FPF2025 Equivalent & Substitute Parts

Part Overview

The FPF2025 is a Power Management IC (PMIC) functioning as a power switch/driver with 1:1 P-Channel configuration. Manufactured by onsemi, this component operates as a high-side switch with 100mA maximum output current and 215mOhm typical on-resistance. The device is classified as obsolete, necessitating identification of active alternative components that maintain functional and electrical compatibility for new designs and production continuity.

Substiute Parts

FPF2025

onsemiIn Stock: 1482FPF2025 Datasheet

Current PartRFQ

TCK22891G,LF

Toshiba Semiconductor and StorageIn Stock: 30123TCK22891G,LF Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the FPF2025 is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

• Output configuration: High side switching
• Output type: P-Channel
• Voltage range: Load voltage must encompass or exceed 1.6V ~ 5.5V
• Current rating: Output current must meet or exceed 100mA requirement
• On-resistance: Lower Rds On values are acceptable and provide improved performance
• Interface: On/Off control capability
• Fault protection: Current limiting and over-temperature protection required

Mechanical Compatibility Criteria:

• Mounting type: Surface mount
• Package family: 6-pin WLCSP/UFBGA variants
• Moisture sensitivity: MSL 1 or equivalent

The TCK22891G,LF from Toshiba Semiconductor and Storage qualifies as a functional substitute based on these parameters.

Parameter Comparison

Engineering Selection Recommendations

The TCK22891G,LF is a qualified substitute for the FPF2025 based on the following factors:

Electrical Performance: The TCK22891G,LF exceeds the FPF2025 specifications in current handling (400mA vs. 100mA) and on-resistance (31mOhm vs. 215mOhm), providing superior performance margins. Load voltage range compatibility is maintained with a lower minimum threshold (1.4V vs. 1.6V).

Product Status: The TCK22891G,LF maintains active product status with Toshiba Semiconductor and Storage, ensuring ongoing availability and supply chain continuity. The FPF2025 is obsolete, making substitution necessary for new production.

Compliance & Certifications: Both components share identical regulatory classifications (ECCN: EAR99, HTSUS: 8542.39.0001, MSL: 1). The TCK22891G,LF is RoHS3 compliant, meeting modern environmental standards.

Package Compatibility: Both devices utilize 6-pin WLCSP packaging with surface mount configuration, enabling direct board-level substitution without layout modifications.

Frequently Asked Questions (FAQ)

Q: Can the TCK22891G,LF directly replace the FPF2025 in existing designs?

A: Yes. Both components share identical electrical interfaces (1:1 P-Channel high-side switch, On/Off control), operating temperature ranges (-40°C ~ 85°C), and 6-pin WLCSP package configuration. The TCK22891G,LF provides enhanced performance with higher current rating and lower on-resistance.

Q: What are the key differences between these two parts?

A: The primary differences are product status (FPF2025 is obsolete; TCK22891G,LF is active), current capacity (100mA vs. 400mA), on-resistance (215mOhm vs. 31mOhm), and load voltage minimum threshold (1.6V vs. 1.4V). The TCK22891G,LF also includes load discharge features.

Q: Are there any package considerations for substitution?

A: Both components use 6-pin WLCSP surface mount packages. The FPF2025 uses 6-WLCSP (0.96x1.66) while the TCK22891G,LF uses 6-WCSPE (0.80x1.2). Verify PCB footprint compatibility with your design specifications before implementation.

Q: What fault protection features are present in the TCK22891G,LF?

A: The TCK22891G,LF includes current limiting (fixed) and over-temperature protection. The FPF2025 additionally includes UVLO (under-voltage lockout). Confirm that the absence of UVLO does not impact your application requirements.

Q: Is the TCK22891G,LF available in the same packaging format?

A: The TCK22891G,LF is supplied in Tape & Reel (TR) format, while the FPF2025 packaging format is not specified. Both use 6-pin WLCSP package families suitable for automated assembly processes.