FS2D-TP Equivalent & Substitute Parts

Part Overview

The FS2D-TP is a general-purpose rectifier diode manufactured by Micro Commercial Co, rated for 200 V DC reverse voltage and 2 A average rectified current in a surface mount DO-214AC (HSMA) package. This component is classified as obsolete, making identification of equivalent and substitute parts necessary for ongoing design support and procurement continuity. The FS2D-TP operates across a junction temperature range of -50°C to 150°C and features fast recovery characteristics with a reverse recovery time of 150 ns, suitable for applications requiring rapid switching performance.

Substiute Parts

FS2D-TP
Micro Commercial CoIn Stock: 1000FS2D-TP Datasheet
FS2D-TP
Current Part
SA2D-M3/61T
Vishay General Semiconductor - Diodes DivisionIn Stock: 774SA2D-M3/61T Datasheet
SA2D-M3/61T
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Key Parameters

Parameter Value Unit
Voltage - DC Reverse (Vr) (Max) 200 V
Current - Average Rectified (Io) 2 A
Speed Classification Fast Recovery ≤ 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 150 ns
Current - Reverse Leakage @ Vr 5 µA @ 200 V
Capacitance @ Vr, F 50 pF @ 4V, 1MHz
Mounting Type Surface Mount
Package / Case DO-214AC, SMA
Operating Temperature - Junction -50 to 150 °C
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the FS2D-TP is determined by strict equivalence across the following critical electrical and mechanical parameters:

Mandatory Matching Parameters:

  • Voltage - DC Reverse (Vr) (Max): 200 V
  • Current - Average Rectified (Io): 2 A
  • Package / Case: DO-214AC, SMA (surface mount)
  • Mounting Type: Surface Mount
  • RoHS Status: ROHS3 Compliant
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)

Allowable Variation Parameters:

  • Reverse Recovery Time (trr): May differ from 150 ns specification
  • Speed Classification: May vary between Fast Recovery and Standard Recovery
  • Current - Reverse Leakage @ Vr: May differ from 5 µA specification
  • Capacitance @ Vr, F: May differ from 50 pF specification
  • Operating Temperature - Junction: May extend beyond -50°C to 150°C range
  • Forward Voltage (Vf): Permitted to vary if not specified in main part

The SA2D-M3/61T qualifies as a substitute part based on matching voltage, current, package, and compliance requirements, despite differences in recovery speed classification and specific electrical characteristics.

Parameter Comparison

Parameter FS2D-TP (Main Part) SA2D-M3/61T (Substitute) Match Status
Manufacturer Micro Commercial Co Vishay General Semiconductor - Diodes Division Different
Voltage - DC Reverse (Vr) (Max) 200 V 200 V Equivalent
Current - Average Rectified (Io) 2 A 2 A Equivalent
Speed Classification Fast Recovery ≤ 500ns, > 200mA (Io) Standard Recovery >500ns, > 200mA (Io) Different
Reverse Recovery Time (trr) 150 ns 1.5 µs Different
Current - Reverse Leakage @ Vr 5 µA @ 200 V 3 µA @ 200 V Different
Capacitance @ Vr, F 50 pF @ 4V, 1MHz 11 pF @ 4V, 1MHz Different
Mounting Type Surface Mount Surface Mount Equivalent
Package / Case DO-214AC, SMA DO-214AC, SMA Equivalent
Operating Temperature - Junction -50°C to 150°C -55°C to 150°C Compatible
Product Status Obsolete Active Different
RoHS Status ROHS3 Compliant ROHS3 Compliant Equivalent
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) Equivalent
Packaging Bulk Tape & Reel (TR) Different

Engineering Selection Recommendations

The SA2D-M3/61T serves as a functional substitute for the obsolete FS2D-TP based on electrical rating equivalence and mechanical compatibility. Both components maintain identical voltage and current specifications (200 V, 2 A) and share the same DO-214AC surface mount package footprint, ensuring direct PCB compatibility without layout modifications.

The SA2D-M3/61T holds active product status from Vishay General Semiconductor - Diodes Division, providing long-term availability and supply chain stability compared to the obsolete FS2D-TP. Both parts maintain ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity ratings, satisfying regulatory and environmental requirements.

Differences in reverse recovery time (150 ns versus 1.5 µs) and speed classification reflect the transition from fast recovery to standard recovery technology. The SA2D-M3/61T exhibits lower reverse leakage current (3 µA versus 5 µA) and reduced junction capacitance (11 pF versus 50 pF), characteristics that may improve performance in specific circuit topologies. The extended operating temperature range of the SA2D-M3/61T (-55°C to 150°C versus -50°C to 150°C) provides additional thermal margin.

Packaging format differs between the main part (bulk) and substitute (Tape & Reel), requiring adjustment to procurement and assembly processes.

Frequently Asked Questions (FAQ)

Q: Can the SA2D-M3/61T replace the FS2D-TP in existing designs without circuit modification?

A: Yes. Both components share identical voltage (200 V) and current (2 A) ratings and occupy the same DO-214AC surface mount package footprint. PCB layout and component placement require no changes. Circuit performance may differ due to variations in reverse recovery time and capacitance, but functional substitution is supported by electrical rating equivalence.

Q: What is the significance of the difference in reverse recovery time between the FS2D-TP (150 ns) and SA2D-M3/61T (1.5 µs)?

A: The FS2D-TP employs fast recovery technology with a reverse recovery time of 150 ns, suitable for high-frequency switching applications. The SA2D-M3/61T uses standard recovery technology with a reverse recovery time of 1.5 µs, resulting in slower switching transitions. Applications operating at frequencies below 100 kHz typically tolerate this difference without performance degradation. High-frequency circuits (above 500 kHz) may experience increased switching losses with the SA2D-M3/61T.

Q: Are there compliance or regulatory differences between the FS2D-TP and SA2D-M3/61T?

A: Both components are ROHS3 compliant and carry MSL 1 (Unlimited) moisture sensitivity ratings. The SA2D-M3/61T includes REACH Unaffected status. No regulatory barriers exist to substitution.

Q: Why is the SA2D-M3/61T packaged in Tape & Reel format while the FS2D-TP is supplied in bulk?

A: Packaging format reflects manufacturing and distribution practices. Tape & Reel packaging (SA2D-M3/61T) is standard for active production components and supports automated assembly processes. Bulk packaging (FS2D-TP) was typical for legacy components. Procurement and assembly workflows must accommodate this difference.

Q: Does the lower reverse leakage current of the SA2D-M3/61T (3 µA versus 5 µA) provide any circuit advantage?

A: Lower reverse leakage current reduces standby power consumption and improves circuit performance in applications sensitive to leakage, such as precision rectification or low-power switching supplies. The difference of 2 µA is negligible in most general-purpose applications but beneficial in power-sensitive designs.

Q: What is the impact of the reduced junction capacitance in the SA2D-M3/61T (11 pF versus 50 pF)?

A: Lower junction capacitance reduces switching transients and improves high-frequency performance. This characteristic benefits circuits operating above 100 kHz by reducing capacitive coupling effects and improving switching speed. General-purpose low-frequency applications experience no practical difference.

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