FDMS3660AS MOSFET Equivalent & Substitute Parts

Part Overview

The FDMS3660AS is a dual N-channel MOSFET manufactured by onsemi, designed for power switching applications requiring 30V drain-to-source voltage capability. This device features a PowerTrench® architecture integrated into an 8-PowerTDFN (Power56) surface mount package, delivering continuous drain current ratings of 13A and 30A with logic level gate drive capability.

The FDMS3660AS is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this component.

Substiute Parts

FDMS3660AS
onsemiIn Stock: 2999FDMS3660AS Datasheet
FDMS3660AS
Current Part
NTMFD4C20NT1G
onsemiIn Stock: 1759NTMFD4C20NT1G Datasheet
NTMFD4C20NT1G
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Key Parameters

Parameter Value Unit
Drain to Source Voltage (Vdss) 30 V
Continuous Drain Current (Id) @ 25°C 13A, 30A A
On-State Resistance (Rds On) @ Id, Vgs 8mOhm @ 13A, 10V mOhm
Gate Threshold Voltage (Vgs(th)) @ Id 2.7V @ 250µA V
Gate Charge (Qg) @ Vgs 30nC @ 10V nC
Input Capacitance (Ciss) @ Vds 2230pF @ 15V pF
Maximum Power Dissipation 1 W
Operating Temperature Range -55 to 150 °C (TJ)
Configuration 2 N-Channel (Dual)
Package Type 8-PowerTDFN
FET Feature Logic Level Gate
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the FDMS3660AS is determined by strict alignment of electrical and mechanical parameters within the dual N-channel MOSFET category. The following criteria establish substitution validity:

Electrical Compatibility Requirements:

  • Drain-to-source voltage (Vdss) rating of 30V or greater
  • Dual N-channel configuration
  • Operating temperature range spanning -55°C to 150°C (TJ)
  • Logic level gate drive capability

Mechanical Compatibility Requirements:

  • Surface mount technology
  • 8-pin PowerTDFN package family
  • Dual flag asymmetrical configuration

Performance Alignment Criteria:

  • Continuous drain current (Id) ratings within the operational envelope of the original design
  • On-state resistance (Rds On) characteristics suitable for power switching applications
  • Gate charge (Qg) and input capacitance (Ciss) values compatible with existing gate drive circuits

The NTMFD4C20NT1G meets these substitution criteria through matching voltage rating, dual N-channel configuration, surface mount PowerTDFN packaging, and compatible operating temperature specifications.

Parameter Comparison

Parameter FDMS3660AS NTMFD4C20NT1G Unit
Manufacturer onsemi onsemi
Category Transistors, FETs, MOSFETs Transistors, FETs, MOSFETs
Configuration 2 N-Channel (Dual) 2 N-Channel (Dual)
Drain to Source Voltage (Vdss) 30 30 V
Continuous Drain Current (Id) @ 25°C 13A, 30A 9.1A, 13.7A A
On-State Resistance (Rds On) @ Id, Vgs 8mOhm @ 13A, 10V 7.3mOhm @ 10A, 10V mOhm
Gate Threshold Voltage (Vgs(th)) @ Id 2.7V @ 250µA 2.1V @ 250µA V
Gate Charge (Qg) @ Vgs 30nC @ 10V 9.3nC @ 4.5V nC
Input Capacitance (Ciss) @ Vds 2230pF @ 15V 970pF @ 15V pF
Maximum Power Dissipation 1 1.09, 1.15 W
Operating Temperature Range -55 to 150 -55 to 150 °C (TJ)
Mounting Type Surface Mount Surface Mount
Package / Case 8-PowerTDFN 8-PowerTDFN
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99

Engineering Selection Recommendations

Both the FDMS3660AS and NTMFD4C20NT1G are classified as obsolete products. Selection between these components is based on compliance status and regulatory alignment rather than performance differentiation.

Compliance Alignment: Both parts maintain ROHS3 compliance, REACH unaffected status, and EAR99 export classification. Moisture sensitivity level (MSL) is identical at 1 (Unlimited), indicating no special handling requirements during storage or assembly.

Regulatory Continuity: The NTMFD4C20NT1G provides equivalent regulatory standing to the FDMS3660AS, ensuring that substitution does not introduce compliance complications in applications subject to environmental or trade regulations.

Electrical Performance Considerations: The NTMFD4C20NT1G exhibits lower gate charge (9.3nC versus 30nC) and reduced input capacitance (970pF versus 2230pF), resulting in faster switching characteristics and reduced gate drive power requirements. The on-state resistance at comparable current levels (7.3mOhm at 10A versus 8mOhm at 13A) demonstrates equivalent or superior conduction efficiency.

Current Rating Differential: The FDMS3660AS supports higher continuous drain current ratings (13A and 30A) compared to the NTMFD4C20NT1G (9.1A and 13.7A). Applications requiring the full 30A rating of the original part cannot be directly substituted without circuit redesign.

Frequently Asked Questions (FAQ)

Q: Can the NTMFD4C20NT1G directly replace the FDMS3660AS in all applications?

A: Direct substitution is valid for applications operating within the NTMFD4C20NT1G current envelope (9.1A and 13.7A continuous drain current). Applications requiring the 30A rating of the FDMS3660AS require circuit redesign or alternative component selection.

Q: Are the package dimensions identical between these two parts?

A: Both parts use the 8-PowerTDFN package family with dual flag asymmetrical configuration. Physical footprint compatibility is established for PCB layout purposes.

Q: What is the impact of the lower gate charge specification on circuit design?

A: The NTMFD4C20NT1G gate charge of 9.3nC (versus 30nC for the FDMS3660AS) reduces the energy required to drive the gate, resulting in lower gate drive power dissipation and potentially faster switching transitions. Existing gate drive circuits designed for the FDMS3660AS will operate with improved efficiency when driving the NTMFD4C20NT1G.

Q: Do both parts meet the same environmental and regulatory standards?

A: Yes. Both the FDMS3660AS and NTMFD4C20NT1G are ROHS3 compliant, REACH unaffected, and classified as EAR99 for export purposes. Moisture sensitivity level is identical at MSL 1 (Unlimited).

Q: What is the significance of the lower input capacitance in the NTMFD4C20NT1G?

A: The reduced input capacitance (970pF versus 2230pF) decreases the capacitive load on gate drive circuits, enabling faster switching speeds and reducing electromagnetic interference (EMI) in high-frequency switching applications.

Q: Are there any thermal management differences between these parts?

A: Both parts operate across the identical temperature range (-55°C to 150°C TJ). Maximum power dissipation ratings are comparable (1W for FDMS3660AS; 1.09W and 1.15W for NTMFD4C20NT1G), indicating equivalent thermal performance within their respective current ratings.

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