FQP9N15 Equivalent & Substitute Parts

Part Overview

The FQP9N15 is an N-Channel MOSFET manufactured by onsemi, rated for 150V drain-to-source voltage and 9A continuous drain current in a Through Hole TO-220-3 package. This device is classified as obsolete, making identification of equivalent and substitute parts necessary for ongoing design support and procurement continuity. The part operates across a temperature range of -55°C to 175°C and dissipates up to 75W, making it suitable for moderate-power switching applications requiring high voltage capability.

Substiute Parts

FQP9N15

onsemiIn Stock: 2455FQP9N15 Datasheet

Current PartRFQ

RCX100N25

Rohm SemiconductorIn Stock: 1623RCX100N25 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the FQP9N15 is determined by the following critical parameters:

Channel Type & Technology: Both the main part and substitute must be N-Channel MOSFETs to maintain circuit functionality and gate drive compatibility.

Voltage Rating (Vdss): The substitute must equal or exceed the 150V rating of the FQP9N15. A higher voltage rating provides design margin and does not compromise circuit operation.

Current Rating (Id): The substitute must equal or exceed the 9A continuous drain current specification to handle the same load conditions without thermal stress.

Package & Mounting: The substitute must use a Through Hole package compatible with TO-220-3 footprints to ensure mechanical and thermal interface compatibility.

Temperature Range: The substitute must support the operating temperature envelope of -55°C to 175°C or a subset thereof that covers the intended application range.

Compliance & Status: Active product status and REACH compliance ensure long-term availability and regulatory conformance.

The RCX100N25 meets these substitution criteria with a higher voltage rating (250V), equal or greater current capability (10A), compatible Through Hole packaging (TO-220FM), and active product status.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitution: The RCX100N25 is suitable as a direct substitute for the FQP9N15 in applications where the following conditions are met:

The RCX100N25 provides superior voltage headroom with a 250V Vdss rating compared to the 150V requirement, reducing stress on the semiconductor junction and improving reliability margins. The 10A current rating meets the 9A specification of the FQP9N15. Both devices operate at 10V gate drive voltage, ensuring compatibility with existing gate driver circuits.

Thermal Considerations: The RCX100N25 has a maximum power dissipation of 40W compared to the FQP9N15's 75W rating. Applications operating near the thermal limits of the FQP9N15 require thermal analysis to confirm the substitute can dissipate the expected power within the target operating temperature range.

Temperature Range Limitation: The RCX100N25 maximum junction temperature is 150°C, whereas the FQP9N15 extends to 175°C. Applications requiring operation above 150°C junction temperature cannot use this substitute.

Product Status & Availability: The RCX100N25 holds active product status with REACH compliance, ensuring long-term procurement availability and regulatory conformance. The FQP9N15 is obsolete, making the RCX100N25 the preferred choice for new designs and ongoing production support.

Packaging Compatibility: Both devices use Through Hole TO-220 packages with compatible footprints. The RCX100N25 TO-220FM designation indicates a full-pack variant, maintaining mechanical and thermal interface compatibility with existing PCB designs.

Frequently Asked Questions (FAQ)

Q: Can the RCX100N25 directly replace the FQP9N15 in existing circuit boards?

A: The RCX100N25 is mechanically and electrically compatible with the FQP9N15 in most applications. Both devices use Through Hole TO-220 packages with identical pin configurations and 10V gate drive voltage. Verify that the application's thermal design accommodates the RCX100N25's 40W maximum power dissipation and that operating temperatures do not exceed 150°C junction temperature.

Q: What are the key differences between these two parts?

A: The RCX100N25 has a higher drain-to-source voltage rating (250V vs. 150V), equal or greater current capability (10A vs. 9A), and active product status. The FQP9N15 has higher power dissipation capability (75W vs. 40W) and a wider operating temperature range (-55°C to 175°C vs. up to 150°C). The RCX100N25 is manufactured by Rohm Semiconductor, while the FQP9N15 is from onsemi.

Q: Is the RCX100N25 suitable for high-temperature applications above 150°C?

A: No. The RCX100N25 has a maximum junction temperature of 150°C. Applications requiring operation above this temperature must use an alternative device with a higher temperature rating.

Q: Will the higher voltage rating of the RCX100N25 affect circuit performance?

A: No. A higher voltage rating does not degrade performance in circuits designed for lower voltages. The 250V rating of the RCX100N25 provides additional design margin and improves reliability when used in 150V applications.

Q: Are there any gate drive circuit modifications required when switching from FQP9N15 to RCX100N25?

A: No modifications are required. Both devices operate at 10V gate drive voltage with compatible gate charge characteristics. Existing gate driver circuits designed for the FQP9N15 will function with the RCX100N25 without adjustment.

Q: What is the impact of the lower power dissipation rating on thermal design?

A: The RCX100N25's 40W maximum power dissipation is lower than the FQP9N15's 75W rating. Thermal analysis is required to confirm the substitute can dissipate the expected power in the target application. If the application generates power dissipation exceeding 40W, alternative devices with higher power ratings must be evaluated.

Q: Are both parts REACH compliant?

A: Yes. Both the FQP9N15 and RCX100N25 are REACH Unaffected, confirming compliance with European chemical regulations.