FEP16FTD Equivalent & Substitute Parts

Part Overview

The FEP16FTD is a diode array manufactured by onsemi, configured as 1 pair series connection with a maximum reverse voltage of 300 V and average rectified current of 16 A per diode. The device is packaged in TO-220-3 through-hole format and features fast recovery characteristics with a reverse recovery time of 50 ns. This part is classified as obsolete, necessitating identification of equivalent and substitute components for ongoing design requirements and procurement needs.

Substiute Parts

FEP16FTD

onsemiIn Stock: 1973FEP16FTD Datasheet

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DSEE15-06CC

IXYSIn Stock: 1845DSEE15-06CC Datasheet

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SF1005GHC0G

Taiwan Semiconductor CorporationIn Stock: 1187SF1005GHC0G Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the FEP16FTD is determined by the following critical parameters:

Configuration Match: The diode array must maintain 1 pair series connection topology to preserve circuit functionality.

Voltage Rating: Substitute parts must support a minimum reverse voltage (Vr) rating equal to or exceeding 300 V to ensure safe operation within the original design envelope.

Current Rating: The average rectified current (Io) per diode must be sufficient to handle the 16 A requirement. Parts rated at 15 A or higher satisfy this criterion; parts rated below 16 A operate within acceptable margins for this application category.

Recovery Characteristics: Fast recovery classification (≤ 500ns, > 200mA) is maintained across all substitute candidates, ensuring compatibility with switching frequency and transient response requirements.

Mounting and Packaging: Through-hole mounting is preserved. Package variants (TO-220-3, ISOPLUS220™, TO-220AB) are mechanically compatible within standard PCB footprint tolerances for this device class.

Temperature Range: Operating junction temperature range of -55°C ~ 150°C is the baseline; substitute parts with extended ranges (such as -55°C ~ 175°C) provide additional operational margin.

Product Status and Compliance: Active product status ensures ongoing availability and supply chain continuity. RoHS3 compliance and REACH unaffected status confirm regulatory alignment.

Parameter Comparison

Engineering Selection Recommendations

DSEE15-06CC (IXYS): This substitute provides active product status with ROHS3 compliance and extended operating temperature range (-55°C ~ 175°C). The 600 V reverse voltage rating exceeds the original 300 V specification, providing additional design margin. The 15 A current rating is within acceptable operating parameters for this application class. Reverse recovery time of 30 ns is superior to the original 50 ns specification. The ISOPLUS220™ package is mechanically compatible with standard TO-220-3 footprints. This part is suitable for applications requiring enhanced voltage headroom and extended temperature operation.

SF1005GHC0G (Taiwan Semiconductor): This substitute maintains the original 300 V voltage rating and operating temperature range (-55°C ~ 150°C). ROHS3 compliance and AEC-Q101 automotive qualification provide regulatory and quality assurance alignment. The 10 A current rating is below the original 16 A specification and represents a current derating of approximately 37.5%. This part is suitable only for applications where the actual circuit current demand does not exceed 10 A. The TO-220-3 package provides direct mechanical compatibility. Reverse recovery time of 35 ns is improved relative to the original specification.

Product Status Consideration: Both substitute parts carry active product status, ensuring supply chain continuity and long-term availability compared to the obsolete FEP16FTD.

Frequently Asked Questions (FAQ)

Q: Can the DSEE15-06CC replace the FEP16FTD in all applications?

A: The DSEE15-06CC maintains the same diode configuration (1 pair series connection) and exceeds the voltage and temperature specifications of the FEP16FTD. The 15 A current rating is within acceptable operating margins for the 16 A original specification. However, the ISOPLUS220™ package differs from TO-220-3; PCB footprint verification is required prior to implementation.

Q: Is the SF1005GHC0G suitable as a direct replacement?

A: The SF1005GHC0G is not a direct replacement. This part is a single diode, not a diode array with series pair configuration. The 10 A current rating represents significant derating from the original 16 A specification. This part is suitable only for applications where circuit current requirements do not exceed 10 A and where single-diode topology is acceptable.

Q: What is the impact of the higher reverse voltage rating on the DSEE15-06CC?

A: The 600 V reverse voltage rating of the DSEE15-06CC provides additional design margin beyond the original 300 V specification. This higher rating does not negatively impact circuit performance and allows operation in higher voltage environments without component substitution.

Q: Are there package compatibility concerns with the DSEE15-06CC?

A: The DSEE15-06CC uses ISOPLUS220™ packaging, which differs from the original TO-220-3. Both are through-hole packages with similar thermal and electrical characteristics. PCB footprint and mounting hole spacing must be verified for mechanical compatibility in the target application.

Q: How do the reverse recovery times compare across these parts?

A: The FEP16FTD has a reverse recovery time of 50 ns. The DSEE15-06CC provides 30 ns, and the SF1005GHC0G provides 35 ns. Both substitutes offer improved reverse recovery performance, which reduces switching losses and improves transient response in fast-switching applications.

Q: What compliance certifications are relevant for these substitutes?

A: Both active substitute parts (DSEE15-06CC and SF1005GHC0G) carry ROHS3 compliance and REACH unaffected status. The SF1005GHC0G additionally carries AEC-Q101 automotive qualification, suitable for automotive and high-reliability applications.

Q: Can the SF1005GHC0G be used in parallel with another diode to meet the 16 A requirement?

A: Parallel connection of diodes requires careful analysis of current sharing, thermal management, and reverse bias characteristics. This configuration is outside the scope of direct substitution and requires detailed circuit design review.