FDMS7694 N-Channel MOSFET 30V 13.2A/20A Equivalent & Substitute Parts

Part Overview

The FDMS7694 is an N-Channel MOSFET manufactured by onsemi in the PowerTrench® series, rated for 30V drain-to-source voltage with continuous drain current of 13.2A at Ta and 20A at Tc. This device is housed in an 8-PQFN (5x6) surface mount package and is actively produced. The part operates across a temperature range of -55°C to 150°C (TJ) with maximum power dissipation of 2.5W (Ta) and 27W (Tc). Equivalent and substitute parts are identified based on matching electrical characteristics including voltage rating, continuous drain current capability, on-resistance specifications, and compatible surface mount packaging within the 8-PowerTDFN family.

Key Parameters

Parameter	FDMS7694 Value	Unit
Drain to Source Voltage (Vdss)	30	V
Current - Continuous Drain @ 25°C (Ta)	13.2	A
Current - Continuous Drain @ 25°C (Tc)	20	A
Rds On (Max) @ Id, Vgs	9.5 mOhm @ 13.2A, 10V	mOhm
Vgs(th) (Max) @ Id	3	V @ 250µA
Gate Charge (Qg) (Max) @ Vgs	22	nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds	1410	pF @ 15V
Power Dissipation (Max) Ta	2.5	W
Power Dissipation (Max) Tc	27	W
Operating Temperature Range	-55 to 150	°C (TJ)
Mounting Type	Surface Mount	-
Package / Case	8-PowerTDFN	-
RoHS Status	ROHS3 Compliant	-
Moisture Sensitivity Level (MSL)	1 (Unlimited)	-

Substitute Part Grouping Explanation

Substitute parts for the FDMS7694 are selected based on the following critical electrical and mechanical parameters:

Primary Matching Criteria:

Drain to Source Voltage (Vdss): 30V minimum
Continuous Drain Current (Id): 13.2A (Ta) or 20A (Tc) minimum
On-Resistance (Rds On): 9.5 mOhm or lower at specified gate voltage
Gate Threshold Voltage (Vgs(th)): Compatible with 3V maximum
Operating Temperature Range: -55°C to 150°C (TJ)
Mounting Type: Surface Mount
Package Family: 8-PowerTDFN compatible packages

Secondary Compatibility Factors:

Gate Charge (Qg): Lower values preferred for faster switching
Input Capacitance (Ciss): Lower values reduce drive requirements
Power Dissipation: Minimum 27W (Tc) capability
RoHS3 Compliance and MSL Level 1 status

Substitute parts are grouped into two categories: direct equivalents from alternative manufacturers (Infineon, Texas Instruments, Rohm, STMicroelectronics) that maintain electrical performance within specified tolerances, and functional alternatives that exceed minimum performance requirements while maintaining package compatibility.

Parameter Comparison

Parameter	FDMS7694	BSC0909NSATMA1	BSC100N03MSGATMA1	CSD17302Q5A	CSD17307Q5A	CSD17507Q5A	CSD17522Q5A	CSD17527Q5A	RS1E150GNTB	STL56N3LLH5
Manufacturer	onsemi	Infineon	Infineon	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Rohm	STMicroelectronics
Vdss (V)	30	34	30	30	30	30	30	30	30	30
Id @ Ta (A)	13.2	12	12	16	14	13	—	—	15	—
Id @ Tc (A)	20	44	44	87	73	65	87	65	40	56
Rds On (Max) (mOhm)	9.5 @ 13.2A, 10V	9.2 @ 20A, 10V	10 @ 30A, 10V	7.9 @ 14A, 8V	10.5 @ 11A, 8V	10.8 @ 11A, 10V	8.1 @ 14A, 10V	10.8 @ 11A, 10V	8.8 @ 15A, 10V	9 @ 7.5A, 10V
Vgs(th) (Max) (V)	3 @ 250µA	2 @ 250µA	2 @ 250µA	1.7 @ 250µA	1.8 @ 250µA	2.1 @ 250µA	2 @ 250µA	2 @ 250µA	2.5 @ 1mA	1 @ 250µA
Qg (Max) (nC)	22 @ 10V	15 @ 10V	23 @ 10V	7 @ 4.5V	5.2 @ 4.5V	3.6 @ 4.5V	4.3 @ 4.5V	3.4 @ 4.5V	10 @ 10V	6.5 @ 4.5V
Ciss (Max) (pF)	1410 @ 15V	1110 @ 15V	1700 @ 15V	950 @ 15V	700 @ 15V	530 @ 15V	695 @ 15V	506 @ 15V	590 @ 15V	950 @ 25V
Power Dissipation Ta (W)	2.5	2.5	2.5	3	3	3	3	3	3	—
Power Dissipation Tc (W)	27	27	30	—	—	—	—	—	22	62.5
Operating Temp Range (°C)	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150	to 150	-55 to 150
Package	8-PQFN (5x6)	PG-TDSON-8-5	PG-TDSON-8-5	8-VSONP (5x6)	8-VSONP (5x6)	8-VSONP (5x6)	8-VSONP (5x6)	8-VSONP (5x6)	8-HSOP	PowerFlat™ (5x6)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Product Status	Active	Active	Not For New Designs	Active	Active	Active	Active	Active	Active	Active

Engineering Selection Recommendations

Tier 1 - Direct Equivalents (Recommended for New Designs):

CSD17507Q5A (Texas Instruments NexFET™) and CSD17527Q5A (Texas Instruments NexFET™) are the primary substitutes. Both devices maintain 30V Vdss rating, meet or exceed the 13.2A continuous drain current requirement, and provide superior on-resistance characteristics (10.8 mOhm and 10.8 mOhm respectively). These parts are actively produced, RoHS3 compliant, and available in compatible 8-VSONP (5x6) surface mount packages. CSD17507Q5A is available in Cut Tape (CT) & Digi-Reel® packaging matching the FDMS7694 distribution format.

BSC0909NSATMA1 (Infineon OptiMOS™) provides an alternative with 34V Vdss rating, 12A continuous drain current at Ta, and 9.2 mOhm on-resistance. This part exceeds voltage specifications and is actively produced with full RoHS3 compliance.

Tier 2 - Functional Alternatives (Performance Enhancement):

CSD17302Q5A (Texas Instruments NexFET™) offers superior performance with 16A continuous drain current at Ta, 87A at Tc, and lower on-resistance of 7.9 mOhm at 14A, 8V. This device is actively produced and RoHS3 compliant, suitable for applications requiring enhanced current handling.

CSD17322Q5A and CSD17522Q5A (Texas Instruments NexFET™) provide 87A continuous drain current at Tc with on-resistance values of 8.8 mOhm and 8.1 mOhm respectively, enabling higher power dissipation applications while maintaining 30V Vdss rating.

RS1E150GNTB (Rohm Semiconductor) delivers 15A continuous drain current at Ta and 40A at Tc with 8.8 mOhm on-resistance in an 8-HSOP package. This part is actively produced and RoHS3 compliant.

STL56N3LLH5 (STMicroelectronics STripFET™ V) provides 56A continuous drain current at Tc with 9 mOhm on-resistance and exceptional power dissipation capability of 62.5W (Tc) in a PowerFlat™ (5x6) package. This device is actively produced and RoHS3 compliant.

Not Recommended for New Designs:

BSC100N03MSGATMA1 (Infineon OptiMOS™) carries a "Not For New Designs" product status designation and should not be selected for new circuit implementations despite meeting electrical specifications.

Compliance and Certification:

All recommended substitutes maintain RoHS3 compliance and MSL Level 1 (Unlimited) moisture sensitivity rating, ensuring compatibility with standard manufacturing and storage processes. All devices operate across the -55°C to 150°C temperature range specified for the FDMS7694.

Frequently Asked Questions (FAQ)

Q: Can CSD17507Q5A directly replace FDMS7694 in existing designs?

A: CSD17507Q5A is electrically compatible with FDMS7694 for applications requiring 13.2A continuous drain current at Ta. Both devices maintain 30V Vdss rating and are housed in compatible 8-PowerTDFN family packages (8-VSONP vs. 8-PQFN). PCB layout considerations for the specific package variant must be evaluated. CSD17507Q5A is available in Cut Tape (CT) & Digi-Reel® packaging, matching FDMS7694 distribution format.

Q: What is the difference between 8-PQFN and 8-VSONP packages?

A: Both 8-PQFN (5x6) and 8-VSONP (5x6) are surface mount packages within the 8-PowerTDFN family with identical 5x6 mm footprints. Package-specific differences in lead frame design and thermal characteristics require verification against PCB layout and thermal management requirements. Consult device datasheets for precise pin configuration and thermal performance specifications.

Q: Are all substitute parts RoHS3 compliant?

A: All substitute parts listed carry RoHS3 compliance certification. All devices maintain MSL Level 1 (Unlimited) moisture sensitivity rating, compatible with standard manufacturing processes and storage conditions.

Q: Which substitute offers the lowest on-resistance?

A: CSD17302Q5A provides the lowest on-resistance at 7.9 mOhm measured at 14A, 8V. This device is actively produced and RoHS3 compliant, suitable for applications prioritizing minimal conduction losses.

Q: Can I use STL56N3LLH5 as a substitute for higher power applications?

A: STL56N3LLH5 is suitable for applications requiring higher continuous drain current (56A at Tc) and exceptional power dissipation capability (62.5W at Tc). This device maintains 30V Vdss rating and is housed in a PowerFlat™ (5x6) package within the 8-PowerTDFN family. Thermal management and PCB layout must be evaluated for the specific application.

Q: What is the significance of gate charge (Qg) differences between parts?

A: Gate charge values determine the energy required to switch the MOSFET. Lower Qg values reduce gate drive requirements and switching losses. FDMS7694 specifies 22 nC at 10V, while substitute parts range from 3.4 nC to 23 nC depending on device selection. Lower Qg values improve switching efficiency in high-frequency applications.

Q: Are there packaging format differences affecting component sourcing?

A: FDMS7694 is available in Cut Tape (CT) & Digi-Reel® packaging. Substitute parts are available in Tape & Reel (TR) or Cut Tape (CT) & Digi-Reel® formats. CSD17507Q5A and CSD17522Q5A are available in Cut Tape (CT) & Digi-Reel® format matching FDMS7694 distribution. Verify packaging availability with component suppliers for production requirements.

Q: Why is BSC100N03MSGATMA1 listed but not recommended?

A: BSC100N03MSGATMA1 carries a "Not For New Designs" product status designation from Infineon Technologies. While the device meets electrical specifications for substitution, this status indicates the manufacturer is discontinuing or has discontinued active development. New designs should select from actively produced alternatives.

Q: What thermal considerations apply when selecting a substitute?

A: Power dissipation ratings vary across substitute parts. FDMS7694 specifies 2.5W (Ta) and 27W (Tc). Substitute parts range from 2.5W to 62.5W (Tc) depending on device selection. Thermal management design, PCB copper area, and heat sink requirements must be evaluated based on the specific application's power dissipation profile and operating conditions.

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