount) and different lead counts (9 leads versus 14 leads). PCB redesign is required. Additionally, the supply voltage range differs significantly (11.3V ~ 25V versus 7.5V ~ 10V), requiring circuit evaluation.

Q: What are the critical parameters that define substitution eligibility?

A: Substitution is based on matching topology (half-bridge), output isolation (isolated), duty cycle (50%), fault protection presence, and regulatory compliance (ROHS3). Both the FSFR2100 and NCP13992ACDR2G meet these criteria.

Q: Are there any compliance or certification differences between these parts?

A: Both devices are ROHS3 compliant and REACH unaffected. No compliance differences exist between the two components.

Q: What is the impact of the different switching frequency ranges?

A: The FSFR2100 supports up to 300kHz, while the NCP13992ACDR2G supports 20kHz ~ 750kHz. The substitute provides a wider frequency range, allowing greater design flexibility for frequency selection within the application's requirements.

Q: How does the package change affect implementation?

A: The FSFR2100 uses through-hole 10-SIP packaging suitable for through-hole assembly, while the NCP13992ACDR2G uses surface-mount 16-SOIC packaging. This requires PCB layout redesign, different assembly processes, and updated soldering procedures.