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FEPB16AT-E3/45 Equivalent & Substitute Parts
Part Overview
The FEPB16AT-E3/45 is a general-purpose diode array manufactured by Vishay General Semiconductor - Diodes Division. This component features a 1 Pair Common Cathode configuration in a Surface Mount TO-263-3 (D2PAK) package with a maximum reverse voltage rating of 50 V and average rectified current of 8A per diode. The part is designated as Last Time Buy, indicating discontinued production status. Identification of equivalent and substitute parts is necessary to ensure design continuity and procurement availability for applications currently utilizing this component.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Diode Configuration | 1 Pair Common Cathode |
| Voltage - DC Reverse (Vr) (Max) | 50 V |
| Current - Average Rectified (Io) (per Diode) | 8A |
| Voltage - Forward (Vf) (Max) @ If | 950 mV @ 8 A |
| Speed | Fast Recovery ≤ 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | 35 ns |
| Current - Reverse Leakage @ Vr | 10 µA @ 50 V |
| Operating Temperature - Junction | -55°C ~ 150°C |
| Mounting Type | Surface Mount |
| Package / Case | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB |
| Technology | Standard |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the FEPB16AT-E3/45 is determined by the following critical parameters: diode configuration (1 Pair Common Cathode), mounting type (Surface Mount), and package type (TO-263-3, D2PAK). Substitute parts must maintain identical or superior electrical performance within the application's voltage and current requirements.
The FEPB16AT-E3/45 operates at a maximum reverse voltage of 50 V with 8A average rectified current per diode. Substitute parts identified in this reference maintain the same diode configuration and package footprint. However, substitute parts may feature higher voltage ratings (200 V) and higher current ratings (10A to 16A), which are electrically compatible for applications designed for the original 50 V / 8A specification, as higher-rated components operate within the original design envelope.
Key substitution criteria:
- Diode Configuration: 1 Pair Common Cathode (mandatory match)
- Package Type: TO-263-3, D2PAK (mandatory match)
- Mounting Type: Surface Mount (mandatory match)
- Fast Recovery Technology: ≤ 500ns (mandatory match)
- Operating Temperature Range: Minimum -55°C to 150°C (mandatory match)
- RoHS3 Compliance: Required for environmental standards
Parameter Comparison
| Parameter | FEPB16AT-E3/45 | FEPB16DT-M3/I | STTH1602CG-TR |
|---|---|---|---|
| Manufacturer | Vishay General Semiconductor - Diodes Division | Vishay General Semiconductor - Diodes Division | STMicroelectronics |
| Diode Configuration | 1 Pair Common Cathode | 1 Pair Common Cathode | 1 Pair Common Cathode |
| Voltage - DC Reverse (Vr) (Max) | 50 V | 200 V | 200 V |
| Current - Average Rectified (Io) (per Diode) | 8A | 16A | 10A |
| Voltage - Forward (Vf) (Max) @ If | 950 mV @ 8 A | 950 mV @ 8 A | 1.1 V @ 8 A |
| Speed | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) | Fast Recovery ≤ 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | 35 ns | 35 ns | 26 ns |
| Current - Reverse Leakage @ Vr | 10 µA @ 50 V | 10 µA @ 200 V | 6 µA @ 200 V |
| Operating Temperature - Junction | -55°C ~ 150°C | -55°C ~ 150°C | 175°C (Max) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB |
| Technology | Standard | Standard | Standard |
| Product Status | Last Time Buy | Active | Active |
| RoHS Status | ROHS3 Compliant | Not specified | ROHS3 Compliant |
Engineering Selection Recommendations
FEPB16DT-M3/I (Vishay General Semiconductor - Diodes Division)
The FEPB16DT-M3/I is an Active product from the same manufacturer as the original component. This part maintains identical diode configuration, package type, and mounting specifications. The FEPB16DT-M3/I features higher voltage (200 V) and current (16A) ratings, providing enhanced performance margin for the original 50 V / 8A application. Forward voltage and reverse recovery time characteristics are identical to the FEPB16AT-E3/45. The part carries AEC-Q101 automotive qualification and maintains the same operating temperature range. Selection of this part is appropriate for applications requiring manufacturer continuity and automotive-grade reliability.
STTH1602CG-TR (STMicroelectronics)
The STTH1602CG-TR is an Active product from STMicroelectronics with identical diode configuration and package type. This part features 200 V reverse voltage and 10A average rectified current ratings. The STTH1602CG-TR exhibits superior reverse recovery time (26 ns versus 35 ns) and lower reverse leakage current (6 µA versus 10 µA at rated voltage). Forward voltage is slightly elevated at 1.1 V @ 8A compared to 950 mV. The maximum operating temperature is 175°C, exceeding the original specification. RoHS3 compliance is confirmed. Selection of this part is appropriate for applications where improved switching performance and extended temperature operation are beneficial.
Both substitute parts are electrically compatible with the FEPB16AT-E3/45 within the original design voltage and current envelope. Selection between substitutes depends on manufacturer preference, automotive qualification requirements, and performance optimization priorities.
Frequently Asked Questions (FAQ)
Q: Can the FEPB16DT-M3/I or STTH1602CG-TR be used as direct replacements for the FEPB16AT-E3/45?
A: Both parts are electrically compatible substitutes. They maintain identical diode configuration (1 Pair Common Cathode), package type (TO-263-3, D2PAK), and mounting type (Surface Mount). The substitute parts feature higher voltage and current ratings, which operate within the original design envelope. PCB footprint compatibility is confirmed across all three parts.
Q: What is the difference in forward voltage between these parts?
A: The FEPB16AT-E3/45 and FEPB16DT-M3/I both specify 950 mV @ 8A forward voltage. The STTH1602CG-TR specifies 1.1 V @ 8A. This 150 mV difference may affect power dissipation in high-current applications. Thermal analysis is required if forward voltage variation impacts design margins.
Q: Are there temperature rating differences between the substitutes?
A: The FEPB16AT-E3/45 and FEPB16DT-M3/I both specify -55°C to 150°C operating junction temperature range. The STTH1602CG-TR specifies a maximum junction temperature of 175°C, providing 25°C additional thermal margin. Applications operating near the upper temperature limit may benefit from the STTH1602CG-TR.
Q: What is the significance of the reverse recovery time difference?
A: The FEPB16AT-E3/45 specifies 35 ns reverse recovery time. The STTH1602CG-TR specifies 26 ns. Faster reverse recovery reduces switching losses and electromagnetic interference in high-frequency applications. The FEPB16DT-M3/I maintains the original 35 ns specification.
Q: Does the higher voltage rating of substitute parts affect circuit operation?
A: No. The substitute parts rated at 200 V are designed to operate safely at voltages below their maximum rating. An application designed for 50 V operation will function correctly with 200 V-rated components. The higher rating provides additional safety margin and component longevity.
Q: Are all three parts RoHS3 compliant?
A: The FEPB16AT-E3/45 and STTH1602CG-TR are confirmed RoHS3 compliant. RoHS status for the FEPB16DT-M3/I is not specified in the provided data. Verification with the manufacturer is required if RoHS3 compliance is a design requirement.
Q: What is the difference in reverse leakage current?
A: The FEPB16AT-E3/45 specifies 10 µA @ 50 V. The FEPB16DT-M3/I specifies 10 µA @ 200 V. The STTH1602CG-TR specifies 6 µA @ 200 V. Lower reverse leakage current reduces standby power consumption and improves circuit efficiency in low-power applications.
Q: Can I use these parts interchangeably on the same PCB?
A: Yes. All three parts share identical TO-263-3 (D2PAK) package dimensions and pin configuration. No PCB layout modifications are required for substitution. Thermal management considerations may differ due to current rating variations; verify thermal design if operating at maximum current specifications.
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