FEP16HTD Equivalent & Substitute Parts

Part Overview

The FEP16HTD is a diode array manufactured by onsemi, configured as 1 pair series connection with a maximum reverse voltage of 500 V and average rectified current of 16 A per diode. The device is packaged in TO-220-3 through-hole configuration and classified as obsolete. Due to its obsolete product status, equivalent substitute parts with compatible electrical and mechanical specifications are necessary for continued system design and maintenance applications.

Substiute Parts

FEP16HTD

onsemiIn Stock: 684FEP16HTD Datasheet

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DSEE15-06CC

IXYSIn Stock: 1845DSEE15-06CC Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the FEP16HTD are identified based on the following critical parameters that determine functional compatibility:

Configuration Match: Diode array with 1 pair series connection architecture

Voltage Rating: Maximum reverse voltage equal to or greater than 500 V

Current Rating: Average rectified current per diode equal to or greater than 16 A

Speed Classification: Fast recovery diode technology with reverse recovery time ≤ 500 ns

Mounting Technology: Through-hole mounting for direct PCB integration

Temperature Range: Operating junction temperature range encompassing the -55°C to 150°C specification

The DSEE15-06CC from IXYS meets these substitution criteria with enhanced electrical performance characteristics while maintaining compatible package footprint and mounting methodology.

Parameter Comparison

Engineering Selection Recommendations

The DSEE15-06CC from IXYS is a functional substitute for the obsolete FEP16HTD. The substitute part maintains active product status, ensuring long-term availability and supply chain continuity. Both devices are REACH unaffected and carry MSL 1 classification, indicating equivalent environmental compliance profiles.

The DSEE15-06CC provides enhanced reverse voltage rating (600 V versus 500 V) and improved reverse recovery time (30 ns versus 50 ns), delivering superior performance margins in high-frequency switching applications. The ISOPLUS220™ package provides equivalent through-hole mounting compatibility with the original TO-220-3 footprint.

Current rating differential (15 A versus 16 A per diode) represents a 6.25% reduction and must be evaluated against specific application load requirements. Forward voltage characteristics differ at different measurement points and should be assessed for thermal management implications in the target circuit.

Frequently Asked Questions (FAQ)

Q: Can the DSEE15-06CC directly replace the FEP16HTD in existing designs?

A: The DSEE15-06CC maintains compatible through-hole mounting and diode configuration. However, the 1 A reduction in current rating and package geometry differences between TO-220-3 and ISOPLUS220™ require circuit validation. PCB layout modifications may be necessary to accommodate the alternate package footprint.

Q: What are the key differences in electrical performance?

A: The DSEE15-06CC provides 100 V higher reverse voltage rating (600 V versus 500 V) and 20 ns faster reverse recovery time (30 ns versus 50 ns). Forward voltage is specified at higher current (15 A versus 8 A), making direct comparison at identical operating points necessary for thermal analysis.

Q: Are both parts compliant with the same regulatory standards?

A: Both the FEP16HTD and DSEE15-06CC are REACH unaffected and carry identical MSL 1 classification. The DSEE15-06CC additionally carries RoHS3 compliance certification, providing enhanced environmental compliance documentation.

Q: What is the impact of the current rating difference?

A: The DSEE15-06CC is rated for 15 A average rectified current per diode compared to the FEP16HTD's 16 A rating. Applications operating at or near 16 A must be re-evaluated to confirm operation within the 15 A limit of the substitute part.

Q: How do the package differences affect PCB integration?

A: The FEP16HTD uses TO-220-3 packaging while the DSEE15-06CC uses ISOPLUS220™ packaging. Both are through-hole mounted devices with similar thermal and electrical characteristics, but physical dimensions and pin spacing differ. PCB footprint redesign is required for mechanical compatibility.