FSFR1600XSL Equivalent & Substitute Parts

Part Overview

The FSFR1600XSL is an offline switching half-bridge power management IC manufactured by onsemi, designed for isolated converter applications with up to 300kHz switching frequency and 160W power handling capability. The device features integrated gate drivers, current limiting, over-temperature, and over-voltage protection. Due to its obsolete product status, equivalent and substitute parts from the FSFR-XS series are available to maintain design continuity and support ongoing production requirements.

Substiute Parts

FSFR1600XSL

onsemiIn Stock: 1640FSFR1600XSL Datasheet

Current PartRFQ

FSFR1700XS

Fairchild SemiconductorIn Stock: 1584FSFR1700XS Datasheet

Parametric EquivalentRFQ

FSFR1700XSL

Fairchild SemiconductorIn Stock: 16531FSFR1700XSL Datasheet

Parametric EquivalentRFQ

FSFR1800XS

onsemiIn Stock: 6489FSFR1800XS Datasheet

Parametric EquivalentRFQ

FSFR1800XSL

Fairchild SemiconductorIn Stock: 2665FSFR1800XSL Datasheet

Parametric EquivalentRFQ

FSFR2100XS

onsemiIn Stock: 32784FSFR2100XS Datasheet

Parametric EquivalentRFQ

FSFR2100XSL

onsemiIn Stock: 1219FSFR2100XSL Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution within the FSFR-XS series is determined by the following critical parameters that must remain constant or compatible:

Fixed Parameters (Must Match):

• Topology: Half-Bridge
• Output Isolation: Isolated
• Voltage - Breakdown: 500V
• Voltage - Supply (Vcc/Vdd): 10V ~ 25V
• Voltage - Start Up: 12.5V
• Frequency - Switching: Up to 300kHz
• Duty Cycle: 50%
• Fault Protection: Current Limiting, Over Temperature, Over Voltage
• Control Features: Frequency Control
• Operating Temperature: -40°C ~ 130°C (TJ)
• Mounting Type: Through Hole
• Package Form Factor: 9-SIP with formed leads

Variable Parameters (Allowable Differences):

• Power (Watts): 160W, 200W, 260W, or 400W
• Manufacturer: onsemi or Fairchild Semiconductor
• Product Status: Active or Obsolete
• Supplier Device Package designation: 9-SIP or 9-SIP (L forming)

All substitute parts maintain identical electrical specifications for voltage, frequency, protection features, and operating conditions. Power rating differences reflect design margin variations within the same topology and package family.

Parameter Comparison

Engineering Selection Recommendations

For Direct Replacement (Preferred): FSFR1700XSL is the primary substitute for FSFR1600XSL. Both devices feature identical 10-SIP module packaging with formed leads (L forming designation), matching mechanical and electrical interfaces. FSFR1700XSL carries Active product status with higher inventory availability (16488 units), ensuring long-term supply continuity. The 200W power rating provides adequate margin above the original 160W specification while maintaining all electrical parameters.

For Higher Power Margin Applications: FSFR1800XS or FSFR2100XS accommodate designs requiring increased power headroom. Both maintain identical topology, voltage ratings, and switching frequency specifications. FSFR2100XS provides maximum power capacity (400W) with substantial inventory (32749 units) despite Obsolete status.

Compliance Considerations: All substitute parts maintain ROHS3 compliance and REACH Unaffected status consistent with the original FSFR1600XSL. Moisture sensitivity levels vary; verify MSL requirements for your specific assembly and storage conditions.

Manufacturer Transition: Fairchild Semiconductor parts (FSFR1700XS, FSFR1700XSL, FSFR1800XSL) offer Active product status, supporting long-term availability. onsemi parts maintain the original manufacturer relationship but carry Obsolete designations.

Frequently Asked Questions (FAQ)

Q: Can FSFR1700XSL directly replace FSFR1600XSL without PCB modifications? A: Yes. Both parts use identical 10-SIP module packaging with formed leads and share all critical electrical parameters (500V breakdown, 10-25V supply, 300kHz switching, 50% duty cycle, -40 to 130°C operating range). Pin-to-pin compatibility is maintained.

Q: What is the difference between FSFR1700XS and FSFR1700XSL? A: The primary difference is the package designation. FSFR1700XSL features formed leads (L forming), while FSFR1700XS uses standard leads. Both are 9-SIP modules with identical electrical specifications. Verify your PCB design accommodates the specific lead configuration.

Q: Why do power ratings vary across the FSFR-XS series? A: Power rating differences (160W, 200W, 260W, 400W) reflect design margin variations within the same half-bridge topology and package family. All parts maintain identical voltage, frequency, and protection specifications. Higher-rated parts provide additional thermal headroom for demanding applications.

Q: Are there supply chain advantages to selecting FSFR1700XSL over other substitutes? A: FSFR1700XSL demonstrates the highest inventory availability (16488 units) and Active product status, providing superior long-term supply assurance compared to Obsolete alternatives.

Q: Do all substitute parts require identical PCB layout and thermal management? A: All parts share the same package form factor and electrical interface. Thermal management requirements may vary based on power dissipation differences. Consult thermal analysis for applications approaching maximum power ratings.

Q: What compliance certifications apply to substitute parts? A: All listed substitutes maintain ROHS3 compliance and REACH Unaffected status. Moisture sensitivity levels vary by manufacturer; verify MSL compatibility with your assembly process specifications.