FDZ197PZ P-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The FDZ197PZ is a P-Channel MOSFET manufactured by onsemi, rated for 20V drain-to-source voltage with 3.8A continuous drain current. The device is housed in a 6-WLCSP (1x1.5mm) surface mount package and is designed for low-power switching applications requiring compact form factors.

The FDZ197PZ carries an Obsolete product status. Locating equivalent and substitute components is necessary to support ongoing production requirements, maintenance operations, and design continuity for systems currently utilizing this device.

Substiute Parts

FDZ197PZ

onsemiIn Stock: 8770FDZ197PZ Datasheet

Current PartRFQ

PMCM4402UPEZ

Nexperia USA Inc.In Stock: 17191PMCM4402UPEZ Datasheet

SimilarRFQ

SSM6J771G,LF

Toshiba Semiconductor and StorageIn Stock: 880SSM6J771G,LF Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the FDZ197PZ is determined by the following critical parameters:

Electrical Compatibility Requirements:

• FET Type: P-Channel (required match)
• Drain to Source Voltage (Vdss): 20V minimum (equal or higher acceptable)
• Continuous Drain Current (Id): 3.8A minimum at 25°C (equal or higher acceptable)
• Gate Charge (Qg): Lower values preferred for switching speed; higher values acceptable if within application tolerance
• On-Resistance (Rds On): Lower values preferred for efficiency; higher values acceptable if within application tolerance

Physical and Environmental Compatibility Requirements:

• Mounting Type: Surface Mount (required match)
• Package Category: WLCSP/UFBGA (same family acceptable)
• RoHS Status: ROHS3 Compliant (required match)
• Moisture Sensitivity Level: MSL 1 (required match)
• Operating Temperature: -55°C to 150°C minimum (equal or wider range acceptable)

Identified Substitutes:

The following parts meet the electrical and environmental criteria for substitution:

1. PMCM4402UPEZ (Nexperia USA Inc.) — Meets Vdss and Id requirements; reduced package footprint; lower gate charge; lower power dissipation
2. SSM6J771G,LF (Toshiba Semiconductor and Storage) — Exceeds Vdss and Id requirements; improved on-resistance; active product status; wider gate voltage range

Parameter Comparison

Engineering Selection Recommendations

PMCM4402UPEZ (Nexperia USA Inc.):

This substitute provides electrical equivalence with improved current handling (4.2A vs. 3.8A) and significantly reduced gate charge (6.2nC vs. 25nC), enabling faster switching transitions. The 4-WLCSP package offers a smaller footprint (0.78x0.78mm) compared to the original 6-WLCSP (1x1.5mm), which may require PCB layout modifications. Both devices maintain ROHS3 compliance and MSL 1 rating. The Obsolete product status of both parts indicates limited long-term availability.

SSM6J771G,LF (Toshiba Semiconductor and Storage):

This substitute exceeds the electrical specifications of the FDZ197PZ with higher continuous drain current (5A vs. 3.8A) and superior on-resistance (31mOhm vs. 64mOhm), resulting in improved thermal efficiency. The device supports a wider gate voltage range (±12V vs. ±8V) and maintains the same 6-WLCSP package family, minimizing PCB layout changes. Critically, this part carries Active product status, ensuring ongoing availability and supply chain continuity. ROHS3 compliance and MSL 1 rating are maintained.

Frequently Asked Questions (FAQ)

Q: Can the PMCM4402UPEZ be used as a direct replacement for the FDZ197PZ?

A: The PMCM4402UPEZ meets all electrical requirements (20V Vdss, 4.2A Id, P-Channel configuration) and environmental compliance standards. However, the package footprint differs (4-WLCSP 0.78x0.78mm vs. 6-WLCSP 1x1.5mm), requiring PCB layout verification and potential redesign of the component placement area.

Q: What are the advantages of using SSM6J771G,LF over the original FDZ197PZ?

A: The SSM6J771G,LF provides superior electrical performance with 5A continuous drain current (vs. 3.8A), lower on-resistance (31mOhm vs. 64mOhm), and Active product status ensuring long-term availability. The 6-WLCSP package maintains compatibility with existing PCB layouts designed for the FDZ197PZ.

Q: Are there package compatibility concerns when substituting these parts?

A: The FDZ197PZ and SSM6J771G,LF both use 6-WLCSP packages and are mechanically compatible. The PMCM4402UPEZ uses a smaller 4-WLCSP package (0.78x0.78mm vs. 1x1.5mm), which may require PCB footprint modifications and requalification of solder reflow profiles.

Q: Do all substitute parts maintain the same compliance certifications?

A: Yes. The FDZ197PZ, PMCM4402UPEZ, and SSM6J771G,LF all carry ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity ratings, ensuring compatibility with standard manufacturing and storage protocols.

Q: Why is product status relevant when selecting a substitute?

A: Product status indicates supply chain availability. The FDZ197PZ and PMCM4402UPEZ are Obsolete, meaning production has ended and inventory is limited. The SSM6J771G,LF carries Active status, indicating ongoing manufacture and reliable long-term availability for production and maintenance applications.

Q: What is the significance of gate charge differences between these parts?

A: Gate charge (Qg) affects switching speed and driver circuit requirements. The PMCM4402UPEZ has lower gate charge (6.2nC vs. 25nC), enabling faster switching with lower driver power consumption. The SSM6J771G,LF has moderate gate charge (9.8nC), balancing switching speed with driver simplicity.

Q: Can thermal performance differences affect circuit design?

A: Yes. The PMCM4402UPEZ has lower power dissipation (0.4W vs. 1.9W), reducing thermal load. The SSM6J771G,LF has lower on-resistance (31mOhm vs. 64mOhm), resulting in reduced conduction losses and improved thermal efficiency. Circuit thermal analysis should account for these differences when operating at maximum current levels.