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FPF2303MPX Equivalent & Substitute Parts
Part Overview
The FPF2303MPX is a Power Management Integrated Circuit (PMIC) manufactured by onsemi, functioning as a dual-output power switch with P-channel configuration. This component is classified as a General Purpose power switch/driver rated for 1.1A maximum output current per channel, designed for load voltage applications ranging from 1.8V to 5.5V. The device features integrated fault protection including current limiting, over-temperature protection, reverse current blocking, and under-voltage lockout (UVLO).
The FPF2303MPX carries an Obsolete product status. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support ongoing production requirements for applications utilizing this component.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | FPF2303MPX |
| Manufacturer | onsemi |
| Category | Power Management (PMIC) |
| Switch Type | General Purpose |
| Number of Outputs | 2 |
| Output Type | P-Channel |
| Output Configuration | High Side |
| Voltage - Load | 1.8V ~ 5.5V |
| Current - Output (Max) | 1.1A |
| Rds On (Typ) | 75mOhm |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-WDFN Exposed Pad |
| RoHS Status | ROHS3 Compliant |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitute parts for the FPF2303MPX are identified based on strict electrical and mechanical parameter matching. The following criteria determine substitution eligibility:
Critical Matching Parameters:
- Dual-output configuration (2 outputs)
- P-channel high-side switch topology
- Maximum output current rating of 1.1A per channel
- Load voltage range of 1.8V to 5.5V
- On-resistance (Rds On) of 75mOhm typical
- Non-inverting input interface with On/Off control
- Integrated fault protection: current limiting, over-temperature, reverse current, and UVLO
- Operating temperature range of -40°C to 85°C
- Surface mount packaging
- ROHS3 compliance and REACH unaffected status
The FPF2303MX qualifies as a direct substitute based on matching all critical electrical parameters and functional characteristics. Packaging differences exist between the main part (8-WDFN Exposed Pad) and the substitute (8-SOIC), requiring physical layout verification during implementation.
Parameter Comparison
| Parameter | FPF2303MPX (Main) | FPF2303MX (Substitute) |
|---|---|---|
| Manufacturer | onsemi | Fairchild Semiconductor |
| Product Status | Obsolete | Active |
| Number of Outputs | 2 | 2 |
| Output Type | P-Channel | P-Channel |
| Output Configuration | High Side | High Side |
| Voltage - Load | 1.8V ~ 5.5V | 6V |
| Current - Output (Max) | 1.1A | 1.1A |
| Rds On (Typ) | 75mOhm | 75mOhm |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 8-WDFN Exposed Pad | 8-SOIC (0.154", 3.90mm Width) |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Fault Protection | Current Limiting (Fixed), Over Temperature, Reverse Current, UVLO | Current Limiting (Fixed), Over Temperature, Reverse Current, UVLO |
Engineering Selection Recommendations
The FPF2303MX is an active product from Fairchild Semiconductor and represents the primary substitute for the obsolete FPF2303MPX. Both components maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment for new production.
The FPF2303MX offers supply chain continuity with active inventory availability. The electrical specifications—including output current rating, on-resistance, fault protection features, and operating temperature range—are identical to the main part, supporting direct functional replacement.
Package transition from 8-WDFN Exposed Pad to 8-SOIC requires printed circuit board layout modification. Pin-to-pin compatibility must be verified against the specific application schematic and thermal management requirements, as the SOIC package presents different thermal characteristics compared to the WDFN exposed pad variant.
Frequently Asked Questions (FAQ)
Q: Can the FPF2303MX directly replace the FPF2303MPX without circuit modification?
A: Electrical functionality is directly compatible. However, the package change from 8-WDFN Exposed Pad to 8-SOIC requires PCB layout redesign. Pin assignments must be verified against application schematics before implementation.
Q: What is the significance of the load voltage specification difference (1.8V ~ 5.5V vs. 6V)?
A: The FPF2303MPX specifies load voltage as 1.8V to 5.5V, while the FPF2303MX lists 6V. This represents a specification difference that requires application-level verification to confirm compatibility with your specific load voltage requirements.
Q: Are there thermal management differences between the WDFN and SOIC packages?
A: Yes. The 8-WDFN Exposed Pad package includes a thermal pad for enhanced heat dissipation, while the 8-SOIC package does not. Thermal analysis is required if the application operates at maximum current ratings or elevated ambient temperatures.
Q: Do both parts meet the same compliance standards?
A: Both the FPF2303MPX and FPF2303MX are ROHS3 compliant and REACH unaffected, meeting equivalent regulatory requirements for industrial and commercial applications.
Q: What is the inventory status for the substitute part?
A: The FPF2303MX maintains active product status with 1450 pieces of new original stock available, providing reliable supply chain access compared to the obsolete FPF2303MPX.
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