FIN1019MX Equivalent & Substitute Parts

Part Overview

The FIN1019MX is a 1/1 transceiver with full-duplex LVDS (Low-Voltage Differential Signaling) capability, manufactured by onsemi in a 14-SOIC package. This component operates at data rates up to 400 Mbps and is designed for interface applications requiring high-speed differential signaling. The FIN1019MX is classified as obsolete, making identification of suitable substitute components essential for ongoing system support and new design implementations.

Substiute Parts

FIN1019MX

onsemiIn Stock: 1854FIN1019MX Datasheet

Current PartRFQ

FIN1019MTCX

Fairchild SemiconductorIn Stock: 15327FIN1019MTCX Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the FIN1019MX is determined by the following critical parameters:

• Protocol Compatibility: LVDS transceiver functionality
• Channel Configuration: 1 driver and 1 receiver (1/1)
• Duplex Mode: Full-duplex operation
• Data Rate: 400 Mbps capability
• Supply Voltage: 3V to 3.6V operating range
• Temperature Range: -40°C to 85°C
• Mounting Technology: Surface mount configuration
• Package Type: 14-pin package (SOIC or TSSOP variants acceptable)

The FIN1019MTCX qualifies as a substitute based on matching all critical electrical parameters and maintaining functional equivalence through alternative packaging (14-TSSOP versus 14-SOIC).

Parameter Comparison

Engineering Selection Recommendations

The FIN1019MTCX serves as a functional substitute for the obsolete FIN1019MX. Both components maintain identical electrical specifications across protocol, channel configuration, data rate, supply voltage, and operating temperature range. The primary difference is packaging: the FIN1019MTCX uses 14-TSSOP instead of 14-SOIC, with a slightly wider footprint (4.40mm versus 3.90mm).

The FIN1019MTCX carries Active product status and ROHS3 compliance, providing advantages for new designs and long-term availability. Both components share REACH Unaffected status and EAR99 export classification.

Frequently Asked Questions (FAQ)

Q: Can the FIN1019MTCX directly replace the FIN1019MX on existing PCBs?

A: Electrical substitution is valid. However, the package footprint differs between 14-SOIC and 14-TSSOP. PCB layout modifications are required to accommodate the different pin pitch and body dimensions.

Q: What are the key differences between 14-SOIC and 14-TSSOP packages?

A: Both are 14-pin surface mount packages. The SOIC (Small Outline Integrated Circuit) measures 0.154" width, while TSSOP (Thin Shrink Small Outline Package) measures 0.173" width. Pin spacing and solder pad geometry differ accordingly.

Q: Are there any compliance differences between these parts?

A: The FIN1019MTCX is ROHS3 compliant, while the FIN1019MX compliance status is not specified. Both are REACH Unaffected. For new designs, the FIN1019MTCX provides documented compliance assurance.

Q: Why is the FIN1019MX marked as obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. The FIN1019MTCX, with Active status, represents the current alternative for LVDS transceiver applications in this configuration.

Q: Do both parts support the same data rates and voltage ranges?

A: Yes. Both the FIN1019MX and FIN1019MTCX operate at 400 Mbps with 3V to 3.6V supply voltage and -40°C to 85°C temperature range.