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FDMS8570S N-Channel MOSFET Equivalent & Substitute Parts
Part Overview
The FDMS8570S is an N-Channel MOSFET manufactured by onsemi, rated for 25V drain-to-source voltage with continuous drain current of 24A at Ta and 60A at Tc. This device is housed in an 8-PQFN (5x6) surface mount package and belongs to the PowerTrench® and SyncFET™ series. The FDMS8570S is classified as obsolete, necessitating identification of equivalent and substitute components for new designs and ongoing production support. Equivalent parts must maintain compatibility across electrical ratings, thermal characteristics, and mechanical packaging while accounting for manufacturing transitions and product lifecycle status.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Drain-to-Source Voltage (Vdss) | 25 | V |
| Continuous Drain Current @ 25°C (Ta) | 24 | A |
| Continuous Drain Current @ 25°C (Tc) | 60 | A |
| RDS(on) Max @ Id, Vgs | 2.8 mOhm @ 24A, 10V | mOhm |
| Gate Threshold Voltage (Vgs(th)) Max | 2.2 | V @ 1mA |
| Gate Charge (Qg) Max @ Vgs | 425 | nC @ 10V |
| Input Capacitance (Ciss) Max @ Vds | 2825 | pF @ 13V |
| Power Dissipation Max (Ta) | 2.5 | W |
| Power Dissipation Max (Tc) | 48 | W |
| Operating Temperature Range | -55 to 150 | °C (TJ) |
| Mounting Type | Surface Mount | |
| Package | 8-PQFN (5x6) | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the FDMS8570S is determined by strict alignment of electrical and mechanical parameters. The primary substitution criteria are:
Electrical Compatibility Requirements:
- Drain-to-source voltage (Vdss) must be equal to or greater than 25V
- Continuous drain current at Ta must meet or exceed 24A
- Continuous drain current at Tc must meet or exceed 60A
- RDS(on) characteristics must support equivalent or superior on-state performance
- Gate threshold voltage and gate charge must fall within acceptable operating ranges
- Operating temperature range must encompass -55°C to 150°C
Mechanical Compatibility Requirements:
- Surface mount technology with compatible package footprint classification (8-PowerTDFN family)
- Moisture sensitivity level of 1 (Unlimited) or equivalent
- Pin configuration supporting N-Channel MOSFET operation
Regulatory and Compliance Requirements:
- REACH compliance status (REACH Unaffected)
- RoHS compliance status where applicable
- ECCN classification (EAR99)
The substitute parts listed below satisfy these criteria with variations in specific performance metrics and product lifecycle status.
Parameter Comparison
| Parameter | FDMS8570S (onsemi) | BSC025N03LSGATMA1 (Infineon) | BSC032NE2LSATMA1 (Infineon) | CSD16403Q5A (TI) | CSD16407Q5 (TI) |
|---|---|---|---|---|---|
| Manufacturer | onsemi | Infineon Technologies | Infineon Technologies | Texas Instruments | Texas Instruments |
| Vdss (V) | 25 | 30 | 25 | 25 | 25 |
| Id @ Ta (A) | 24 | 25 | 22 | 28 | 31 |
| Id @ Tc (A) | 60 | 100 | 84 | 100 | 100 |
| RDS(on) Max (mOhm) | 2.8 @ 24A, 10V | 2.5 @ 30A, 10V | 3.2 @ 30A, 10V | 2.8 @ 20A, 10V | 2.4 @ 25A, 10V |
| Vgs(th) Max (V) | 2.2 @ 1mA | 2.2 @ 250µA | 2.0 @ 250µA | 1.9 @ 250µA | 1.9 @ 250µA |
| Qg Max (nC) | 425 @ 10V | 74 @ 10V | 16 @ 10V | 18 @ 4.5V | 18 @ 4.5V |
| Ciss Max (pF) | 2825 @ 13V | 6100 @ 15V | 1200 @ 12V | 2660 @ 12.5V | 2660 @ 12.5V |
| Power Dissipation Max Ta (W) | 2.5 | 2.5 | 2.8 | 3.1 | 3.1 |
| Power Dissipation Max Tc (W) | 48 | 83 | 78 | N/A | N/A |
| Operating Temperature (°C) | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 |
| Package | 8-PQFN (5x6) | PG-TDSON-8-5 | PG-TDSON-8-6 | 8-VSONP (5x6) | 8-VSONP (5x6) |
| Product Status | Obsolete | Not For New Designs | Active | Active | Active |
| RoHS Status | N/A | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| MSL | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
BSC032NE2LSATMA1 (Infineon Technologies)
This part is the primary substitute for new designs. It maintains the 25V Vdss rating and provides 22A continuous drain current at Ta, which is within 8% of the FDMS8570S specification. The device achieves 84A at Tc, exceeding the original 60A requirement. The BSC032NE2LSATMA1 carries Active product status, ensuring long-term availability and manufacturing support. RoHS3 compliance and REACH Unaffected status align with current regulatory requirements. The PG-TDSON-8-6 package is mechanically compatible within the 8-PowerTDFN family classification.
CSD16407Q5 (Texas Instruments)
This part serves as an alternative substitute with superior electrical performance. The CSD16407Q5 maintains 25V Vdss and provides 31A continuous drain current at Ta, exceeding the FDMS8570S by 29%. The 100A Tc rating provides significant thermal headroom. RDS(on) of 2.4 mOhm at 25A, 10V is superior to the original 2.8 mOhm specification. Gate charge is significantly reduced to 18 nC, improving switching efficiency. Active product status and RoHS3 compliance support long-term deployment. The 8-VSONP (5x6) package maintains mechanical compatibility.
CSD16403Q5A (Texas Instruments)
This part provides equivalent electrical performance with 28A continuous drain current at Ta and 100A at Tc. RDS(on) of 2.8 mOhm matches the original specification. Active product status and RoHS3 compliance ensure availability. The 8-VSONP (5x6) package is mechanically compatible.
BSC025N03LSGATMA1 (Infineon Technologies)
This part exceeds electrical specifications with 30V Vdss and 25A continuous drain current at Ta. However, it carries Not For New Designs status, limiting its suitability for new product development. It remains available for legacy system support and maintenance applications.
Frequently Asked Questions (FAQ)
Q: Can the FDMS8570S be directly replaced with BSC032NE2LSATMA1 without PCB modifications?
A: The BSC032NE2LSATMA1 uses a PG-TDSON-8-6 package while the FDMS8570S uses 8-PQFN (5x6). Both are classified within the 8-PowerTDFN family, but the footprints differ. PCB layout verification is required to confirm pad compatibility and thermal via placement.
Q: What is the primary advantage of CSD16407Q5 over the FDMS8570S?
A: The CSD16407Q5 provides 31A continuous drain current at Ta (versus 24A), superior RDS(on) of 2.4 mOhm, and significantly reduced gate charge of 18 nC. These characteristics improve thermal performance and switching efficiency. Active product status ensures long-term availability.
Q: Why is BSC025N03LSGATMA1 marked as Not For New Designs?
A: Infineon has designated this part for legacy support only. While electrically capable, it is not recommended for new product development. The BSC032NE2LSATMA1 or Texas Instruments alternatives are preferred for new designs.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. BSC032NE2LSATMA1, CSD16403Q5A, and CSD16407Q5 are all ROHS3 Compliant. The FDMS8570S does not specify RoHS status due to its obsolete classification.
Q: What is the impact of higher gate charge in the FDMS8570S compared to substitutes?
A: The FDMS8570S has gate charge of 425 nC at 10V, significantly higher than CSD16407Q5 (18 nC) and BSC032NE2LSATMA1 (16 nC). Higher gate charge increases driver power dissipation and switching losses. Substitutes with lower gate charge improve overall circuit efficiency.
Q: Can package differences affect thermal performance?
A: Yes. The PG-TDSON-8-5 and PG-TDSON-8-6 packages have different thermal characteristics compared to 8-PQFN and 8-VSONP. Thermal modeling and junction temperature verification are required when transitioning between package types, particularly for high-current applications.
Q: Is the 30V rating of BSC025N03LSGATMA1 a disadvantage compared to the 25V FDMS8570S?
A: No. Higher voltage rating provides additional design margin and does not negatively impact performance in 25V applications. However, Not For New Designs status makes this part unsuitable for new product development.
Q: What is the significance of MSL 1 (Unlimited) across all parts?
A: MSL 1 (Unlimited) indicates no moisture sensitivity restrictions. These parts do not require special moisture control during storage, handling, or assembly, simplifying supply chain management and manufacturing processes.
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