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FDMS8662 N-Channel MOSFET 30V 28A/49A Equivalent & Substitute Parts
Part Overview
The FDMS8662 is an N-Channel MOSFET manufactured by onsemi in the PowerTrench® series, rated for 30V drain-to-source voltage with continuous drain current of 28A at Ta and 49A at Tc. The device is housed in an 8-PQFN (5x6) surface mount package and is currently classified as obsolete. Due to its obsolete status, equivalent and substitute parts from active product lines are necessary for new designs and ongoing production requirements. Substitute devices must maintain electrical compatibility across critical parameters including voltage rating, drain current capability, on-resistance characteristics, and thermal performance.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Drain-to-Source Voltage (Vdss) | 30 | V |
| Continuous Drain Current @ 25°C (Ta) | 28 | A |
| Continuous Drain Current @ 25°C (Tc) | 49 | A |
| On-Resistance (Rds On Max) @ 28A, 10V | 2 | mOhm |
| Gate Threshold Voltage (Vgs(th)) @ 250µA | 3 | V |
| Gate Charge (Qg) @ 10V | 100 | nC |
| Input Capacitance (Ciss) @ 15V | 6420 | pF |
| Power Dissipation (Ta) | 2.5 | W |
| Power Dissipation (Tc) | 83 | W |
| Operating Temperature Range | -55 to 150 | °C |
| Package Type | 8-PQFN (5x6) | — |
| Mounting Type | Surface Mount | — |
Substitute Part Grouping Explanation
Substitution of the FDMS8662 is determined by strict electrical and mechanical compatibility across the following critical parameters:
Electrical Compatibility Criteria:
- Drain-to-Source Voltage (Vdss) must equal or exceed 30V
- Continuous Drain Current (Ta) must meet or exceed 28A at 25°C
- On-Resistance (Rds On) must not exceed 2mOhm at rated current and 10V gate drive
- Gate Threshold Voltage (Vgs(th)) must be compatible with 3V maximum specification
- Operating temperature range must span -55°C to 150°C
Mechanical Compatibility Criteria:
- Surface mount package with 8-pin configuration
- Package footprint compatibility with 8-PowerTDFN form factor
- Moisture Sensitivity Level (MSL) of 1 (Unlimited)
Regulatory Compliance:
- REACH Unaffected status
- ECCN EAR99 classification
- HTSUS 8541.29.0095 tariff code
Substitute parts are grouped into two categories: direct electrical equivalents from onsemi (same series technology) and cross-manufacturer alternatives from Infineon Technologies and Texas Instruments that meet all electrical and mechanical requirements.
Parameter Comparison
| Part Number | Manufacturer | Vdss (V) | Id @ Ta (A) | Id @ Tc (A) | Rds On Max (mOhm) | Vgs(th) (V) | Qg @ 10V (nC) | Ciss @ 15V (pF) | Package | Status |
|---|---|---|---|---|---|---|---|---|---|---|
| FDMS8662 | onsemi | 30 | 28 | 49 | 2.0 | 3.0 | 100 | 6420 | 8-PQFN (5x6) | Obsolete |
| FDMS7660AS | onsemi | 30 | 26 | 42 | 2.4 | 3.0 | 90 | 6120 | 8-PQFN (5x6) | Active |
| BSC020N03LSGATMA1 | Infineon | 30 | 28 | 100 | 2.0 | 2.2 | 93 | 7200 | PG-TDSON-8-1 | Active |
| BSC0901NSIATMA1 | Infineon | 30 | 28 | 100 | 2.0 | 2.2 | 20 | 2600 | PG-TDSON-8-6 | Active |
| BSC016N03LSGATMA1 | Infineon | 30 | 32 | 100 | 1.6 | 2.2 | 131 | 10000 | PG-TDSON-8-1 | Not For New Designs |
| BSC016N03MSGATMA1 | Infineon | 30 | 28 | 100 | 1.6 | 2.0 | 173 | 13000 | PG-TDSON-8-1 | Not For New Designs |
| BSC020N03MSGATMA1 | Infineon | 30 | 25 | 100 | 2.0 | 2.0 | 124 | 9600 | PG-TDSON-8-1 | Active |
| BSC025N03MSGATMA1 | Infineon | 30 | 23 | 100 | 2.5 | 2.0 | 98 | 7600 | PG-TDSON-8-1 | Active |
| CSD16414Q5 | Texas Instruments | 25 | 34 | 100 | 1.9 | 2.0 | 21 | 3650 | 8-VSON-CLIP (5x6) | Active |
| CSD17301Q5A | Texas Instruments | 30 | 28 | 100 | 2.6 | 1.55 | 25 | 3480 | 8-VSONP (5x6) | Active |
| CSD17576Q5B | Texas Instruments | 30 | 100 | 100 | 2.0 | 1.8 | 68 | 4430 | 8-VSONP (5x6) | Active |
Engineering Selection Recommendations
Primary Recommendation: FDMS7660AS (onsemi)
The FDMS7660AS is the direct onsemi equivalent within the PowerTrench® series. It maintains the same 30V voltage rating, 8-PQFN (5x6) package footprint, and operating temperature range as the FDMS8662. The continuous drain current at Ta is 26A, which is within 93% of the original specification. The device is currently in active production status with RoHS3 compliance and REACH Unaffected designation. This part provides the highest mechanical and electrical compatibility with minimal design modification.
Secondary Recommendation: BSC020N03LSGATMA1 (Infineon OptiMOS™)
The BSC020N03LSGATMA1 matches the FDMS8662 across critical electrical parameters: 30V Vdss, 28A continuous drain current at Ta, and 2mOhm on-resistance. The device is in active production with RoHS3 compliance. The package is PG-TDSON-8-1, which maintains 8-PowerTDFN form factor compatibility. This part is suitable for applications where Infineon OptiMOS™ technology is acceptable and PCB layout can accommodate the alternative package variant.
Tertiary Recommendation: CSD17301Q5A (Texas Instruments NexFET™)
The CSD17301Q5A provides 30V Vdss and 28A continuous drain current at Ta, meeting the core electrical requirements. The device is in active production with RoHS3 compliance. The 8-VSONP (5x6) package maintains the same footprint as the original part. Gate charge is significantly lower at 25nC, which may reduce switching losses in certain applications. This part is suitable for designs where Texas Instruments NexFET™ technology is preferred.
Not Recommended for New Designs:
BSC016N03LSGATMA1 and BSC016N03MSGATMA1 are marked as "Not For New Designs" by Infineon and should not be selected for new product development, despite meeting electrical specifications.
Voltage Rating Consideration:
CSD16414Q5 has a 25V Vdss rating, which is below the 30V specification of the FDMS8662. This part is not suitable for direct substitution in applications requiring the full 30V rating margin.
Frequently Asked Questions (FAQ)
Q: Can the FDMS7660AS directly replace the FDMS8662 without PCB modifications?
A: Yes. Both devices use the 8-PQFN (5x6) package with identical footprints and pin configurations. The FDMS7660AS is designed as a direct mechanical and electrical substitute within the onsemi PowerTrench® series. No PCB layout changes are required.
Q: What is the significance of the continuous drain current difference between FDMS8662 (28A Ta) and FDMS7660AS (26A Ta)?
A: The 2A difference represents approximately 7% lower current capability at ambient temperature. For applications operating at or near the 28A limit, thermal analysis must confirm that the FDMS7660AS provides adequate margin. At case temperature (Tc), the FDMS7660AS provides 42A versus the original 49A, a 14% reduction. Applications with significant thermal headroom will not be affected.
Q: Are the Infineon BSC020N03LSGATMA1 and Texas Instruments CSD17301Q5A pin-compatible with the FDMS8662?
A: Both devices use 8-pin surface mount packages with 8-PowerTDFN form factor compatibility. However, the specific pin assignments and package variants (PG-TDSON-8-1 and 8-VSONP respectively) differ from the 8-PQFN. PCB layout verification is required to confirm pin-to-pin compatibility before substitution.
Q: What is the impact of lower gate charge (Qg) in substitute parts?
A: Lower gate charge reduces the energy required to switch the device on and off, resulting in lower gate drive losses and potentially faster switching transitions. Parts such as BSC0901NSIATMA1 (20nC) and CSD17301Q5A (25nC) have significantly lower gate charge than the FDMS8662 (100nC). This is beneficial for high-frequency switching applications and reduces heat generation in the gate driver circuit.
Q: Can I use CSD16414Q5 as a substitute despite its 25V rating?
A: No. The CSD16414Q5 has a maximum Vdss of 25V, which is 5V below the FDMS8662 specification of 30V. Using this part in a 30V application creates an unacceptable risk of device failure due to overvoltage stress. Direct substitution is not permitted.
Q: What does "Not For New Designs" mean for BSC016N03LSGATMA1 and BSC016N03MSGATMA1?
A: This designation indicates that Infineon has discontinued active development and marketing of these parts. While they may still be available from inventory, they are not recommended for new product designs. These parts should only be used for legacy product support or repair applications where no alternative exists.
Q: How do I verify thermal compatibility when substituting to a different package type?
A: Thermal compatibility is determined by the power dissipation rating and thermal resistance characteristics. The FDMS8662 specifies 83W at Tc. Substitute parts must have equal or greater thermal capacity. BSC020N03LSGATMA1 provides 96W at Tc, and CSD17301Q5A provides 3.2W at Ta. Consult the thermal resistance (Rθ) specifications in the device datasheets and perform thermal modeling for your specific application to confirm adequate heat dissipation.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. All recommended substitute parts carry RoHS3 compliance certification. The FDMS8662 does not specify RoHS status, but all active alternatives meet current RoHS3 requirements, ensuring compliance with environmental regulations for new designs.
Q: What is the difference between Ta and Tc current ratings?
A: Ta (ambient temperature) current rating assumes the device is operating in free air at 25°C with no external heat sinking. Tc (case temperature) current rating assumes the device is mounted on a PCB with thermal management (copper area, heat sink, etc.) and represents the maximum current the device can handle when properly cooled. Tc ratings are typically 1.5 to 3 times higher than Ta ratings for the same device.
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