FOD2200SD Equivalent & Substitute Parts

Part Overview

The FOD2200SD is a logic output optoisolator manufactured by onsemi, featuring 5000Vrms isolation voltage, tri-state output configuration, and 2.5MBd data rate capability. This component is classified as obsolete, making identification of equivalent and substitute parts essential for ongoing system support and new design implementations. The 8-SMD surface mount package with gull wing leads provides compact integration for applications requiring galvanic isolation in digital signal transmission.

Substiute Parts

FOD2200SD
onsemiIn Stock: 5255FOD2200SD Datasheet
FOD2200SD
Current Part
ACNW261L-500E
Broadcom LimitedIn Stock: 6511ACNW261L-500E Datasheet
ACNW261L-500E
Similar
HCPL-2200-500E
Broadcom LimitedIn Stock: 1597HCPL-2200-500E Datasheet
HCPL-2200-500E
Similar

Key Parameters

Parameter FOD2200SD
Manufacturer onsemi
Product Status Obsolete
Number of Channels 1
Voltage - Isolation 5000Vrms
Common Mode Transient Immunity (Min) 10kV/µs
Data Rate 2.5MBd
Output Type Tri-State
Current - Output / Channel 25 mA
Voltage - Supply 4.5V ~ 20V
Operating Temperature -40°C ~ 85°C
Package / Case 8-SMD, Gull Wing
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitute parts for the FOD2200SD are identified based on the following critical parameters that determine functional compatibility:

Primary Compatibility Criteria:

  • Single channel, tri-state output optoisolator configuration
  • 5000Vrms isolation voltage (minimum requirement)
  • 8-SMD surface mount package with gull wing leads
  • DC input type
  • Operating temperature range overlap with -40°C minimum

Identified Substitute Groups:

Group 1: Direct Functional Equivalent ACNW261L-500E (Broadcom Limited) maintains 5000Vrms isolation, tri-state output, and 8-SMD gull wing package. This part exceeds the FOD2200SD in data rate (10MBd vs 2.5MBd), CMTI performance (20kV/µs vs 10kV/µs), and propagation delay specifications while maintaining backward compatibility in core isolation and output characteristics.

Group 2: Reduced Isolation Voltage Substitute HCPL-2200-500E (Broadcom Limited) provides 3750Vrms isolation voltage, which is lower than the FOD2200SD specification of 5000Vrms. This part shares identical data rate (2.5MBd), output current (25 mA), and supply voltage range. Selection of this substitute requires confirmation that the reduced isolation voltage meets application requirements.

Parameter Comparison

Parameter FOD2200SD ACNW261L-500E HCPL-2200-500E
Manufacturer onsemi Broadcom Limited Broadcom Limited
Product Status Obsolete Active Active
Number of Channels 1 1 1
Voltage - Isolation 5000Vrms 5000Vrms 3750Vrms
Common Mode Transient Immunity (Min) 10kV/µs 20kV/µs 1kV/µs
Input Type DC DC DC
Output Type Tri-State Tri-State Tri-State
Current - Output / Channel 25 mA 10 mA 25 mA
Data Rate 2.5MBd 10MBd 2.5MBd
Propagation Delay tpLH / tpHL (Max) 300ns, 300ns 95ns, 95ns 300ns, 300ns
Voltage - Supply 4.5V ~ 20V 2.7V ~ 5.5V 4.5V ~ 20V
Operating Temperature -40°C ~ 85°C -40°C ~ 105°C -40°C ~ 85°C
Package / Case 8-SMD, Gull Wing 8-SMD, Gull Wing 8-SMD, Gull Wing
Mounting Type Surface Mount Surface Mount Surface Mount
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

ACNW261L-500E Selection Criteria: This substitute is the primary recommendation for FOD2200SD replacement. The part maintains 5000Vrms isolation voltage specification and tri-state output configuration. Active product status ensures ongoing availability and manufacturing support. ROHS3 compliance and REACH unaffected status align with current regulatory requirements. The reduced output current (10 mA vs 25 mA) requires verification against load requirements. Supply voltage range limitation (2.7V ~ 5.5V vs 4.5V ~ 20V) necessitates confirmation of system power supply specifications.

HCPL-2200-500E Selection Criteria: This substitute is applicable only when reduced isolation voltage (3750Vrms) is acceptable for the application. Active product status and ROHS3 compliance support long-term availability. Identical data rate and output current specifications provide direct functional compatibility in timing-critical applications. The reduced CMTI specification (1kV/µs vs 10kV/µs) requires assessment of common mode transient exposure in the target circuit environment.

Frequently Asked Questions (FAQ)

Q: Can ACNW261L-500E directly replace FOD2200SD without circuit modifications? A: ACNW261L-500E maintains 5000Vrms isolation and tri-state output compatibility. However, the reduced output current specification (10 mA vs 25 mA) and narrower supply voltage range (2.7V ~ 5.5V vs 4.5V ~ 20V) require circuit verification. If the application operates within 2.7V to 5.5V supply range and load current does not exceed 10 mA, direct substitution is feasible.

Q: What is the primary difference between ACNW261L-500E and HCPL-2200-500E? A: ACNW261L-500E maintains the 5000Vrms isolation voltage of the original FOD2200SD, while HCPL-2200-500E provides only 3750Vrms isolation. ACNW261L-500E also offers superior CMTI performance (20kV/µs vs 1kV/µs) and faster propagation delay (95ns vs 300ns). HCPL-2200-500E matches the original data rate and output current specifications exactly.

Q: Is the 8-SMD gull wing package identical across all three parts? A: All three parts use 8-SMD surface mount packages with gull wing leads, ensuring mechanical compatibility in PCB layouts. Pin assignments and footprints are consistent across FOD2200SD, ACNW261L-500E, and HCPL-2200-500E.

Q: What compliance certifications apply to the substitute parts? A: Both ACNW261L-500E and HCPL-2200-500E are ROHS3 compliant and REACH unaffected. These certifications support use in applications subject to current environmental and hazardous substance regulations.

Q: Why is FOD2200SD classified as obsolete? A: Obsolete status indicates that onsemi has discontinued manufacturing and support for this component. Active substitute parts from Broadcom Limited ensure continued availability for replacement and new design implementations.

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