FQP9N25C Equivalent & Substitute Parts

Part Overview

The FQP9N25C is an N-Channel MOSFET manufactured by onsemi, rated for 250V drain-to-source voltage with 8.8A continuous drain current at 25°C. This device is packaged in a Through Hole TO-220-3 configuration and is designed for general-purpose switching and amplification applications requiring moderate voltage and current ratings.

The FQP9N25C is classified as an Obsolete product. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this component.

Substiute Parts

FQP9N25C
onsemiIn Stock: 20473FQP9N25C Datasheet
FQP9N25C
Current Part
RCX100N25
Rohm SemiconductorIn Stock: 1623RCX100N25 Datasheet
RCX100N25
Direct

Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 250 V
Current - Continuous Drain (Id) @ 25°C 8.8 A
Drive Voltage (Max Rds On) 10 V
Rds On (Max) @ Id, Vgs 430 mOhm
Power Dissipation (Max) 74 W
Operating Temperature Range -55 to 150 °C
Package Type TO-220-3 Through Hole
FET Type N-Channel
Technology MOSFET (Metal Oxide)

Substitute Part Grouping Explanation

Substitution of the FQP9N25C is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

  • Drain to Source Voltage (Vdss) must equal or exceed 250V
  • Continuous Drain Current (Id) must equal or exceed 8.8A at 25°C
  • Drive Voltage (Max Rds On) must be 10V or lower
  • FET Type must be N-Channel
  • Technology must be MOSFET (Metal Oxide)
  • Vgs (Max) must be ±30V or greater

Mechanical Compatibility Criteria:

  • Mounting Type must be Through Hole
  • Package must be compatible with TO-220-3 footprint
  • Moisture Sensitivity Level must be 1 (Unlimited) or equivalent

Regulatory Compliance:

  • REACH Status must be REACH Unaffected
  • ECCN classification must be EAR99

The RCX100N25 from Rohm Semiconductor meets all substitution criteria and is classified as an Active product, providing improved supply availability compared to the obsolete FQP9N25C.

Parameter Comparison

Parameter FQP9N25C (onsemi) RCX100N25 (Rohm Semiconductor) Compatibility
Drain to Source Voltage (Vdss) 250 V 250 V Match
Current - Continuous Drain (Id) @ 25°C 8.8 A (Tc) 10 A (Ta) Substitute Exceeds
Drive Voltage (Max Rds On) 10 V 10 V Match
Vgs (Max) ±30 V ±30 V Match
FET Type N-Channel N-Channel Match
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide) Match
Mounting Type Through Hole Through Hole Match
Package / Case TO-220-3 TO-220-3 Full Pack Compatible
Operating Temperature (TJ) -55 to 150 °C 150 °C Substitute Meets Minimum
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) Match
REACH Status REACH Unaffected REACH Unaffected Match
ECCN EAR99 EAR99 Match
Product Status Obsolete Active Substitute Active

Engineering Selection Recommendations

The RCX100N25 is a direct substitute for the FQP9N25C based on electrical and mechanical parameter alignment. The following factors support this substitution:

Electrical Performance: The RCX100N25 meets or exceeds all critical electrical specifications. The continuous drain current rating of 10A exceeds the FQP9N25C requirement of 8.8A, providing additional design margin. Voltage ratings, gate drive requirements, and maximum gate voltage specifications are identical.

Mechanical Compatibility: Both devices utilize Through Hole mounting in TO-220-3 package configurations. The RCX100N25 is specified as TO-220FM (Full Pack), which maintains footprint compatibility with the original TO-220-3 design.

Product Status and Supply: The RCX100N25 is classified as Active, ensuring ongoing availability and supply chain support. The FQP9N25C is Obsolete, making the RCX100N25 the appropriate choice for new designs and production continuity.

Regulatory Compliance: Both parts maintain identical REACH and ECCN classifications (REACH Unaffected, EAR99), ensuring no regulatory complications in substitution. Both devices carry MSL 1 (Unlimited) moisture sensitivity ratings.

RoHS Compliance: The RCX100N25 is explicitly RoHS3 Compliant, providing additional environmental compliance assurance for applications requiring RoHS certification.

Frequently Asked Questions (FAQ)

Q: Can the RCX100N25 be used as a direct replacement for the FQP9N25C in existing designs?

A: Yes. The RCX100N25 meets all electrical and mechanical substitution criteria. Both devices are N-Channel MOSFETs with identical 250V Vdss ratings, 10V drive voltage specifications, and TO-220-3 Through Hole packaging. The RCX100N25 provides equal or superior performance across all specified parameters.

Q: What is the difference between the TO-220-3 and TO-220FM packages?

A: TO-220FM designates a Full Pack variant of the TO-220-3 package. Both maintain identical pin configurations and footprint compatibility for Through Hole mounting applications. The designation reflects packaging format rather than electrical or mechanical incompatibility.

Q: Are there any thermal performance differences between these devices?

A: The FQP9N25C specifies 74W maximum power dissipation at Tc (case temperature). The RCX100N25 specifies 40W maximum power dissipation at Tc. In applications operating near maximum power dissipation limits, thermal management and heatsinking requirements should be evaluated based on actual circuit conditions.

Q: Does the higher current rating of the RCX100N25 (10A vs. 8.8A) affect circuit design?

A: No. The higher current rating of the RCX100N25 provides additional design margin and does not require circuit modifications. The device will operate safely within the original design specifications established for the FQP9N25C.

Q: Are regulatory certifications identical between these parts?

A: Yes. Both the FQP9N25C and RCX100N25 carry identical REACH Status (REACH Unaffected) and ECCN classifications (EAR99). The RCX100N25 additionally carries RoHS3 Compliance certification.

Q: What is the minimum operating temperature specification for the RCX100N25?

A: The RCX100N25 specifies a maximum operating temperature of 150°C (TJ). The minimum operating temperature is not explicitly provided in the available specifications. For applications requiring operation below 0°C, the FQP9N25C specification of -55°C minimum should be referenced for comparison.

Q: Is the RCX100N25 available in the same packaging format as the FQP9N25C?

A: Yes. Both devices are supplied in Through Hole TO-220-3 package configurations suitable for identical PCB layouts and assembly processes. The RCX100N25 is available in Bulk packaging format.

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