FPF2701MPX Equivalent & Substitute Parts

Part Overview

The FPF2701MPX is an N-Channel power switch driver manufactured by onsemi, designed for general-purpose load switching applications. This integrated circuit provides 1:1 switching control with high-side N-Channel output configuration, delivering up to 2A continuous output current across a 2.8V to 36V load voltage range. The device includes integrated power management features including power good indication, slew rate control, and comprehensive fault protection with current limiting, over-temperature shutdown, and under-voltage lockout (UVLO).

The FPF2701MPX is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support ongoing production requirements for legacy systems utilizing this component.

Substiute Parts

FPF2701MPX

onsemiIn Stock: 4060FPF2701MPX Datasheet

Current PartRFQ

FPF2702MPX

onsemiIn Stock: 5274FPF2702MPX Datasheet

Parametric EquivalentRFQ

TSM900N10CH X0G

Taiwan Semiconductor CorporationIn Stock: 1006TSM900N10CH X0G Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the FPF2701MPX are identified based on strict electrical and mechanical parameter alignment within the power management and switching device categories. The substitution logic is organized into two categories:

Parametric Equivalent (Direct Replacement): Parts that maintain identical or functionally equivalent electrical specifications across all critical parameters including output current rating (2A), load voltage range (2.8V ~ 36V), on-resistance (88mOhm typical), output configuration (high-side N-Channel 1:1), and integrated protection features (current limiting, over-temperature, UVLO). These parts are suitable for direct substitution without circuit redesign.

Similar Functional Alternative: Parts that provide comparable switching and load control functionality but operate under different electrical specifications, package types, or mounting configurations. These alternatives require engineering evaluation to confirm compatibility with the specific application circuit and thermal requirements.

The key parameters determining substitution eligibility are:

• Output current capability (2A maximum)
• Load voltage operating range (2.8V ~ 36V)
• On-resistance characteristics (88mOhm typical)
• Output configuration (high-side N-Channel)
• Integrated fault protection features
• Operating temperature range (-40°C ~ 85°C minimum)
• Surface mount or through-hole package compatibility

Parameter Comparison

Engineering Selection Recommendations

FPF2702MPX (Parametric Equivalent - Recommended Primary Substitute)

The FPF2702MPX is the direct parametric equivalent to the FPF2701MPX. Both devices are manufactured by onsemi within the AccuPower™ series and maintain identical electrical specifications including 2A output current, 2.8V to 36V load voltage range, 88mOhm typical on-resistance, and comprehensive integrated protection features. The primary difference is packaging format: FPF2702MPX is supplied in Cut Tape (CT) configuration versus the standard packaging of FPF2701MPX. Both devices are classified as obsolete but remain ROHS3 compliant. This part is suitable for direct substitution without circuit modification.

TSM900N10CH X0G (Similar Functional Alternative - Requires Evaluation)

The TSM900N10CH X0G is a discrete N-Channel MOSFET manufactured by Taiwan Semiconductor Corporation with active product status. This device provides higher current capability (15A continuous drain current) and higher voltage rating (100V Vdss) compared to the FPF2701MPX integrated switch. The on-resistance specification (90mOhm @ 5A, 10V) is comparable to the FPF2701MPX. However, this is a discrete MOSFET without integrated power management features (power good indication, slew rate control, status flag, current limiting, UVLO). The TSM900N10CH X0G uses through-hole TO-251 packaging rather than surface mount. This alternative is suitable only for applications where the integrated protection features of the FPF2701MPX are not required, and where through-hole mounting is acceptable. Circuit redesign and additional discrete protection components may be necessary.

Frequently Asked Questions (FAQ)

Q: Can FPF2702MPX be used as a direct replacement for FPF2701MPX?

A: Yes. The FPF2702MPX is a parametric equivalent with identical electrical specifications. The only difference is the packaging format (Cut Tape versus standard packaging). No circuit modification is required.

Q: What are the key differences between FPF2701MPX and TSM900N10CH X0G?

A: The FPF2701MPX is an integrated power switch driver with built-in protection features (power good, current limiting, over-temperature, UVLO). The TSM900N10CH X0G is a discrete MOSFET without integrated protection. The TSM900 has higher current (15A vs 2A) and voltage (100V vs 36V) ratings but requires external protection circuitry. The FPF2701MPX uses surface-mount packaging; the TSM900 uses through-hole TO-251 packaging.

Q: Is TSM900N10CH X0G suitable for direct substitution?

A: No. While the TSM900N10CH X0G provides comparable on-resistance, it lacks the integrated protection features of the FPF2701MPX. Applications relying on power good indication, adjustable current limiting, or UVLO protection require circuit redesign or addition of discrete protection components.

Q: What is the impact of the FPF2701MPX being obsolete?

A: The obsolete status indicates the manufacturer has discontinued production. The FPF2702MPX, also obsolete, provides identical functionality. For new designs or long-term supply assurance, the TSM900N10CH X0G with active status may be considered, provided the application can accommodate the absence of integrated protection features and the through-hole package format.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. FPF2701MPX, FPF2702MPX, and TSM900N10CH X0G are all ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: What packaging considerations apply to these substitutes?

A: FPF2701MPX and FPF2702MPX both use 8-WDFN surface-mount packages with exposed pads. TSM900N10CH X0G uses through-hole TO-251 (IPAK) packaging. Surface-mount and through-hole packages are not interchangeable without PCB redesign.