FQH70N10 Equivalent & Substitute Parts

Part Overview

The FQH70N10 is an N-Channel MOSFET manufactured by onsemi, rated for 100V drain-to-source voltage with 70A continuous drain current at 25°C. This device is packaged in a TO-247-3 through-hole configuration and is designed for high-power switching applications requiring robust thermal performance up to 214W at the case temperature.

The FQH70N10 carries an Obsolete product status. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications currently utilizing this component.

Substiute Parts

FQH70N10
onsemiIn Stock: 808FQH70N10 Datasheet
FQH70N10
Current Part
IXTQ75N10P
IXYSIn Stock: 6494IXTQ75N10P Datasheet
IXTQ75N10P
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Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 100 V
Continuous Drain Current (Id) @ 25°C 70 A
Drive Voltage (Max Rds On) 10 V
Rds On (Max) @ Id, Vgs 23 mOhm @ 35A, 10V mOhm
Gate Threshold Voltage (Vgs(th)) @ Id 4 V @ 250µA
Gate Charge (Qg) @ Vgs 110 nC @ 10V
Input Capacitance (Ciss) @ Vds 3300 pF @ 25V
Power Dissipation (Max) 214 W
Operating Temperature Range -55 to 175 °C
Package Type TO-247-3 Through Hole

Substitute Part Grouping Explanation

Substitution of the FQH70N10 is determined by strict alignment of the following electrical and mechanical parameters:

Critical Matching Parameters:

  • Drain to Source Voltage (Vdss): 100V minimum
  • Continuous Drain Current (Id): 70A or greater at 25°C
  • Drive Voltage: 10V gate drive compatibility
  • Gate Threshold Voltage (Vgs(th)): Within acceptable switching range
  • Operating Temperature Range: -55°C to 175°C minimum
  • Mounting Type: Through-hole configuration
  • Package compatibility: TO-247-3 or equivalent footprint

The IXTQ75N10P meets these substitution criteria through equivalent voltage rating, higher current capability (75A), compatible gate drive voltage, and matching operating temperature range. Both devices utilize N-Channel MOSFET technology with identical Vdss specification and through-hole mounting.

Parameter Comparison

Parameter FQH70N10 (Main) IXTQ75N10P (Substitute) Unit
Manufacturer onsemi IXYS
FET Type N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 100 100 V
Continuous Drain Current (Id) @ 25°C 70 75 A
Drive Voltage (Max Rds On) 10 10 V
Rds On (Max) @ Id, Vgs 23 mOhm @ 35A, 10V 25 mOhm @ 500mA, 10V mOhm
Gate Threshold Voltage (Vgs(th)) @ Id 4 5.5 V @ 250µA
Gate Charge (Qg) @ Vgs 110 74 nC @ 10V
Vgs (Max) ±25 ±20 V
Input Capacitance (Ciss) @ Vds 3300 2250 pF @ 25V
Power Dissipation (Max) 214 360 W
Operating Temperature Range -55 to 175 -55 to 175 °C
Mounting Type Through Hole Through Hole
Package / Case TO-247-3 TO-3P-3, SC-65-3
Product Status Obsolete Active
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99

Engineering Selection Recommendations

Product Status Consideration: The FQH70N10 is classified as Obsolete, making the IXTQ75N10P a necessary alternative for ongoing supply and production support. The IXTQ75N10P maintains Active product status with onsemi's IXYS division, ensuring long-term availability and continued manufacturer support.

Compliance and Regulatory Alignment: Both devices share identical REACH and ECCN classifications (REACH Unaffected, EAR99), ensuring equivalent regulatory compliance for export and environmental standards. The IXTQ75N10P carries RoHS3 compliance certification, providing additional environmental compliance assurance.

Electrical Performance: The IXTQ75N10P delivers equivalent voltage rating (100V Vdss) with enhanced current capability (75A versus 70A). The substitute provides superior power dissipation capacity (360W versus 214W), enabling thermal margin improvement in high-power applications. Gate charge reduction (74 nC versus 110 nC) results in faster switching characteristics and reduced driver power requirements.

Package and Thermal Considerations: The IXTQ75N10P utilizes TO-3P-3 and SC-65-3 package designations, which differ from the FQH70N10's TO-247-3 package. Physical footprint verification and PCB layout modification are required for mechanical integration. The enhanced power dissipation rating of the substitute provides superior thermal performance for demanding applications.

Frequently Asked Questions (FAQ)

Q: Can the IXTQ75N10P directly replace the FQH70N10 without circuit modification?

A: Electrical substitution is valid based on matching Vdss (100V), compatible gate drive voltage (10V), and identical operating temperature range (-55°C to 175°C). However, package differences between TO-247-3 and TO-3P-3 require PCB layout modification. Pin configuration and mounting hole spacing must be verified against application-specific requirements before implementation.

Q: What are the key electrical differences between these devices?

A: The IXTQ75N10P provides higher continuous drain current (75A versus 70A), lower gate charge (74 nC versus 110 nC), and significantly higher power dissipation capability (360W versus 214W). Gate threshold voltage differs slightly (5.5V versus 4V), and maximum gate voltage rating is reduced (±20V versus ±25V). These differences favor the substitute in high-current and high-frequency switching applications.

Q: Are there supply chain advantages to using the IXTQ75N10P?

A: Yes. The IXTQ75N10P maintains Active product status with substantially higher inventory availability (6440 pieces in stock versus 763 pieces for the obsolete FQH70N10). Active product status ensures continued manufacturer support, technical documentation updates, and long-term supply continuity.

Q: How do the on-resistance characteristics compare?

A: The FQH70N10 specifies 23 mOhm at 35A and 10V gate drive, while the IXTQ75N10P specifies 25 mOhm at 500mA and 10V gate drive. Direct comparison requires evaluation at identical current and voltage conditions. The substitute's lower gate charge and higher current rating provide improved efficiency in switching applications despite marginally higher on-resistance specification.

Q: What thermal considerations apply to package substitution?

A: The IXTQ75N10P's TO-3P-3 package provides enhanced thermal performance with 360W maximum power dissipation versus the FQH70N10's 214W rating. This represents a 68% increase in thermal capacity. PCB thermal design, heatsink interface, and mounting configuration must be evaluated to fully utilize the substitute's thermal advantages.

Q: Are gate drive circuits compatible between these devices?

A: Both devices operate with 10V gate drive voltage and share identical operating temperature ranges. However, the IXTQ75N10P's lower gate charge (74 nC versus 110 nC) reduces driver current requirements and enables faster switching transitions. Existing gate drive circuits designed for the FQH70N10 are electrically compatible with the IXTQ75N10P without modification.

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