FSAM30SM60SL Equivalent & Substitute Parts

Part Overview

The FSAM30SM60SL is a Power Driver Module featuring an IGBT 3-phase configuration rated for 600V and 30A operation. Manufactured by onsemi under the SPM® series, this component is packaged in a 32-PowerDIP Module format with through-hole mounting. The product status is listed as Obsolete, making identification of functionally equivalent alternatives necessary for ongoing system maintenance and new design implementations where this topology remains applicable.

Substiute Parts

FSAM30SM60SL

onsemiIn Stock: 36699FSAM30SM60SL Datasheet

Current PartRFQ

FNB43060T2

onsemiIn Stock: 30964FNB43060T2 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the FSAM30SM60SL is determined by the following critical parameters:

• Type: IGBT power driver module
• Configuration: 3-phase topology
• Current Rating: 30 A
• Voltage Rating: 600 V
• Mounting Type: Through-hole compatibility
• Isolation Voltage: Minimum 2000Vrms

The FNB43060T2 qualifies as a functional substitute based on matching the core electrical specifications (30A, 600V, 3-phase IGBT configuration) and through-hole mounting requirement. While package dimensions differ (26-PowerDIP vs. 32-PowerDIP), both maintain through-hole mounting compatibility. The FNB43060T2 represents an active product from the Motion SPM® 45 series, providing design continuity with current manufacturing support.

Parameter Comparison

Engineering Selection Recommendations

The FNB43060T2 is the identified substitute for the obsolete FSAM30SM60SL. Selection between these parts is determined by the following factors:

For FSAM30SM60SL: Use only when existing inventory is available or legacy system maintenance requires exact form-factor compatibility with the 32-PowerDIP package. Product status is Obsolete with no active manufacturing support.

For FNB43060T2: Recommended for new designs and ongoing production. This part maintains Active product status with current manufacturing availability. It satisfies the core electrical requirements (30A, 600V, 3-phase IGBT) and through-hole mounting specification. The reduced package footprint (26-PowerDIP vs. 32-PowerDIP) may require PCB layout adjustment. Isolation voltage is rated at 2000Vrms, which is lower than the original 2500Vrms specification; system isolation requirements must be evaluated accordingly.

Both parts carry REACH Unaffected status and are manufactured by onsemi, ensuring regulatory compliance consistency.

Frequently Asked Questions (FAQ)

Q: Can FNB43060T2 directly replace FSAM30SM60SL in existing PCB layouts?

A: Direct PCB replacement is not possible due to package differences. FSAM30SM60SL uses a 32-PowerDIP Module (1.370", 34.80mm) while FNB43060T2 uses a 26-PowerDIP Module (1.024", 26.00mm). PCB footprint modification is required. Both maintain through-hole mounting, allowing for mechanical adaptation.

Q: Are the electrical specifications compatible?

A: Core electrical specifications match: both are 3-phase IGBT modules rated for 30A at 600V. The isolation voltage differs: FSAM30SM60SL is rated 2500Vrms while FNB43060T2 is rated 2000Vrms. System isolation requirements must be evaluated to confirm FNB43060T2 suitability.

Q: What is the product status difference?

A: FSAM30SM60SL is Obsolete with no active manufacturing. FNB43060T2 is Active with current production support. For new designs, FNB43060T2 ensures long-term component availability.

Q: Are there packaging or handling differences?

A: FNB43060T2 is supplied in Tube packaging. FSAM30SM60SL packaging specification was not provided. Both parts carry MSL ratings suitable for standard handling: FSAM30SM60SL is MSL 1 (Unlimited), while FNB43060T2 is Not Applicable.

Q: Do both parts meet regulatory requirements?

A: Both parts carry REACH Unaffected status and EAR99 ECCN classification, ensuring equivalent regulatory compliance for export and use.