FDS6688 N-Channel MOSFET 30V 16A Equivalent & Substitute Parts

Part Overview

The FDS6688 is an N-Channel MOSFET manufactured by onsemi, rated for 30V drain-to-source voltage with 16A continuous drain current at 25°C. This device is part of the PowerTrench® series and is housed in an 8-SOIC surface mount package. The FDS6688 is classified as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement continuity. Substitute parts must maintain electrical compatibility across voltage ratings, current handling, and thermal characteristics while accommodating available packaging options.

Key Parameters

Parameter	FDS6688 Value	Unit
Drain to Source Voltage (Vdss)	30	V
Continuous Drain Current (Id) @ 25°C	16	A
Rds On (Max) @ 16A, 10V	6	mOhm
Gate Threshold Voltage (Vgs(th)) @ 250µA	3	V
Gate Charge (Qg) @ 5V	56	nC
Power Dissipation (Max)	2.5	W
Operating Temperature Range	-55 to 175	°C
Package Type	8-SOIC	—
Mounting Type	Surface Mount	—

Substitute Part Grouping Explanation

Substitution eligibility for the FDS6688 is determined by the following critical parameters:

Primary Compatibility Criteria:

Drain to Source Voltage (Vdss): Must equal or exceed 30V
Continuous Drain Current (Id): Must equal or exceed 16A at 25°C
Package Type: Surface mount 8-pin configurations (8-SOIC, 8-SOP, 8-DSO acceptable)
FET Type: N-Channel MOSFET technology
Gate Voltage (Vgs): Maximum rating must accommodate ±20V

Secondary Compatibility Criteria:

Rds On (Max): Lower or equal values indicate improved performance
Gate Charge (Qg): Lower values reduce switching losses
Power Dissipation: Equal or higher ratings ensure thermal compatibility
Operating Temperature: Minimum -55°C and maximum ≥150°C required

The following parts meet these criteria and are grouped by electrical performance characteristics:

Group 1 - Direct Current Rating Match (16A):

FDS8896 (onsemi): 15A rated, active status
DMN3010LSS-13 (Diodes Incorporated): 16A rated, active status
BSO040N03MSGXUMA1 (Infineon Technologies): 16A rated, not for new designs

Group 2 - Enhanced Current Rating (18A):

FDS8870 (onsemi): 18A rated, active status

Group 3 - Different Voltage/Current Class:

PH6325L,115 (Nexperia USA Inc.): 25V/78.7A, different application class

Parameter Comparison

Parameter	FDS6688	FDS8870	FDS8896	BSO040N03MSGXUMA1	DMN3010LSS-13
Manufacturer	onsemi	onsemi	onsemi	Infineon	Diodes Inc.
Vdss (V)	30	30	30	30	30
Id @ 25°C (A)	16	18	15	16	16
Rds On @ 10V (mOhm)	6	4.2	6	4	9
Vgs(th) @ 250µA (V)	3	2.5	2.5	2	2
Gate Charge @ 10V (nC)	56	112	67	73	43.7
Power Dissipation (W)	2.5	2.5	2.5	1.56	2.5
Operating Temp (°C)	-55 to 175	-55 to 150	-55 to 150	-55 to 150	-55 to 150
Package	8-SOIC	8-SOIC	8-SOIC	PG-DSO-8	8-SOP
Product Status	Obsolete	Active	Active	Not For New Designs	Active
RoHS Status	—	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

Recommended Primary Substitutes (Active Status):

FDS8896 (onsemi) - Preferred for direct replacement in existing designs. Maintains identical 30V/15A electrical class with same 8-SOIC package footprint. Active product status ensures long-term availability. ROHS3 compliant. Gate charge of 67 nC is marginally higher than FDS6688 (56 nC), resulting in slightly increased switching losses. Rds On matches the original specification at 6 mOhm.

DMN3010LSS-13 (Diodes Incorporated) - Alternative substitute with 16A rating matching the original device. Active product status and ROHS3 compliance. Package is 8-SOP, requiring PCB layout verification for pin compatibility. Rds On is 9 mOhm, higher than FDS6688, resulting in increased conduction losses. Gate charge of 43.7 nC is lower, reducing switching losses. Suitable for applications where package footprint can be accommodated.

FDS8870 (onsemi) - Enhanced current rating of 18A provides design margin above the 16A requirement. Active product status and ROHS3 compliant. Rds On of 4.2 mOhm is superior to FDS6688, reducing conduction losses. Gate charge of 112 nC is significantly higher, increasing switching losses. Operating temperature maximum reduced to 150°C. Suitable for high-current applications requiring improved efficiency.

Not Recommended for New Designs:

BSO040N03MSGXUMA1 (Infineon Technologies) - Classified as "Not For New Designs." While electrical parameters are compatible, this status indicates Infineon has discontinued support for new applications. Package is PG-DSO-8, differing from standard 8-SOIC. Power dissipation of 1.56W is lower than FDS6688, but this reflects different thermal measurement conditions. MSL rating of 3 (168 Hours) requires controlled moisture handling compared to MSL 1 of other options.

Compliance and Certification:

All recommended active substitutes carry ROHS3 compliance and REACH Unaffected status, matching the regulatory profile of the FDS6688. Moisture sensitivity levels are MSL 1 (Unlimited) for FDS8896 and DMN3010LSS-13, providing standard handling conditions. All parts are classified under ECCN EAR99 and HTSUS 8541.29.0095.

Frequently Asked Questions (FAQ)

Q: Can FDS8896 be used as a direct drop-in replacement for FDS6688?

A: FDS8896 is electrically compatible as a substitute. Both devices share 30V Vdss rating, 8-SOIC package, and similar Rds On characteristics at 6 mOhm. The 15A continuous current rating of FDS8896 is slightly lower than FDS6688's 16A, but remains within acceptable operating margins for most applications. Gate charge is marginally higher (67 nC vs. 56 nC), resulting in minimal switching loss increase. PCB layout and thermal design do not require modification.

Q: What is the difference between 8-SOIC and 8-SOP packages?

A: Both are 8-pin surface mount packages with similar footprints (0.154" width, 3.90mm). The primary difference is pin pitch and lead geometry. 8-SOIC uses gull-wing leads with tighter spacing, while 8-SOP uses similar geometry. For DMN3010LSS-13 (8-SOP), verify PCB pad layout compatibility with your existing design. Pin assignments must be confirmed against device datasheets to ensure correct gate, drain, and source connections.

Q: Why does FDS8870 have higher gate charge than FDS6688?

A: Gate charge (Qg) is proportional to the device's input capacitance and is measured at a specific gate voltage. FDS8870's higher gate charge of 112 nC (measured at 10V) versus FDS6688's 56 nC (measured at 5V) reflects the different measurement conditions and the device's larger die size supporting 18A current. Higher gate charge increases the time and energy required to switch the device, resulting in higher switching losses. This trade-off is acceptable in applications where the improved current rating and lower Rds On provide overall efficiency benefits.

Q: Is DMN3010LSS-13 suitable for high-frequency switching applications?

A: DMN3010LSS-13 has a lower gate charge of 43.7 nC, which is advantageous for high-frequency switching by reducing switching losses. However, its Rds On of 9 mOhm is higher than FDS6688 (6 mOhm), increasing conduction losses. The net efficiency impact depends on the specific switching frequency and duty cycle. For frequencies above 100 kHz, the reduced gate charge may offset the higher Rds On penalty. Thermal analysis is recommended to confirm suitability for your application.

Q: Can I use BSO040N03MSGXUMA1 in new product designs?

A: BSO040N03MSGXUMA1 is classified as "Not For New Designs" by Infineon Technologies. This designation indicates the manufacturer is not supporting new applications with this part. While the device is electrically compatible with FDS6688, using it in new designs creates long-term supply chain risk and limits manufacturer support. FDS8896 or DMN3010LSS-13 are preferred alternatives for new designs due to their active product status.

Q: What is the impact of operating temperature differences on substitute selection?

A: FDS6688 operates from -55°C to 175°C, while FDS8870, FDS8896, and DMN3010LSS-13 operate from -55°C to 150°C. If your application requires operation above 150°C, FDS6688 is the only option among these substitutes. For applications with maximum operating temperature at or below 150°C, all substitutes are acceptable. Verify your thermal design to confirm the maximum junction temperature does not exceed the device rating.

Q: Are there inventory considerations when selecting a substitute?

A: FDS6688 has 80,399 pcs in stock (obsolete status). FDS8896 has 45,355 pcs available, FDS8870 has 4,706 pcs, and DMN3010LSS-13 has 15,465 pcs. For high-volume production, FDS8896 offers the best inventory availability among active substitutes. FDS8870's lower inventory may impact lead times for large orders. Confirm supplier availability and lead times for your procurement timeline before finalizing part selection.

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