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FDP8860 Equivalent & Substitute Parts
Part Overview
The FDP8860 is an N-Channel MOSFET manufactured by onsemi in the PowerTrench® series, rated for 30V drain-to-source voltage and 80A continuous drain current in a TO-220-3 through-hole package. The device is classified as obsolete, necessitating identification of equivalent and substitute components for ongoing design support and procurement continuity. Substitute parts must maintain electrical compatibility across voltage, current, and thermal specifications while accommodating the through-hole TO-220 package format.
Substiute Parts
Key Parameters
| Parameter | FDP8860 Specification |
|---|---|
| Drain-to-Source Voltage (Vdss) | 30 V |
| Continuous Drain Current (Id) @ 25°C | 80 A (Tc) |
| On-State Resistance (Rds On Max) @ Id, Vgs | 2.5 mOhm @ 80A, 10V |
| Gate Threshold Voltage (Vgs(th) Max) @ Id | 2.5 V @ 250 µA |
| Gate Charge (Qg Max) @ Vgs | 222 nC @ 10 V |
| Power Dissipation (Max) | 254 W (Tc) |
| Operating Temperature Range | -55°C to 175°C (TJ) |
| Package Type | TO-220-3 |
| Mounting Type | Through Hole |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution eligibility for the FDP8860 is determined by the following critical parameters:
Mandatory Compatibility Criteria:
- Drain-to-Source Voltage (Vdss): 30 V minimum
- Continuous Drain Current (Id): 80 A or greater
- Package Type: TO-220-3 or TO-220AB through-hole configuration
- Operating Temperature Range: -55°C to 175°C
- FET Type: N-Channel MOSFET
- Technology: Metal Oxide Semiconductor
Electrical Performance Considerations:
- On-State Resistance (Rds On): Lower or equivalent values ensure thermal performance
- Gate Charge (Qg): Lower values reduce switching losses
- Input Capacitance (Ciss): Lower values improve switching speed
- Gate Threshold Voltage (Vgs(th)): Compatibility with existing gate drive circuits
Regulatory Compliance:
- RoHS3 Compliance required
- REACH Unaffected status required
Substitute parts meeting these criteria are classified into two groups: direct replacements with equivalent or superior electrical performance, and functional alternatives with acceptable parameter variations for specific application contexts.
Parameter Comparison
| Parameter | FDP8860 | IRLB8314PBF | PSMN2R0-30PL,127 | PSMN4R3-30PL,127 | STP70NS04ZC |
|---|---|---|---|---|---|
| Manufacturer | onsemi | Infineon Technologies | Nexperia USA Inc. | Nexperia USA Inc. | STMicroelectronics |
| Vdss (V) | 30 | 30 | 30 | 30 | 33 |
| Id @ 25°C (A) | 80 | 171 | 100 | 100 | 80 |
| Rds On Max (mOhm) | 2.5 @ 80A, 10V | 2.4 @ 68A, 10V | 2.1 @ 15A, 10V | 4.3 @ 15A, 10V | 11 @ 40A, 10V |
| Vgs(th) Max (V) | 2.5 @ 250µA | 2.2 @ 100µA | 2.15 @ 1mA | 2.15 @ 1mA | 4 @ 1mA |
| Qg Max (nC) | 222 @ 10V | 60 @ 4.5V | 117 @ 10V | 41.5 @ 10V | 58 @ 10V |
| Ciss Max (pF) | 12240 @ 15V | 5050 @ 15V | 6810 @ 12V | 2400 @ 12V | 1930 @ 25V |
| Power Dissipation Max (W) | 254 | 125 | 211 | 103 | 180 |
| Operating Temperature (°C) | -55 to 175 | -55 to 175 | -55 to 175 | -55 to 175 | -55 to 175 |
| Package | TO-220-3 | TO-220-3 | TO-220AB | TO-220AB | TO-220 |
| Product Status | Obsolete | Active | Obsolete | Obsolete | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
Primary Substitute: IRLB8314PBF
The IRLB8314PBF from Infineon Technologies is the preferred substitute for the FDP8860. This device exceeds the minimum current specification at 171A continuous drain current, providing design margin for thermal and electrical performance. The IRLB8314PBF maintains the 30V Vdss rating and TO-220-3 package compatibility. Product status is active, ensuring long-term availability and supply chain stability. The device is ROHS3 compliant and REACH unaffected, meeting regulatory requirements. Gate charge is significantly lower at 60 nC compared to 222 nC, reducing switching losses in high-frequency applications. Input capacitance is reduced to 5050 pF, improving switching speed characteristics.
Secondary Substitutes: PSMN2R0-30PL,127 and PSMN4R3-30PL,127
Both Nexperia devices provide 100A continuous drain current, exceeding the FDP8860 specification. The PSMN2R0-30PL,127 offers superior on-state resistance at 2.1 mOhm and moderate gate charge at 117 nC. The PSMN4R3-30PL,127 provides the lowest input capacitance at 2400 pF and lowest gate charge at 41.5 nC, optimizing for switching speed applications. Both devices are classified as obsolete, limiting long-term procurement viability. Package designation is TO-220AB, which is mechanically compatible with TO-220-3 footprints in most applications.
Alternative Substitute: STP70NS04ZC
The STMicroelectronics STP70NS04ZC maintains 80A continuous drain current matching the FDP8860 specification. Vdss rating is 33V, providing additional voltage margin. Product status is active, supporting long-term availability. The TO-220 package is compatible with TO-220-3 footprints. On-state resistance is higher at 11 mOhm, and gate threshold voltage is elevated at 4V, requiring verification of gate drive circuit compatibility. This device is suitable for applications where voltage margin is prioritized over switching performance.
Frequently Asked Questions (FAQ)
Q: Can the IRLB8314PBF directly replace the FDP8860 without circuit modifications?
A: The IRLB8314PBF is electrically compatible with the FDP8860 across voltage and current specifications. The TO-220-3 package is identical. Gate threshold voltage is lower (2.2V vs. 2.5V), which is compatible with standard gate drive circuits. Gate charge is significantly lower, reducing switching losses. No circuit modifications are required for basic functionality.
Q: What is the difference between TO-220-3 and TO-220AB packages?
A: TO-220-3 and TO-220AB are mechanically compatible through-hole packages with identical pin configurations and thermal characteristics. Both accommodate three leads (Gate, Drain, Source) in the same physical footprint. PCB layout and heatsink mounting are interchangeable.
Q: Why is the PSMN4R3-30PL,127 recommended despite higher on-state resistance?
A: The PSMN4R3-30PL,127 is recommended for applications prioritizing switching speed and efficiency at lower current levels. Gate charge of 41.5 nC and input capacitance of 2400 pF are the lowest among substitutes, reducing switching losses in high-frequency converters. Higher on-state resistance (4.3 mOhm) is acceptable when continuous current remains below 80A.
Q: Is the STP70NS04ZC suitable for direct replacement in all applications?
A: The STP70NS04ZC is suitable for applications where gate drive circuits accommodate 4V threshold voltage and where higher on-state resistance (11 mOhm) does not exceed thermal limits. The 33V Vdss rating provides additional voltage margin. Verification of gate drive compatibility is required before implementation.
Q: What is the impact of lower gate charge on circuit performance?
A: Lower gate charge reduces the energy required to switch the MOSFET on and off, decreasing switching losses and improving efficiency in high-frequency applications. The IRLB8314PBF (60 nC) and PSMN4R3-30PL,127 (41.5 nC) provide significant switching loss reduction compared to the FDP8860 (222 nC).
Q: Are all substitute parts RoHS3 compliant?
A: All substitute parts listed are ROHS3 compliant and REACH unaffected, meeting regulatory requirements for electronic component procurement and environmental compliance.
Q: Which substitute offers the best thermal performance?
A: The FDP8860 itself provides the highest power dissipation rating at 254W. Among active substitutes, the IRLB8314PBF offers 125W dissipation with superior current handling at 171A. For equivalent 80A applications, the STP70NS04ZC provides 180W dissipation. Thermal performance depends on on-state resistance and application current levels.
Q: Can multiple substitute parts be used interchangeably in inventory?
A: Yes, the IRLB8314PBF, PSMN2R0-30PL,127, PSMN4R3-30PL,127, and STP70NS04ZC are electrically compatible substitutes. However, gate threshold voltage variations (2.15V to 4V) require verification of gate drive circuit compatibility. Standardizing on a single substitute part is recommended to minimize design validation effort.
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