FSBB20CH60F Equivalent & Substitute Parts

Part Overview

The FSBB20CH60F is a Power Driver Module IGBT manufactured by onsemi, designed for 3-phase applications with 600V voltage rating and 20A current capacity. This module features a 27-PowerDIP package configuration with 2500Vrms isolation capability. The product is currently classified as Obsolete, necessitating identification of equivalent substitute components for ongoing system support and new design considerations.

Substiute Parts

FSBB20CH60F

onsemiIn Stock: 2308FSBB20CH60F Datasheet

Current PartRFQ

FNC42060F2

onsemiIn Stock: 1984FNC42060F2 Datasheet

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FSBB20CH60C

onsemiIn Stock: 30579FSBB20CH60C Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the FSBB20CH60F are identified based on the following critical electrical and mechanical parameters:

• Current Rating: 20 A (exact match required)
• Voltage Rating: 600 V (exact match required)
• Configuration: 3 Phase (exact match required)
• Type: IGBT Power Driver Module (exact match required)
• Mounting Type: Through Hole (exact match required)

Two substitute parts meet these core criteria: FSBB20CH60C and FNC42060F2. Both maintain identical electrical specifications (20A, 600V, 3-phase IGBT configuration) and through-hole mounting. Variations exist in package dimensions, isolation voltage, series designation, and product status, which are documented in the parameter comparison table below.

Parameter Comparison

Engineering Selection Recommendations

FSBB20CH60C is the primary substitute for FSBB20CH60F. Both parts share identical package dimensions (27-PowerDIP, 1.205" / 30.60mm), isolation voltage (2500Vrms), and series designation (Motion SPM® 3). The FSBB20CH60C maintains full electrical and mechanical compatibility while offering ROHS3 compliance. This part is classified as "Not For New Designs" but remains available in production quantities (30,490 pcs in stock).

FNC42060F2 is an alternative substitute with identical electrical specifications (20A, 600V, 3-phase IGBT) but differs in package dimensions and isolation voltage. The FNC42060F2 uses a 26-PowerDIP package (1.024" / 26.00mm) with 2000Vrms isolation and belongs to the Motion SPM® 45 series. This part is also ROHS3 compliant and classified as "Not For New Designs" (1,900 pcs in stock). Package dimension differences require PCB layout verification before implementation.

Both substitutes maintain REACH compliance and EAR99 export classification consistent with the original part.

Frequently Asked Questions (FAQ)

Q: Can FSBB20CH60C directly replace FSBB20CH60F without PCB modifications?

A: Yes. The FSBB20CH60C shares identical package dimensions (27-PowerDIP, 1.205" / 30.60mm), pin configuration, and electrical specifications. No PCB layout changes are required for direct substitution.

Q: What are the key differences between FSBB20CH60C and FNC42060F2?

A: Both parts maintain 20A, 600V, 3-phase IGBT specifications. Primary differences are: FSBB20CH60C uses 27-PowerDIP packaging (1.205") with 2500Vrms isolation; FNC42060F2 uses 26-PowerDIP packaging (1.024") with 2000Vrms isolation. Package dimension differences require PCB footprint verification.

Q: Why is isolation voltage different between substitutes?

A: Isolation voltage is a specified parameter that varies by part design. FSBB20CH60F and FSBB20CH60C both provide 2500Vrms isolation. FNC42060F2 provides 2000Vrms isolation. System isolation requirements must be evaluated against application specifications.

Q: Are both substitutes RoHS compliant?

A: Yes. Both FSBB20CH60C and FNC42060F2 are ROHS3 compliant. The original FSBB20CH60F does not specify RoHS status.

Q: What is the significance of "Not For New Designs" status?

A: This classification indicates the parts are available for existing system support and maintenance but are not recommended for new product development. Both substitutes carry this designation.

Q: Do package dimension differences affect thermal performance?

A: Package dimensions are provided as specified parameters. Thermal performance evaluation requires application-specific analysis and is outside the scope of this substitution reference.