FDS6375 Equivalent & Substitute Parts

Part Overview

The FDS6375 is an active P-Channel MOSFET manufactured by onsemi, rated for 20V drain-to-source voltage with 8A continuous drain current at 25°C. The device is housed in an 8-SOIC surface mount package and features PowerTrench® technology. This part is compliant with RoHS3 and REACH regulations, with unlimited moisture sensitivity level (MSL 1).

Substitute parts are identified when equivalent electrical performance can be achieved within the specified parameter ranges, allowing for component interchangeability in circuit applications where the FDS6375 may be unavailable or when alternative sourcing is required.

Substiute Parts

FDS6375

onsemiIn Stock: 80400FDS6375 Datasheet

Current PartRFQ

DMP2066LSS-13

Diodes IncorporatedIn Stock: 27496DMP2066LSS-13 Datasheet

SimilarRFQ

IRF7240TRPBF

Infineon TechnologiesIn Stock: 4085IRF7240TRPBF Datasheet

SimilarRFQ

PJL9411_R2_00001

Panjit International Inc.In Stock: 3416PJL9411_R2_00001 Datasheet

SimilarRFQ

SI4459ADY-T1-GE3

Vishay SiliconixIn Stock: 35233SI4459ADY-T1-GE3 Datasheet

SimilarRFQ

TPS1100D

Texas InstrumentsIn Stock: 1376TPS1100D Datasheet

SimilarRFQ

TPS1100DR

Texas InstrumentsIn Stock: 5133TPS1100DR Datasheet

SimilarRFQ

TPS1101D

Texas InstrumentsIn Stock: 2191TPS1101D Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the FDS6375 are classified based on the following critical electrical and mechanical parameters:

Primary Substitution Criteria:

• FET Type: P-Channel (required match)
• Package / Case: 8-SOIC or 8-SO compatible footprint (required match)
• Drain to Source Voltage (Vdss): Equal to or greater than 20V
• Current - Continuous Drain (Id) @ 25°C: Equal to or greater than 8A
• Mounting Type: Surface Mount (required match)
• RoHS Status: ROHS3 Compliant (required match)

Secondary Compatibility Parameters:

• Rds On (Max): Lower or equal values indicate improved performance
• Operating Temperature Range: Must encompass application requirements
• Power Dissipation (Max): Must support thermal requirements
• Gate Charge (Qg): Affects switching speed and drive requirements
• Vgs(th) and Vgs (Max): Must be compatible with gate drive circuitry

Substitute parts are grouped into two categories: Direct Substitutes (matching or exceeding all primary criteria with minimal parameter variance) and Functional Alternatives (meeting primary criteria with notable parameter differences that may require circuit evaluation).

Parameter Comparison

Engineering Selection Recommendations

Direct Substitutes (Recommended for Pin-Compatible Replacement):

DMP2066LSS-13 (Diodes Incorporated) meets the primary substitution criteria with matching 20V Vdss rating and 6.5A continuous drain current. The device is housed in an 8-SOIC package with ROHS3 compliance and MSL 1 rating. The higher Rds On value (40 mOhm vs. 24 mOhm) results in increased power dissipation under identical load conditions. Operating temperature range extends to 150°C, which is lower than the FDS6375 maximum of 175°C. This part is suitable for applications where the 6.5A current rating is sufficient and thermal management accommodates the higher on-resistance.

Functional Alternatives (Evaluate for Application Compatibility):

IRF7240TRPBF (Infineon Technologies) provides superior electrical performance with 40V Vdss rating and 10.5A continuous drain current. The significantly lower Rds On (15 mOhm) reduces power dissipation and improves efficiency. However, the higher gate charge (110 nC) and input capacitance (9250 pF) require evaluation of gate drive circuit capability. Operating temperature maximum is 150°C. This part is suitable for applications requiring higher voltage headroom and improved current handling.

PJL9411_R2_00001 (Panjit International Inc.) offers 30V Vdss rating with 8.4A continuous drain current and 20 mOhm Rds On. Power dissipation is reduced to 1.7W, and gate charge is minimal at 11 nC. Operating temperature range is -55°C to 150°C. MSL rating is not applicable. This part is suitable for applications where lower power dissipation and reduced gate drive requirements are beneficial.

SI4459ADY-T1-GE3 (Vishay Siliconix) provides the highest current capability at 29A continuous drain current with 30V Vdss rating. The exceptionally low Rds On (5 mOhm) and high power dissipation rating (3.5W Ta, 7.8W Tc) support high-current applications. Gate charge is elevated at 195 nC. Operating temperature range is -55°C to 150°C. This part is suitable for high-current switching applications where the FDS6375 current rating is insufficient.

TPS1100D / TPS1100DR (Texas Instruments) and TPS1101D (Texas Instruments) are not recommended as direct substitutes. These parts feature 15V Vdss rating, which is below the FDS6375 specification. Current ratings are significantly lower (1.6A and 2.3A respectively). These parts are suitable only for applications with reduced voltage and current requirements.

Compliance and Certification:

All substitute parts maintain ROHS3 compliance and are active products with current manufacturing status. The FDS6375 operates to 175°C, providing the widest temperature range among the listed alternatives. Applications requiring operation above 150°C must retain the FDS6375 or evaluate thermal management strategies for alternative parts.

Frequently Asked Questions (FAQ)

Q: Can DMP2066LSS-13 directly replace FDS6375 in all applications?

A: DMP2066LSS-13 is pin-compatible and shares the same 8-SOIC package footprint. However, the 6.5A current rating is lower than the FDS6375 8A rating, and Rds On is higher (40 mOhm vs. 24 mOhm). Substitution is valid only when the application current requirement does not exceed 6.5A and thermal dissipation from the higher on-resistance is acceptable.

Q: What is the significance of Rds On differences between substitute parts?

A: Rds On (on-resistance) directly affects power dissipation and heat generation. Lower Rds On values reduce power loss and improve efficiency. For example, SI4459ADY-T1-GE3 with 5 mOhm Rds On dissipates significantly less power than FDS6375 with 24 mOhm at equivalent current levels. Higher Rds On values require enhanced thermal management or operation at reduced current levels.

Q: Are TPS1100D and TPS1101D suitable substitutes for FDS6375?

A: No. These Texas Instruments parts feature 15V Vdss rating, which is below the FDS6375 20V specification. Current ratings are also significantly lower (1.6A and 2.3A vs. 8A). These parts are suitable only for applications with reduced voltage and current requirements and cannot be used as direct substitutes.

Q: How does operating temperature range affect part selection?

A: FDS6375 operates from -55°C to 175°C, providing the widest temperature range. Most substitute parts operate to 150°C maximum. Applications requiring operation above 150°C must use FDS6375 or implement thermal management to keep junction temperature within the substitute part's rated range.

Q: What is the impact of gate charge (Qg) on circuit design?

A: Gate charge affects switching speed and gate drive circuit requirements. Lower gate charge (e.g., PJL9411_R2_00001 at 11 nC) requires less drive current and enables faster switching. Higher gate charge (e.g., SI4459ADY-T1-GE3 at 195 nC) requires more robust gate drive circuitry. Gate drive circuit capability must be verified before substitution.

Q: Can parts with higher Vdss rating replace FDS6375?

A: Yes, parts with higher Vdss ratings (e.g., IRF7240TRPBF at 40V, PJL9411_R2_00001 at 30V, SI4459ADY-T1-GE3 at 30V) can replace FDS6375 in 20V applications. Higher voltage rating provides additional safety margin. However, other parameters such as current rating, Rds On, and gate charge must be evaluated for circuit compatibility.

Q: What packaging considerations apply to these substitute parts?

A: All listed substitute parts use 8-SOIC or 8-SO surface mount packages with 0.154" (3.90mm) width, ensuring PCB footprint compatibility. Packaging differences (Cut Tape vs. Tape & Reel) affect supply and handling but do not impact electrical performance or board-level compatibility.

Q: How should I evaluate power dissipation when substituting parts?

A: Power dissipation is calculated as P = I²R (where I is drain current and R is Rds On). Compare dissipation at the actual operating current of the application. For example, at 8A operation, FDS6375 dissipates 1.536W (8² × 0.024), while DMP2066LSS-13 dissipates 2.56W (8² × 0.040). Thermal design must accommodate the higher dissipation of substitute parts with higher Rds On values.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All listed substitute parts are ROHS3 compliant and meet REACH requirements. Moisture sensitivity level (MSL) is 1 (Unlimited) for most parts, with PJL9411_R2_00001 listed as Not Applicable. This ensures compatibility with standard PCB assembly processes.