FIN1017MX Equivalent & Substitute Parts

Part Overview

The FIN1017MX is a 1/0 LVDS driver IC manufactured by onsemi, housed in an 8-SOIC package. This component is classified as Last Time Buy, indicating discontinued production with limited inventory availability. The FIN1017MX operates at 3V to 3.6V supply voltage with a maximum data rate of 600Mbps and supports operating temperatures from -40°C to 85°C. Due to its Last Time Buy status, identifying functionally compatible substitute components is essential for design continuity and long-term supply chain planning.

Substiute Parts

FIN1017MX

onsemiIn Stock: 1652FIN1017MX Datasheet

Current PartRFQ

FIN1019MTCX

Fairchild SemiconductorIn Stock: 15327FIN1019MTCX Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the FIN1017MX is determined by the following critical parameters:

• Protocol Compatibility: Both main and substitute parts must support LVDS (Low-Voltage Differential Signaling)
• Supply Voltage Range: Operating voltage must overlap or be compatible with 3V to 3.6V
• Operating Temperature Range: Must support -40°C to 85°C minimum
• Data Rate Capability: Substitute must support at least the required signaling speed
• RoHS and Compliance Status: Both parts must maintain equivalent regulatory compliance (ROHS3, REACH Unaffected, EAR99)

The FIN1019MTCX qualifies as a substitute based on these parameters. While it functions as a 1/1 transceiver (versus the 1/0 driver configuration of the FIN1017MX), it maintains LVDS protocol compatibility, identical supply voltage range, matching operating temperature specifications, and equivalent compliance certifications.

Parameter Comparison

Engineering Selection Recommendations

The FIN1019MTCX is available as an active production substitute for the Last Time Buy FIN1017MX. Both components maintain ROHS3 compliance, REACH Unaffected status, and EAR99 classification, ensuring equivalent regulatory standing.

Key considerations for selection:

• The FIN1019MTCX operates at a lower maximum data rate (400Mbps versus 600Mbps), which may impact applications requiring the full bandwidth of the original FIN1017MX
• The substitute provides 1/1 transceiver functionality with full-duplex capability, offering additional operational modes beyond the 1/0 driver configuration
• Package differences (8-SOIC to 14-TSSOP) require PCB layout modifications and may affect board space allocation
• The FIN1019MTCX is in active production status, providing long-term supply availability compared to the Last Time Buy status of the original part

Frequently Asked Questions (FAQ)

Q: Can the FIN1019MTCX directly replace the FIN1017MX without circuit modifications?

A: Direct pin-for-pin replacement is not possible due to different package types (8-SOIC versus 14-TSSOP) and pin counts (8 versus 14). PCB layout and schematic modifications are required. The functional differences (1/0 driver versus 1/1 transceiver) may also require circuit design adjustments depending on application requirements.

Q: What is the impact of the lower 400Mbps data rate on the FIN1019MTCX compared to the 600Mbps FIN1017MX?

A: Applications operating below 400Mbps will function within the substitute's specifications. Systems requiring data rates between 400Mbps and 600Mbps cannot use the FIN1019MTCX without performance degradation or signal integrity issues.

Q: Are both parts compliant with the same regulatory standards?

A: Yes. Both the FIN1017MX and FIN1019MTCX are ROHS3 compliant, REACH Unaffected, and classified as EAR99 for export control purposes.

Q: Why does the FIN1019MTCX have a 1/1 transceiver configuration instead of a 1/0 driver?

A: The FIN1019MTCX is designed for bidirectional LVDS communication with full-duplex capability. Applications requiring only unidirectional driver functionality will not utilize the receiver portion of the substitute component.

Q: What are the package footprint implications of switching from 8-SOIC to 14-TSSOP?

A: The 14-TSSOP package is larger than the 8-SOIC package. PCB layout redesign is necessary to accommodate the increased pin count and different lead spacing. Board space availability must be verified before design implementation.