FDP33N25 Equivalent & Substitute Parts

Part Overview

The FDP33N25 is an N-Channel MOSFET manufactured by onsemi, rated for 250V drain-to-source voltage with 33A continuous drain current at 25°C. This device is packaged in a Through Hole TO-220-3 configuration and is classified as Active product status. The FDP33N25 belongs to the UniFET™ series and is RoHS3 compliant.

Substitute parts are identified when equivalent electrical and mechanical parameters allow direct replacement in circuit applications. Substitutes for the FDP33N25 are selected based on matching or exceeding critical specifications including drain-to-source voltage rating, continuous drain current capability, gate drive voltage, package type, and operating temperature range.

Substiute Parts

FDP33N25

onsemiIn Stock: 1231FDP33N25 Datasheet

Current PartRFQ

RCX330N25

Rohm SemiconductorIn Stock: 1313RCX330N25 Datasheet

DirectRFQ

STP50NF25

STMicroelectronicsIn Stock: 4748STP50NF25 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the FDP33N25 are classified based on electrical parameter compatibility. The critical parameters that determine substitution eligibility are:

Mandatory Matching Parameters:

• Drain to Source Voltage (Vdss): 250V minimum
• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Mounting Type: Through Hole
• Package Category: TO-220 family

Performance Parameters:

• Continuous Drain Current (Id): Equal to or greater than 33A
• Drive Voltage: 10V gate drive capability
• Operating Temperature Range: Minimum -55°C to 150°C

Compliance Parameters:

• RoHS3 Compliant
• REACH Unaffected
• Active product status

The FDP33N25 has two identified substitutes: RCX330N25 (Rohm Semiconductor) and STP50NF25 (STMicroelectronics). Both devices meet the mandatory electrical and mechanical criteria for direct substitution.

Parameter Comparison

Engineering Selection Recommendations

RCX330N25 (Rohm Semiconductor): The RCX330N25 provides electrical equivalence to the FDP33N25 with matching 250V Vdss and 33A continuous drain current ratings. Both devices operate at 10V gate drive voltage and are RoHS3 compliant with Active product status. The RCX330N25 is packaged in TO-220FM (Full Pack variant), which is mechanically compatible with TO-220-3 footprints. This substitute is suitable for direct replacement in applications where the FDP33N25 is specified, provided thermal management accommodates the lower power dissipation rating of 40W (Tc) compared to the original 235W (Tc).

STP50NF25 (STMicroelectronics): The STP50NF25 exceeds the FDP33N25 specifications with a higher continuous drain current rating of 45A at 25°C, while maintaining the same 250V Vdss rating and 10V gate drive voltage. This device is RoHS3 compliant and Active status. The STP50NF25 operates across the full temperature range of -55°C to 150°C, matching the FDP33N25. The lower on-resistance of 69mOhm (at 22A, 10V) compared to 94mOhm (at 16.5A, 10V) provides improved thermal performance. The STP50NF25 is suitable for applications requiring higher current capacity or improved efficiency characteristics.

Both substitutes maintain compliance certifications (RoHS3, REACH Unaffected, EAR99) and are available in Active product status.

Frequently Asked Questions (FAQ)

Q: Can the RCX330N25 be used as a direct replacement for the FDP33N25?

A: The RCX330N25 provides electrical equivalence with matching 250V Vdss and 33A continuous drain current ratings. Both devices use 10V gate drive voltage and are RoHS3 compliant. The TO-220FM package is mechanically compatible with TO-220-3 footprints. Thermal design must account for the RCX330N25 power dissipation rating of 40W (Tc) versus the FDP33N25 rating of 235W (Tc).

Q: What are the advantages of using the STP50NF25 over the FDP33N25?

A: The STP50NF25 provides higher continuous drain current capability at 45A compared to 33A, and lower on-resistance at 69mOhm versus 94mOhm. Both devices maintain 250V Vdss rating and 10V gate drive voltage. The STP50NF25 operates across the full -55°C to 150°C temperature range. These characteristics result in improved current handling and reduced power dissipation in high-current applications.

Q: Are the TO-220-3 and TO-220FM packages pin-compatible?

A: The TO-220FM (Full Pack) is a variant of the TO-220-3 package family and maintains mechanical and electrical pin compatibility for Through Hole mounting applications. Both packages accommodate standard TO-220 footprints on printed circuit boards.

Q: What is the maximum gate voltage for each substitute?

A: The FDP33N25 and RCX330N25 both support ±30V maximum gate voltage. The STP50NF25 supports ±20V maximum gate voltage. Gate drive circuits must operate within these specified limits.

Q: Do all three devices meet RoHS3 compliance requirements?

A: Yes. The FDP33N25, RCX330N25, and STP50NF25 are all RoHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards for electronic components.

Q: How do the input capacitance values compare between devices?

A: The FDP33N25 has input capacitance of 2135 pF at 25V. The STP50NF25 has input capacitance of 2670 pF at 25V. The RCX330N25 input capacitance is not specified in available documentation. Higher input capacitance may affect gate drive circuit design and switching speed characteristics.