FDP032N08-F102 Equivalent & Substitute Parts

Part Overview

The FDP032N08-F102 is an N-Channel MOSFET manufactured by onsemi, rated for 75V drain-to-source voltage and 120A continuous drain current in a Through Hole TO-220 package. This device is designed for high-current switching applications requiring robust thermal performance with a maximum power dissipation of 375W at the case temperature. The part is Active in product status and RoHS3 compliant.

Equivalent and substitute parts are identified when design requirements necessitate alternative sourcing, inventory constraints, or when specific performance characteristics align with application parameters. Substitution eligibility is determined by matching critical electrical specifications including voltage rating, current capacity, on-resistance characteristics, and thermal performance within defined operating ranges.

Substiute Parts

FDP032N08-F102
onsemiIn Stock: 947FDP032N08-F102 Datasheet
FDP032N08-F102
Current Part
FDP032N08
onsemiIn Stock: 1858FDP032N08 Datasheet
FDP032N08
Parametric Equivalent
IRFB3077PBF
Infineon TechnologiesIn Stock: 36490IRFB3077PBF Datasheet
IRFB3077PBF
Direct
AOT266L
Alpha & Omega Semiconductor Inc.In Stock: 2097AOT266L Datasheet
AOT266L
Similar
IXTP260N055T2
IXYSIn Stock: 32874IXTP260N055T2 Datasheet
IXTP260N055T2
Similar

Key Parameters

Parameter Value Unit
FET Type N-Channel
Technology MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 75 V
Current - Continuous Drain (Id) @ 25°C 120 A (Tc)
Rds On (Max) @ Id, Vgs 3.2 mOhm @ 75A, 10V
Drive Voltage (Max Rds On) 10 V
Vgs(th) (Max) @ Id 4.5 V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 220 nC @ 10V
Vgs (Max) ±20 V
Input Capacitance (Ciss) (Max) @ Vds 15160 pF @ 25V
Power Dissipation (Max) 375 W (Tc)
Operating Temperature -55 to 175 °C (TJ)
Mounting Type Through Hole
Package / Case TO-220-3
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the FDP032N08-F102 are classified into two categories based on electrical parameter alignment:

Parametric Equivalent: Parts that match all critical electrical specifications within the same voltage and current class, enabling direct functional replacement without circuit modification.

Direct Manufacturer Equivalent: Parts from alternative manufacturers that meet or exceed the primary electrical specifications (Vdss, Id, Rds On, thermal performance) while maintaining compatible package form factors and operating characteristics.

Similar Performance Parts: Parts with modified voltage or current ratings that operate within acceptable application ranges but require engineering evaluation for specific use cases.

Substitution eligibility is determined by the following key parameters:

  • Drain-to-Source Voltage (Vdss) rating equal to or greater than 75V
  • Continuous Drain Current (Id) at or above 120A
  • On-Resistance (Rds On) at 10V gate drive voltage
  • Gate threshold voltage (Vgs(th)) compatibility
  • Operating temperature range encompassing -55°C to 175°C
  • Through Hole TO-220 package configuration
  • RoHS3 compliance status

Parameter Comparison

Parameter FDP032N08-F102 FDP032N08 IRFB3077PBF AOT266L IXTP260N055T2
Manufacturer onsemi onsemi Infineon Technologies Alpha & Omega Semiconductor Inc. IXYS
Vdss (V) 75 75 75 60 55
Id @ 25°C (A) 120 120 120 140 (Tc) 260
Rds On (Max) @ 10V (mOhm) 3.2 @ 75A 3.2 @ 75A 3.3 @ 75A 3.5 @ 20A 3.3 @ 50A
Vgs(th) (Max) @ 250µA (V) 4.5 4.5 4 3.2 4
Gate Charge (Qg) @ 10V (nC) 220 220 220 90 140
Ciss (Max) @ Vds (pF) 15160 @ 25V 15160 @ 25V 9400 @ 50V 5650 @ 30V 10800 @ 25V
Power Dissipation (Max) (W) 375 375 370 268 (Tc) 480
Operating Temperature (°C) -55 to 175 -55 to 175 -55 to 175 -55 to 175 -55 to 175
Package TO-220-3 TO-220-3 TO-220-3 TO-220-3 TO-220-3
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

FDP032N08 (onsemi): This part is a parametric equivalent to the FDP032N08-F102, offering identical electrical specifications and thermal performance. Both parts are manufactured by onsemi, carry Active product status, and maintain RoHS3 compliance. The primary distinction is packaging format (Tube versus unspecified for the main part). This substitute provides direct functional replacement with no circuit modifications required.

IRFB3077PBF (Infineon Technologies): This HEXFET® series device from Infineon matches the 75V/120A rating class with equivalent on-resistance performance (3.3 mOhm @ 75A, 10V). The part maintains identical gate charge specification (220 nC @ 10V) and operating temperature range. Power dissipation is marginally lower at 370W versus 375W. The IRFB3077PBF is Active in product status and RoHS3 compliant. This part functions as a direct manufacturer equivalent with high inventory availability.

AOT266L (Alpha & Omega Semiconductor Inc.): This part operates at a reduced voltage rating of 60V with higher continuous drain current capability (140A at Tc). The on-resistance specification (3.5 mOhm @ 20A, 10V) is comparable to the main part. Gate charge is significantly lower at 90 nC @ 10V, indicating reduced switching losses. Power dissipation is reduced to 268W (Tc). This part is suitable for applications where the 60V voltage rating is acceptable and where lower gate charge is beneficial. Active product status and RoHS3 compliance are maintained.

IXTP260N055T2 (IXYS): This TrenchT2™ series device operates at 55V with substantially higher current capability (260A at Tc). On-resistance is 3.3 mOhm @ 50A, 10V. Gate charge is 140 nC @ 10V, and power dissipation reaches 480W (Tc). This part is applicable to applications requiring higher current handling at reduced voltage ratings. Active product status and RoHS3 compliance are confirmed.

All substitute parts maintain Through Hole TO-220-3 package compatibility, identical operating temperature ranges, and regulatory compliance status. Selection among these alternatives depends on specific application voltage and current requirements, thermal management capabilities, and switching frequency considerations.

Frequently Asked Questions (FAQ)

Q: Can FDP032N08 be used as a direct replacement for FDP032N08-F102?

A: Yes. FDP032N08 is a parametric equivalent with identical electrical specifications, thermal performance, and operating characteristics. Both parts are manufactured by onsemi and carry Active product status with RoHS3 compliance. The only distinction is packaging format.

Q: What are the key differences between IRFB3077PBF and the FDP032N08-F102?

A: Both parts share the same 75V/120A rating and 220 nC gate charge specification. The IRFB3077PBF has marginally higher on-resistance (3.3 mOhm versus 3.2 mOhm) and slightly lower power dissipation (370W versus 375W). The IRFB3077PBF is manufactured by Infineon and carries identical compliance certifications.

Q: Is AOT266L suitable for applications designed for the FDP032N08-F102?

A: AOT266L operates at a reduced voltage rating of 60V compared to the 75V specification of FDP032N08-F102. This part is suitable only for applications where the maximum voltage stress does not exceed 60V. The higher current capability (140A at Tc) and lower gate charge (90 nC) may provide benefits in specific switching applications.

Q: What is the primary advantage of IXTP260N055T2 over FDP032N08-F102?

A: IXTP260N055T2 provides significantly higher current capability at 260A (Tc) compared to 120A for the FDP032N08-F102. However, this part operates at a reduced voltage rating of 55V. Selection depends on application requirements for voltage and current ratings.

Q: Are all substitute parts compatible with the TO-220-3 package footprint?

A: Yes. All substitute parts listed are configured in Through Hole TO-220-3 package format, ensuring mechanical and thermal interface compatibility with existing PCB designs.

Q: Do all substitute parts meet RoHS3 compliance requirements?

A: Yes. All substitute parts carry RoHS3 Compliant status, maintaining regulatory compliance equivalent to the FDP032N08-F102.

Q: What is the significance of gate charge (Qg) differences among these parts?

A: Gate charge affects switching speed and driver circuit requirements. Lower gate charge (AOT266L at 90 nC, IXTP260N055T2 at 140 nC) reduces switching losses and driver power consumption compared to higher gate charge specifications (FDP032N08-F102 and IRFB3077PBF at 220 nC). Selection depends on switching frequency and driver circuit design.

Q: Can these parts be used interchangeably in high-frequency switching applications?

A: Interchangeability in high-frequency applications depends on gate charge, input capacitance, and on-resistance characteristics. Parts with lower gate charge and capacitance may provide superior performance at elevated switching frequencies. Circuit validation is necessary to confirm performance equivalence for specific frequency ranges.

Q: What inventory considerations apply to these substitute parts?

A: FDP032N08 has 1794 Pcs in stock, IRFB3077PBF has 36409 Pcs, AOT266L has 2030 Pcs, and IXTP260N055T2 has 32800 Pcs available. Inventory levels may influence sourcing decisions for high-volume production requirements.

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