FDZ1905PZ MOSFET Equivalent & Substitute Parts

Part Overview

The FDZ1905PZ is a dual P-Channel MOSFET array manufactured by onsemi, designed for surface mount applications in the PowerTrench® series. This component integrates two P-Channel MOSFETs in a compact 6-WLCSP (1x1.5mm) package with a maximum power dissipation of 900mW and logic level gate operation.

The onsemi FDZ1905PZ is currently listed as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this dual P-Channel MOSFET configuration.

Substiute Parts

FDZ1905PZ
onsemiIn Stock: 19546FDZ1905PZ Datasheet
FDZ1905PZ
Current Part
FDZ1905PZ
Fairchild SemiconductorIn Stock: 19574FDZ1905PZ Datasheet
FDZ1905PZ
Direct

Key Parameters

Parameter Value Unit
Configuration 2 P-Channel (Dual)
Package Type 6-WLCSP (1x1.5)
Rds On (Max) @ Id, Vgs 126mOhm @ 1A, 4.5V mOhm
Vgs(th) (Max) @ Id 1V @ 250µA V
Power - Max 900mW mW
Operating Temperature Range -55°C to 150°C (TJ) °C
FET Feature Logic Level Gate
Mounting Type Surface Mount
Technology MOSFET (Metal Oxide)
Series PowerTrench®

Substitute Part Grouping Explanation

Substitution of the FDZ1905PZ is determined by strict equivalence across the following critical parameters:

Configuration Match: The substitute part must be a 2 P-Channel (Dual) MOSFET to maintain functional compatibility with existing circuit designs.

Package Compatibility: The substitute must use the 6-WLCSP (1x1.5mm) package to ensure mechanical and electrical compatibility with printed circuit board layouts and reflow soldering processes.

Electrical Performance: The substitute must meet or exceed the specified Rds On (Max) of 126mOhm @ 1A, 4.5V and Vgs(th) (Max) of 1V @ 250µA to maintain circuit performance characteristics.

Power Dissipation: The substitute must support the 900mW maximum power rating to ensure thermal stability in the intended application.

Operating Temperature Range: The substitute must support the -55°C to 150°C (TJ) operating temperature range to function across the full environmental specification.

Gate Feature: The substitute must feature logic level gate operation to maintain compatibility with standard digital control signals.

Parameter Comparison

Parameter FDZ1905PZ (onsemi) FDZ1905PZ (Fairchild Semiconductor)
Manufacturer onsemi Fairchild Semiconductor
Product Status Obsolete Active
Configuration 2 P-Channel (Dual) 2 P-Channel (Dual)
Package / Case 6-UFBGA, WLCSP 6-UFBGA, WLCSP
Supplier Device Package 6-WLCSP (1x1.5) 6-WLCSP (1x1.5)
Rds On (Max) @ Id, Vgs 126mOhm @ 1A, 4.5V 126mOhm @ 1A, 4.5V
Vgs(th) (Max) @ Id 1V @ 250µA 1V @ 250µA
Power - Max 900mW 900mW
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide)
FET Feature Logic Level Gate Logic Level Gate
Series PowerTrench® PowerTrench®

Engineering Selection Recommendations

The FDZ1905PZ manufactured by Fairchild Semiconductor is a direct equivalent substitute for the obsolete onsemi FDZ1905PZ. Both parts share identical electrical specifications, package geometry, and functional characteristics across all provided parameters.

The Fairchild Semiconductor variant maintains active product status, ensuring ongoing availability and supply chain support. Both versions comply with RoHS3 requirements and carry REACH unaffected status, supporting regulatory compliance in manufacturing environments.

Selection of the Fairchild Semiconductor FDZ1905PZ is appropriate for new production runs, design refreshes, and replacement of obsolete inventory. The identical electrical and mechanical specifications ensure direct substitution without circuit redesign or board layout modification.

Frequently Asked Questions (FAQ)

Q: Can the Fairchild Semiconductor FDZ1905PZ directly replace the onsemi FDZ1905PZ in existing designs?

A: Yes. Both parts are electrically and mechanically identical across all specified parameters, including package type, pin configuration, Rds On, Vgs(th), power rating, and operating temperature range. Direct substitution is supported without circuit modification.

Q: What is the significance of the 6-WLCSP (1x1.5mm) package specification?

A: The 6-WLCSP package is a wafer-level chip-scale package with specific footprint dimensions of 1x1.5mm. This package type determines PCB layout compatibility, solder reflow requirements, and thermal management characteristics. Substitute parts must use this identical package to ensure mechanical fit and electrical performance.

Q: Are there differences in compliance or regulatory status between the two manufacturers?

A: Both the onsemi and Fairchild Semiconductor versions are RoHS3 compliant and REACH unaffected. The ECCN and HTSUS codes differ between manufacturers due to administrative classification, but both parts meet equivalent regulatory requirements for industrial and commercial applications.

Q: Why is the onsemi FDZ1905PZ listed as obsolete?

A: Product obsolescence reflects manufacturer discontinuation decisions. The Fairchild Semiconductor equivalent maintains active status and provides continuity for applications requiring this dual P-Channel MOSFET configuration.

Q: What parameters must remain constant when selecting a substitute for the FDZ1905PZ?

A: Critical parameters include dual P-Channel configuration, 6-WLCSP (1x1.5mm) package, 126mOhm Rds On specification, 1V Vgs(th), 900mW power rating, -55°C to 150°C operating temperature range, and logic level gate feature. Deviation from any of these parameters indicates incompatibility.

Q: Is the PowerTrench® series designation important for substitution?

A: The PowerTrench® series designation indicates the underlying MOSFET technology platform used by both manufacturers. Maintaining this series consistency supports equivalent electrical performance and thermal characteristics.

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