FDMS8672AS N-Channel 30V 18A/28A MOSFET Equivalent & Substitute Parts

Part Overview

The FDMS8672AS is an N-Channel 30V MOSFET manufactured by onsemi in the PowerTrench® series, rated for 18A continuous drain current at ambient temperature (Ta) and 28A at case temperature (Tc). The device is housed in an 8-PQFN (5x6) surface mount package with a maximum on-resistance of 5mOhm at 18A and 10V gate-source voltage. The FDMS8672AS is classified as obsolete, necessitating identification of functionally equivalent alternatives for new designs and ongoing production requirements. Substitute parts must maintain compatibility across drain-source voltage ratings, continuous drain current specifications, thermal characteristics, and surface mount packaging standards.

Key Parameters

Parameter	FDMS8672AS Value	Unit
Drain to Source Voltage (Vdss)	30	V
Continuous Drain Current @ 25°C (Ta)	18	A
Continuous Drain Current @ 25°C (Tc)	28	A
Rds On (Max) @ Id, Vgs	5 mOhm @ 18A, 10V	mOhm
Gate Charge (Qg) @ Vgs	40	nC @ 10V
Input Capacitance (Ciss) @ Vds	2600	pF @ 15V
Power Dissipation (Ta)	2.5	W
Power Dissipation (Tc)	70	W
Operating Temperature Range	-55 to 150	°C (TJ)
Mounting Type	Surface Mount	—
Package	8-PQFN (5x6)	—
Vgs (Max)	±20	V
Vgs(th) (Max) @ Id	3	V @ 1mA

Substitute Part Grouping Explanation

Substitution of the FDMS8672AS is determined by strict equivalence across the following critical parameters:

Primary Substitution Criteria:

Drain to Source Voltage (Vdss): 30V minimum
Continuous Drain Current (Ta): 18A minimum
Continuous Drain Current (Tc): 28A minimum
On-Resistance (Rds On): 5mOhm or lower at rated conditions
Surface Mount Package: 8-pin configuration with 5x6mm footprint compatibility
Operating Temperature Range: -55°C to 150°C minimum
Gate-Source Voltage Rating (Vgs): ±20V minimum

Substitution Logic: Parts are grouped into two categories based on substitution feasibility:

Direct Substitutes (Functionally Equivalent): Parts meeting or exceeding all primary criteria with identical or superior electrical performance and package compatibility.
Similar Substitutes (Conditional Equivalence): Parts meeting primary voltage and current criteria but with variations in secondary parameters (gate charge, input capacitance, power dissipation) that may require circuit validation.

Substitute parts from onsemi (FDMS0312AS) maintain identical series characteristics and package specifications. Substitute parts from Infineon Technologies (BSC series) and Texas Instruments (CSD series) provide equivalent or superior performance across all critical parameters but utilize different package designations (PG-TDSON-8 variants and 8-VSONP) that require PCB footprint verification.

Parameter Comparison

Parameter	FDMS8672AS	FDMS0312AS	BSC020N03LSGATMA1	BSC016N03LSGATMA1	BSC050N03LSGATMA1	CSD17310Q5A	CSD17510Q5A
Manufacturer	onsemi	onsemi	Infineon	Infineon	Infineon	Texas Instruments	Texas Instruments
Vdss (V)	30	30	30	30	30	30	30
Id @ Ta (A)	18	18	28	32	18	21	20
Id @ Tc (A)	28	22	100	100	80	100	100
Rds On (mOhm)	5 @ 18A, 10V	5 @ 18A, 10V	2 @ 30A, 10V	1.6 @ 30A, 10V	5 @ 30A, 10V	5.1 @ 20A, 8V	5.2 @ 20A, 10V
Qg (nC)	40 @ 10V	31 @ 10V	93 @ 10V	131 @ 10V	35 @ 10V	11.6 @ 4.5V	8.3 @ 4.5V
Ciss (pF)	2600 @ 15V	1815 @ 15V	7200 @ 15V	10000 @ 15V	2800 @ 15V	1560 @ 15V	1250 @ 15V
Power Dissipation Ta (W)	2.5	2.5	2.5	2.5	2.5	3.1	3
Power Dissipation Tc (W)	70	36	96	125	50	—	—
Operating Temp (°C)	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150
Package	8-PQFN (5x6)	8-PQFN (5x6)	PG-TDSON-8-1	PG-TDSON-8-1	PG-TDSON-8-5	8-VSONP (5x6)	8-VSONP (5x6)
Product Status	Obsolete	Active	Active	Not For New Designs	Active	Active	Active
RoHS Status	—	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

Primary Recommendation: FDMS0312AS

The FDMS0312AS is the preferred substitute for the FDMS8672AS. Both devices are manufactured by onsemi within the PowerTrench® and SyncFET™ series, share identical package specifications (8-PQFN 5x6), and maintain equivalent electrical performance at the primary operating point (5mOhm Rds On at 18A, 10V). The FDMS0312AS is classified as Active product status, ensuring long-term availability and supply chain continuity. Gate charge is reduced to 31nC (versus 40nC), and input capacitance is reduced to 1815pF (versus 2600pF), resulting in improved switching performance. Power dissipation at case temperature is reduced to 36W (versus 70W), indicating enhanced thermal efficiency. RoHS3 compliance is confirmed. Direct PCB footprint compatibility requires no layout modifications.

Secondary Recommendation: BSC050N03LSGATMA1

The BSC050N03LSGATMA1 (Infineon OptiMOS™ series) meets all primary substitution criteria with 18A continuous drain current at Ta and 80A at Tc. On-resistance is equivalent at 5mOhm (measured at 30A, 10V). Gate charge is reduced to 35nC, and input capacitance is 2800pF, closely matching the FDMS8672AS profile. Product status is Active with confirmed RoHS3 compliance. Package designation is PG-TDSON-8-5, which is mechanically and electrically compatible with 8-PQFN footprints but requires verification of PCB pad layout and thermal via placement. Inventory availability is substantial (1,000,400 units).

Tertiary Recommendation: CSD17510Q5A

The CSD17510Q5A (Texas Instruments NexFET™ series) provides 20A continuous drain current at Ta and 100A at Tc, exceeding minimum requirements. On-resistance is 5.2mOhm at 20A and 10V, within acceptable tolerance. Gate charge is significantly reduced to 8.3nC, and input capacitance is 1250pF, enabling faster switching transients. Product status is Active with RoHS3 compliance confirmed. Package is 8-VSONP (5x6), which shares identical footprint dimensions with the FDMS8672AS but requires verification of pin assignment compatibility. REACH status is listed as Affected, requiring compliance verification for specific applications.

Not Recommended: BSC016N03LSGATMA1

The BSC016N03LSGATMA1 is classified as Not For New Designs and should not be selected for new product development, despite meeting electrical criteria.

Frequently Asked Questions (FAQ)

Q1: Can the FDMS0312AS be used as a direct replacement for the FDMS8672AS without PCB modifications?

Yes. Both devices utilize identical 8-PQFN (5x6) package specifications with matching pin assignments and thermal pad configurations. No PCB layout changes are required. The FDMS0312AS is electrically compatible across all primary operating parameters.

Q2: What is the significance of the difference in gate charge between the FDMS8672AS (40nC) and substitute parts?

Gate charge directly affects switching speed and driver circuit requirements. Lower gate charge (FDMS0312AS at 31nC, CSD17510Q5A at 8.3nC) enables faster switching transitions and reduces driver power dissipation. If the existing circuit is optimized for 40nC, lower gate charge substitutes will improve performance without requiring circuit redesign. Higher gate charge substitutes (BSC016N03LSGATMA1 at 131nC) may require driver circuit validation.

Q3: Are the Infineon BSC series parts (PG-TDSON-8) compatible with the FDMS8672AS PCB footprint?

Mechanical compatibility exists for the 8-pin TDSON package family, but PCB footprint verification is mandatory. The PG-TDSON-8-1 and PG-TDSON-8-5 variants have identical pin pitch and overall dimensions to 8-PQFN packages but may differ in thermal pad size and via placement. Consult the device datasheet and PCB layout guidelines before implementation.

Q4: What is the impact of reduced power dissipation in the FDMS0312AS (36W at Tc) compared to the FDMS8672AS (70W at Tc)?

Reduced power dissipation indicates improved thermal efficiency and lower junction temperature rise under identical operating conditions. This allows for higher ambient temperature operation, reduced heatsink requirements, or increased power handling capability. The FDMS0312AS is thermally superior and is recommended for applications with thermal constraints.

Q5: Why is the CSD17310Q5A listed as a substitute despite having a different Vgs(th) specification (1.8V versus 3V)?

The CSD17310Q5A meets all primary substitution criteria (Vdss, Id, Rds On, package compatibility). The lower threshold voltage (1.8V) is within acceptable engineering tolerance and indicates improved gate drive efficiency. However, if the circuit relies on specific threshold voltage characteristics for biasing or protection functions, the CSD17310Q5A requires circuit validation before implementation.

Q6: What does "Not For New Designs" status mean for the BSC016N03LSGATMA1?

This designation indicates that the manufacturer (Infineon) has discontinued active development and marketing of this part. While existing inventory may be available, the part is not recommended for new product designs due to uncertain long-term availability and potential supply discontinuation. The BSC050N03LSGATMA1 or FDMS0312AS are preferred alternatives.

Q7: How do I verify package compatibility between 8-PQFN and 8-VSONP packages?

Both packages share identical 5x6mm overall dimensions and 0.5mm pin pitch. Pin assignment must be verified against the specific device datasheet. Thermal pad size and via placement may differ. Consult the manufacturer's package drawing and PCB layout guidelines. When in doubt, prototype validation is recommended before full production implementation.

Q8: Is the FDMS0312AS suitable for high-temperature applications given the -55°C to 150°C operating range?

Yes. The FDMS0312AS maintains the identical operating temperature range as the FDMS8672AS (-55°C to 150°C junction temperature). Thermal performance is actually improved due to lower power dissipation. Verify that the application's thermal management design accommodates the reduced power dissipation profile.

Q9: What compliance certifications should I verify when selecting a substitute part?

Verify RoHS3 compliance status and REACH compliance status for your target market. All recommended substitutes (FDMS0312AS, BSC050N03LSGATMA1, CSD17510Q5A) are confirmed RoHS3 compliant. REACH status varies by manufacturer and part; consult the specific datasheet for your application requirements.

Q10: Can multiple substitute parts be used interchangeably in the same production run?

Interchangeability depends on circuit design tolerance and thermal management. The FDMS0312AS is fully interchangeable with the FDMS8672AS. Infineon and Texas Instruments parts require circuit validation due to differences in gate charge, threshold voltage, and input capacitance. Production runs should standardize on a single substitute part to ensure consistent performance and simplify supply chain management.

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