FPF1104 Equivalent & Substitute Parts

Part Overview

The FPF1104 is a P-Channel power switch/driver IC manufactured by onsemi, designed for high-side load switching applications. This component operates as a 1:1 power switch with 1.2A maximum output current in a compact 4-WLCSP (0.96x0.96mm) package. The device is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and production continuity. Substitute parts must maintain functional compatibility across voltage, current, and thermal operating ranges while accommodating package variations.

Substiute Parts

FPF1104
onsemiIn Stock: 1703FPF1104 Datasheet
FPF1104
Current Part
FPF1504UCX
Fairchild SemiconductorIn Stock: 20718FPF1504UCX Datasheet
FPF1504UCX
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TPS22906YZVR
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TPS22907YZTR
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TPS22907YZTT
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TPS22910AYZVT
Texas InstrumentsIn Stock: 4248TPS22910AYZVT Datasheet
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TPS22913BYZVT
Texas InstrumentsIn Stock: 1274TPS22913BYZVT Datasheet
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TPS22913CYZVT
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TPS22930AYZVR
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TPS22930AYZVT
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TPS22934YZVR
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TPS22934YZVT
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Key Parameters

Parameter FPF1104 Specification
Manufacturer onsemi
Switch Type General Purpose P-Channel
Output Configuration High Side, 1:1 Ratio
Current - Output (Max) 1.2A
Voltage - Load 1.2V ~ 4V
Rds On (Typ) 35mOhm
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 4-UFBGA, WLCSP (0.96x0.96mm)
Mounting Type Surface Mount
Product Status Obsolete
Features Load Discharge, Slew Rate Controlled

Substitute Part Grouping Explanation

Substitution eligibility for the FPF1104 is determined by the following critical parameters:

Functional Requirements:

  • Switch topology: P-Channel, high-side configuration, 1:1 ratio
  • Output current capability: minimum 1.2A (equal or greater)
  • Load voltage range: must encompass or exceed 1.2V ~ 4V
  • On-resistance (Rds On): lower values preferred for thermal performance
  • Interface: On/Off control, non-inverting input

Environmental & Compliance:

  • Operating temperature range: -40°C ~ 85°C (TA)
  • Mounting: Surface mount only
  • Package compatibility: 4-pin BGA variants (WLCSP, DSBGA, UFBGA acceptable with PCB layout verification)
  • RoHS/REACH compliance status

Product Lifecycle:

  • Active or Not For New Designs status acceptable for substitution
  • Inventory availability for production continuity

Substitute parts are grouped by current rating and voltage range compatibility. Parts exceeding the FPF1104's 1.2A specification provide design margin. Parts with lower voltage ranges require application-specific verification.

Parameter Comparison

Part Number Manufacturer Current (Max) Voltage - Load Rds On (Typ) Package Product Status Features
FPF1104 onsemi 1.2A 1.2V ~ 4V 35mOhm 4-WLCSP (0.96x0.96) Obsolete Load Discharge, Slew Rate Controlled
FPF1504UCX Fairchild Semiconductor 1.5A 1V ~ 3.6V 15mOhm 4-WLCSP (0.96x0.96) Active Load Discharge, Slew Rate Controlled
TPS22906YZVR Texas Instruments 500mA 1V ~ 3.6V 90mOhm 4-DSBGA (0.88x0.88) Not For New Designs Load Discharge, Slew Rate Controlled
TPS22907YZTR Texas Instruments 1A 1.1V ~ 3.6V 44mOhm 4-DSBGA (0.9x0.9) Not For New Designs Slew Rate Controlled
TPS22907YZTT Texas Instruments 1A 1.1V ~ 3.6V 44mOhm 4-DSBGA (0.9x0.9) Not For New Designs Slew Rate Controlled
TPS22910AYZVT Texas Instruments 2A 1.4V ~ 5.5V 60mOhm 4-DSBGA (0.88x0.88) Active Slew Rate Controlled
TPS22913BYZVT Texas Instruments 2A 1.4V ~ 5.5V 60mOhm 4-DSBGA (0.88x0.88) Active Load Discharge, Slew Rate Controlled
TPS22913CYZVT Texas Instruments 2A 1.4V ~ 5.5V 60mOhm 4-DSBGA (0.88x0.88) Active Load Discharge, Slew Rate Controlled
TPS22930AYZVR Texas Instruments 2A 1.4V ~ 5.5V 35mOhm 4-DSBGA (0.88x0.88) Active Slew Rate Controlled
TPS22930AYZVT Texas Instruments 2A 1.4V ~ 5.5V 35mOhm 4-DSBGA (0.88x0.88) Active Slew Rate Controlled
TPS22934YZVR Texas Instruments 1A 1.5V ~ 3.6V 63mOhm 4-DSBGA (0.88x0.88) Active Load Discharge, Slew Rate Controlled

Engineering Selection Recommendations

Primary Substitute (Highest Compatibility): FPF1504UCX is the most direct substitute. It maintains identical package geometry (4-WLCSP 0.96x0.96mm), exceeds current capability (1.5A vs. 1.2A), and is in active production status. The lower on-resistance (15mOhm vs. 35mOhm) provides improved thermal performance. Voltage range (1V ~ 3.6V) is compatible with FPF1104 applications operating within 1.2V ~ 3.6V. This part is suitable for direct PCB replacement without layout modification.

Secondary Substitutes (Active Status, Higher Current): TPS22910AYZVT, TPS22913BYZVT, TPS22913CYZVT, TPS22930AYZVR, and TPS22930AYZVT are all active Texas Instruments parts rated for 2A output current. These parts provide design margin for current-limited applications. Extended voltage range (1.4V ~ 5.5V) accommodates broader supply specifications. Package variation (4-DSBGA 0.88x0.88mm) requires PCB layout verification for pin-to-pin compatibility and thermal management. TPS22930 variants offer superior on-resistance (35mOhm, matching FPF1104) compared to TPS22913 variants (60mOhm).

Conditional Substitutes (Not For New Designs Status): TPS22906YZVR, TPS22907YZTR, and TPS22907YZTT are classified as Not For New Designs. These parts are acceptable for legacy system support or production continuity only. TPS22906YZVR is current-limited (500mA) and unsuitable for 1.2A applications. TPS22907 variants (1A rating) are marginal for FPF1104 replacement and require thermal analysis.

Compliance Considerations: All substitute parts maintain RoHS3 compliance and REACH Unaffected status, consistent with FPF1104 environmental requirements. Moisture sensitivity level (MSL 1 - Unlimited) is uniform across all candidates.

Frequently Asked Questions (FAQ)

Q: Can FPF1504UCX directly replace FPF1104 without PCB modification? A: Yes. FPF1504UCX uses identical 4-WLCSP (0.96x0.96mm) packaging with matching pin configuration. No PCB layout changes are required. The higher current rating (1.5A) and lower on-resistance (15mOhm) provide performance improvement.

Q: Why do some substitutes use different package types (DSBGA vs. WLCSP)? A: DSBGA and WLCSP are both 4-pin BGA variants with different footprint geometries. DSBGA packages (0.88x0.88mm or 0.9x0.9mm) require PCB layout verification to confirm pad spacing and via placement compatibility. WLCSP packages maintain tighter pitch consistency. Consult PCB design files and component datasheets before selecting DSBGA alternatives.

Q: Is TPS22930AYZVR equivalent to FPF1104 in terms of on-resistance? A: Yes. TPS22930AYZVR has identical on-resistance (35mOhm) to FPF1104. However, it operates at higher voltage range (1.4V ~ 5.5V) and uses 4-DSBGA packaging. For applications within FPF1104's 1.2V ~ 4V range, this part is functionally equivalent with superior current handling (2A vs. 1.2A).

Q: Can I use TPS22906YZVR as a substitute? A: TPS22906YZVR is not recommended for direct substitution. Maximum output current is 500mA, insufficient for FPF1104's 1.2A specification. This part is suitable only for lower-current applications or as a secondary option if primary substitutes are unavailable.

Q: What is the impact of using a part rated for higher current (2A) in a 1.2A application? A: Higher current rating provides design margin and thermal headroom. On-resistance and thermal dissipation remain the primary performance factors. Parts like TPS22930 (2A, 35mOhm) offer equivalent or superior thermal performance compared to FPF1104 (1.2A, 35mOhm) in the same application.

Q: Are "Not For New Designs" parts acceptable for production? A: Parts classified as Not For New Designs are acceptable for legacy system support and production continuity of existing designs. They are not recommended for new product development. Prioritize Active status parts (FPF1504UCX, TPS22910AYZVT, TPS22913 variants, TPS22930 variants, TPS22934YZVR) for new designs.

Q: How do I verify package compatibility before switching to a DSBGA variant? A: Compare pad pitch, ball diameter, and via placement in PCB design files. DSBGA packages (0.88x0.88mm or 0.9x0.9mm) have different footprints than WLCSP (0.96x0.96mm). Consult component datasheets for exact pad coordinates and reflow profile requirements. Prototype testing is recommended before production transition.

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