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FLZ10VC Equivalent & Substitute Parts
Part Overview
The FLZ10VC is a Zener diode manufactured by onsemi, rated at 10.1 V nominal with 500 mW power dissipation in a surface mount SOD-80 package. This component is classified as obsolete, necessitating identification of active equivalent parts for new designs and ongoing production requirements. The FLZ10VC serves as a voltage regulation and protection element in electronic circuits requiring stable reference voltages in the 10 V range.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Zener (Nom) | 10.1 | V |
| Tolerance | ±3% | % |
| Power - Max | 500 | mW |
| Impedance (Max) | 6.6 | Ohms |
| Current - Reverse Leakage @ Vr | 110 | nA @ 7 V |
| Voltage - Forward (Vf) (Max) @ If | 1.2 | V @ 200 mA |
| Operating Temperature Range | -65 to 175 | °C |
| Mounting Type | Surface Mount | — |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 | — |
| Product Status | Obsolete | — |
Substitute Part Grouping Explanation
Substitution of the FLZ10VC is determined by alignment of the following critical electrical and mechanical parameters:
Electrical Criteria:
- Zener voltage nominal rating within the 10 V range (10.0 V to 10.1 V acceptable)
- Power dissipation rating of 500 mW minimum
- Surface mount technology compatibility
- Operating temperature range encompassing or exceeding -65°C to 175°C
Mechanical Criteria:
- Package format: DO-213AC, MINI-MELF, or SOD-80 equivalent
- Moisture sensitivity level MSL 1 or better
The BZV55-B10,115 manufactured by NXP Semiconductors meets these substitution criteria. This part maintains the same power rating, package family, and surface mount configuration while offering active product status and improved availability.
Parameter Comparison
| Parameter | FLZ10VC (onsemi) | BZV55-B10,115 (NXP) | Compatibility Notes |
|---|---|---|---|
| Voltage - Zener (Nom) | 10.1 V | 10 V | 0.1 V variance within acceptable tolerance band |
| Tolerance | ±3% | ±2% | NXP part offers tighter tolerance |
| Power - Max | 500 mW | 500 mW | Identical rating |
| Impedance (Max) | 6.6 Ohms | 20 Ohms | NXP part has higher impedance; verify circuit requirements |
| Current - Reverse Leakage @ Vr | 110 nA @ 7 V | 200 nA @ 7 V | NXP part exhibits higher leakage current |
| Voltage - Forward (Vf) (Max) @ If | 1.2 V @ 200 mA | 900 mV @ 10 mA | Different test conditions; direct comparison not applicable |
| Operating Temperature Range | -65 to 175°C | -65 to 200°C | NXP part extends upper temperature limit |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 | DO-213AC, MINI-MELF, SOD-80 | Identical package family |
| Product Status | Obsolete | Active | NXP part actively manufactured and supported |
| Moisture Sensitivity Level | MSL 1 (Unlimited) | MSL 1 (Unlimited) | Identical |
| REACH Status | REACH Unaffected | REACH Unaffected | Both compliant |
Engineering Selection Recommendations
The BZV55-B10,115 is the qualified substitute for the obsolete FLZ10VC. Selection of this alternative is based on the following engineering factors:
Product Status: The FLZ10VC is classified as obsolete, making continued sourcing from original inventory unsustainable for long-term production. The BZV55-B10,115 maintains active manufacturing status with established supply chains.
Electrical Equivalence: Both devices operate at nominally 10 V with 500 mW power dissipation. The 0.1 V difference between 10.1 V and 10 V falls within standard tolerance bands for Zener diode applications. The tighter ±2% tolerance of the NXP part provides improved voltage regulation precision compared to the ±3% onsemi specification.
Thermal Performance: The BZV55-B10,115 extends the upper operating temperature limit to 200°C, providing additional thermal margin beyond the FLZ10VC specification of 175°C.
Regulatory Compliance: Both parts maintain REACH Unaffected status and MSL 1 moisture sensitivity classification, ensuring equivalent compliance posture for manufacturing and environmental requirements.
Package Compatibility: Identical surface mount package specifications (DO-213AC, MINI-MELF, SOD-80) ensure direct PCB footprint compatibility without layout modifications.
Frequently Asked Questions (FAQ)
Q: Can the BZV55-B10,115 be used as a direct replacement for the FLZ10VC in existing designs?
A: Yes. Both devices share identical power ratings (500 mW), package formats (SOD-80/MINI-MELF), and surface mount configuration. The 0.1 V nominal voltage difference and improved tolerance specification of the NXP part are compatible with standard Zener diode application requirements.
Q: What is the significance of the impedance difference between the two parts?
A: The FLZ10VC specifies 6.6 Ohms maximum impedance while the BZV55-B10,115 specifies 20 Ohms. Impedance affects voltage regulation quality under load transients. Applications requiring the lowest possible impedance should evaluate circuit performance with the higher impedance value of the substitute part.
Q: Does the higher reverse leakage current of the BZV55-B10,115 affect circuit operation?
A: The BZV55-B10,115 exhibits 200 nA reverse leakage at 7 V compared to 110 nA for the FLZ10VC. This difference is negligible in most voltage regulation and protection applications. Circuits with extremely low quiescent current requirements should evaluate the impact through simulation or prototype testing.
Q: Are the forward voltage specifications comparable between these parts?
A: No. The FLZ10VC specifies forward voltage at 200 mA while the BZV55-B10,115 specifies it at 10 mA. These different test conditions prevent direct comparison. Forward voltage characteristics are secondary to Zener voltage regulation in typical applications.
Q: What is the advantage of the extended temperature range of the BZV55-B10,115?
A: The BZV55-B10,115 operates to 200°C versus 175°C for the FLZ10VC. This extended range provides additional thermal margin for applications in high-temperature environments or with limited thermal management, reducing the risk of exceeding maximum operating temperature limits.
Q: Are there any PCB layout considerations when substituting these parts?
A: No. Both parts use identical package families (DO-213AC, MINI-MELF, SOD-80). PCB footprints, land patterns, and assembly processes remain unchanged. No layout modifications are required.
Q: What is the inventory status difference between these parts?
A: The FLZ10VC has 17,845 pieces available as new original stock but is classified as obsolete with no ongoing manufacturing. The BZV55-B10,115 has 352,780 pieces in stock and maintains active product status, ensuring long-term availability for production requirements.
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