FDU8796 Equivalent & Substitute Parts

Part Overview

The FDU8796 is an N-Channel MOSFET manufactured by onsemi, rated for 25V drain-to-source voltage with a continuous drain current of 35A at 25°C. This device features the PowerTrench® series technology and is housed in a Through Hole I-PAK (TO-251-3) package. The FDU8796 is classified as obsolete, making identification of equivalent substitute parts essential for ongoing design support and component procurement. Substitute parts must maintain electrical performance specifications while accommodating alternative packaging configurations.

Substiute Parts

FDU8796

onsemiIn Stock: 15263FDU8796 Datasheet

Current PartRFQ

FDD8796

Fairchild SemiconductorIn Stock: 16002FDD8796 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the FDU8796 is determined by electrical parameter equivalence across the following critical specifications:

Electrical Equivalence Criteria:

• Drain-to-Source Voltage (Vdss): 25V
• Continuous Drain Current (Id): 35A at 25°C
• On-State Resistance (Rds On): 5.7 mOhm @ 35A, 10V
• Gate Charge (Qg): 52 nC @ 10V
• Input Capacitance (Ciss): 2610 pF @ 13V
• Power Dissipation: 88W (Tc)
• Operating Temperature Range: -55°C to 175°C

Mechanical Compatibility: Substitute parts must be evaluated for package type compatibility. The FDU8796 uses Through Hole I-PAK mounting; substitutes may employ Surface Mount packaging, requiring circuit board redesign and thermal management reassessment.

The FDD8796 manufactured by Fairchild Semiconductor meets all electrical parameter requirements and is classified as Active product status, providing long-term availability assurance.

Parameter Comparison

Engineering Selection Recommendations

FDD8796 (Fairchild Semiconductor) Substitution Basis:

The FDD8796 is electrically equivalent to the FDU8796 across all specified electrical parameters, including voltage rating, current capacity, on-state resistance, gate charge, and thermal characteristics. Both devices are manufactured using PowerTrench® technology and share identical performance specifications.

Critical Consideration—Packaging Transition:

The primary distinction between these parts is the mounting technology. The FDU8796 employs Through Hole I-PAK (TO-251-3) configuration, while the FDD8796 uses Surface Mount TO-252 (DPAK) packaging. This difference requires circuit board layout modification and thermal management reassessment. The TO-252 DPAK package includes a tab for thermal coupling to PCB ground planes, which may alter thermal performance characteristics compared to the Through Hole configuration.

Product Status Advantage:

The FDD8796 maintains Active product status with Fairchild Semiconductor, ensuring continued availability and manufacturing support. The FDU8796 is classified as Obsolete, making the FDD8796 the appropriate long-term substitute for new designs and ongoing production requirements.

Compliance Alignment:

Both parts share identical ECCN (EAR99) and HTSUS (8541.29.0095) classifications, confirming regulatory equivalence for export and procurement purposes.

Frequently Asked Questions (FAQ)

Q: Can the FDD8796 directly replace the FDU8796 in existing circuit designs?

A: Electrical substitution is valid; however, packaging differences require circuit board redesign. The FDD8796 uses Surface Mount TO-252 (DPAK) packaging versus the Through Hole TO-251-3 (I-PAK) of the FDU8796. PCB layout modifications and thermal management verification are necessary.

Q: Are the electrical performance characteristics identical between FDU8796 and FDD8796?

A: Yes. Both devices share identical specifications for Vdss (25V), Id (35A), Rds On (5.7 mOhm @ 35A, 10V), gate charge (52 nC), input capacitance (2610 pF), power dissipation (88W), and operating temperature range (-55°C to 175°C).

Q: What is the significance of the different package types?

A: The FDU8796 (Through Hole I-PAK) and FDD8796 (Surface Mount DPAK) require different PCB assembly processes and thermal management approaches. The DPAK includes a tab for direct thermal coupling to PCB ground planes, potentially offering improved thermal performance in surface mount applications.

Q: Why is the FDU8796 classified as Obsolete?

A: The FDU8796 is no longer in active production by onsemi. The FDD8796 (Active status) represents the current equivalent offering from Fairchild Semiconductor, ensuring long-term component availability.

Q: Are there any compliance or regulatory differences between these parts?

A: No. Both parts share identical ECCN (EAR99) and HTSUS (8541.29.0095) classifications, confirming regulatory equivalence.

Q: What thermal considerations apply when transitioning from Through Hole to Surface Mount packaging?

A: The TO-252 DPAK package provides a tab for direct thermal coupling to PCB copper planes, which may improve heat dissipation compared to Through Hole mounting. Thermal analysis specific to the target application and PCB design is required to confirm adequate thermal performance.

Q: Is the FDD8796 suitable for new product designs?

A: Yes. The FDD8796 is classified as Active product status, making it appropriate for new designs requiring 25V, 35A N-Channel MOSFET functionality. Surface Mount packaging is standard in modern PCB assembly processes.