FPF2165 Equivalent & Substitute Parts

Part Overview

The FPF2165 is an active power switch IC designed for high-side load switching applications. This P-Channel power switch integrates a 1:1 configuration with 1.5A maximum output current, operating across 1.8V to 5.5V load voltage ranges. The device features integrated fault protection including current limiting, over-temperature shutdown, reverse current blocking, and under-voltage lockout (UVLO). The FPF2165 is classified as Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating. Substitute components are identified to support design flexibility, inventory optimization, and supply chain continuity while maintaining functional equivalence within specified electrical and mechanical parameters.

Substiute Parts

FPF2165

onsemiIn Stock: 20339FPF2165 Datasheet

Current PartRFQ

FQD13N06LTM

onsemiIn Stock: 16088FQD13N06LTM Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute components for the FPF2165 are identified based on functional equivalence within the power switching category. The primary substitution criterion is the ability to perform high-side load switching with compatible electrical characteristics. The FPF2165 operates as a P-Channel power switch with 1.5A output current capability and 120mOhm typical on-resistance. Substitute parts must satisfy the following key parameters:

• Output current rating of 1.5A or greater
• On-resistance (Rds On) at or below 120mOhm typical specification
• Surface mount packaging compatible with 6-WDFN form factor or equivalent
• Active product status with current manufacturing support
• RoHS3 compliance certification
• Operating temperature range encompassing -40°C to 85°C minimum

The FQD13N06LTM is identified as a manufacturer-recommended substitute. While this component operates as an N-Channel MOSFET rather than a P-Channel switch, it provides equivalent current-switching capability (11A continuous drain current) with superior on-resistance performance (115mOhm maximum at specified conditions). The substitute maintains surface mount technology, active product status, and full RoHS3 compliance.

Parameter Comparison

Engineering Selection Recommendations

Component selection between the FPF2165 and FQD13N06LTM must account for documented product status, compliance certifications, and application-specific requirements. Both components maintain Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating, ensuring long-term supply availability and regulatory compliance.

The FPF2165 is recommended for applications requiring integrated power switch functionality with built-in fault protection features (current limiting, over-temperature shutdown, reverse current blocking, UVLO). This integrated approach reduces external component count and simplifies circuit design for general-purpose high-side switching applications.

The FQD13N06LTM is recommended for applications requiring discrete MOSFET functionality with higher current capacity (11A continuous) and extended operating temperature range (-55°C to 150°C junction temperature). This component is suitable for designs where discrete FET control and higher thermal performance are required. Package form factor differences (6-WDFN versus TO-252-3 DPAK) must be evaluated against PCB layout constraints and thermal management requirements.

Both components are manufactured by onsemi, ensuring consistent quality standards and technical support. Selection should be based on specific circuit topology requirements, thermal dissipation needs, and available PCB real estate.

Frequently Asked Questions (FAQ)

Q: Can the FQD13N06LTM directly replace the FPF2165 in existing designs?

A: Direct replacement requires circuit topology evaluation. The FPF2165 integrates power switch control with fault protection, while the FQD13N06LTM is a discrete MOSFET requiring external gate drive and protection circuitry. Package form factors differ (6-WDFN versus TO-252-3 DPAK), necessitating PCB layout modifications.

Q: What are the key electrical differences between these components?

A: The FPF2165 operates as a P-Channel integrated power switch with 1.5A output current and 120mOhm typical on-resistance. The FQD13N06LTM is an N-Channel discrete MOSFET with 11A continuous drain current and 115mOhm maximum on-resistance. The FQD13N06LTM provides higher current capacity and lower maximum on-resistance specification.

Q: Are both components RoHS3 compliant?

A: Yes. Both the FPF2165 and FQD13N06LTM maintain full RoHS3 compliance with unlimited moisture sensitivity rating (MSL 1), ensuring regulatory compliance for current manufacturing standards.

Q: What packaging considerations apply to substitution?

A: The FPF2165 uses 6-WDFN Exposed Pad surface mount packaging. The FQD13N06LTM uses TO-252-3 DPAK surface mount packaging. These form factors require different PCB footprints and thermal management approaches. Verify PCB layout compatibility and thermal dissipation requirements before substitution.

Q: What is the operating temperature range for each component?

A: The FPF2165 operates from -40°C to 85°C (ambient temperature). The FQD13N06LTM operates from -55°C to 150°C (junction temperature), providing extended temperature range capability for demanding thermal environments.