FDZ206P Equivalent & Substitute Parts

Part Overview

The FDZ206P is a P-Channel MOSFET manufactured by onsemi, part of the PowerTrench® series. This device is rated for 20V drain-to-source voltage with a continuous drain current of 13A at 25°C and is housed in a 30-BGA (4x3.5) surface mount package. The FDZ206P is classified as Obsolete, making identification of functionally equivalent alternatives necessary for ongoing design support and component procurement.

Substiute Parts

FDZ206P

onsemiIn Stock: 20404FDZ206P Datasheet

Current PartRFQ

FDMC6679AZ

onsemiIn Stock: 29157FDMC6679AZ Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the FDZ206P requires evaluation based on the following critical parameters:

Electrical Compatibility Criteria:

• FET Type: P-Channel topology must be maintained
• Drain to Source Voltage (Vdss): Substitute must equal or exceed 20V rating
• Continuous Drain Current (Id): Substitute must support minimum 13A at 25°C
• On-State Resistance (Rds On): Substitute performance must be comparable to 9.5mOhm at rated conditions
• Gate Charge (Qg): Lower values indicate faster switching characteristics
• Operating Temperature Range: Must support -55°C to 150°C (TJ)

Mechanical Compatibility Criteria:

• Mounting Type: Surface mount requirement
• Package footprint compatibility with PCB layout

The FDMC6679AZ is identified as a direct substitute based on onsemi's internal cross-reference data. This device maintains P-Channel MOSFET topology and PowerTrench® series characteristics while offering enhanced voltage rating (30V) and comparable current handling capability.

Parameter Comparison

Engineering Selection Recommendations

FDMC6679AZ as Substitute for FDZ206P:

The FDMC6679AZ is suitable as a functional equivalent based on the following engineering criteria:

1. Electrical Performance: The FDMC6679AZ maintains P-Channel MOSFET topology with enhanced voltage rating (30V vs. 20V). Continuous drain current at 25°C ambient (11.5A Ta) meets the FDZ206P requirement of 13A when operating under case temperature conditions (20A Tc). On-state resistance values are comparable (10mOhm vs. 9.5mOhm), ensuring similar power dissipation characteristics.

2. Thermal Compatibility: Both devices operate across the identical temperature range (-55°C to 150°C TJ), supporting equivalent thermal performance in target applications.

3. Product Status Consideration: Both devices carry legacy product status (FDZ206P: Obsolete; FDMC6679AZ: Not For New Designs). For ongoing support of existing designs, the FDMC6679AZ provides continued availability while maintaining electrical and thermal specifications.

4. Compliance: The FDMC6679AZ carries ROHS3 compliance certification, whereas the FDZ206P compliance status is not specified. Both devices are REACH Unaffected and classified under ECCN EAR99.

5. Package Transition: The substitution requires PCB layout modification due to package change from 30-WFBGA (4x3.5) to 8-PowerWDFN (3.3x3.3). This is a mechanical redesign consideration, not an electrical limitation.

Frequently Asked Questions (FAQ)

Q: Can the FDMC6679AZ directly replace the FDZ206P without circuit modification?

A: Electrical substitution is valid based on voltage, current, and thermal ratings. However, the package change from 30-WFBGA to 8-PowerWDFN requires PCB layout redesign. Pin configuration and footprint are not compatible for direct socket replacement.

Q: What is the impact of the higher gate charge (91 nC vs. 53 nC) in the FDMC6679AZ?

A: Higher gate charge increases the energy required to switch the device and may extend switching time. Gate driver circuits must be evaluated to confirm adequate drive capability at the intended switching frequency.

Q: Why does the FDMC6679AZ show different continuous drain current ratings (11.5A Ta vs. 20A Tc)?

A: The 11.5A rating is specified at 25°C ambient temperature (Ta), while 20A is specified at case temperature (Tc). For the FDZ206P application requiring 13A at 25°C, the FDMC6679AZ meets this requirement under case temperature operation. Thermal management design must ensure case temperature conditions are achievable.

Q: Are there compliance or certification differences between these devices?

A: The FDMC6679AZ carries ROHS3 compliance certification. The FDZ206P compliance status is not specified in available documentation. Both devices are REACH Unaffected and carry identical ECCN and HTSUS classifications.

Q: What is the significance of the "Not For New Designs" status of the FDMC6679AZ?

A: This status indicates the device is in legacy phase with limited future availability. It is suitable for sustaining existing designs but should not be selected for new product development. For new designs, consult current onsemi product lines for actively supported P-Channel MOSFET alternatives.

Q: How does the 30V rating of the FDMC6679AZ affect circuit design compared to the 20V FDZ206P?

A: The higher voltage rating provides additional design margin for transient voltage spikes and overvoltage conditions. No circuit modification is required; the device operates safely at voltages up to 30V, providing enhanced reliability in the 20V application space.