FDMS3006SDC N-Channel 30V 34A Dual Cool MOSFET Equivalent & Substitute Parts

Part Overview

The FDMS3006SDC is an N-Channel 30V 34A surface mount MOSFET manufactured by onsemi, featuring Dual Cool™, PowerTrench®, and SyncFET™ technologies in an 8-PQFN (5x6) package. This device is classified as obsolete, necessitating identification of active equivalent and substitute parts for new designs and ongoing production requirements. The part operates across a temperature range of -55°C to 150°C (TJ) and is suitable for applications requiring moderate drain current at 30V drain-source voltage ratings.

Key Parameters

Parameter	Value	Unit
Drain to Source Voltage (Vdss)	30	V
Continuous Drain Current (Id) @ 25°C	34	A (Ta)
RDS(on) Max @ 30A, 10V	1.9	mOhm
Gate Charge (Qg) @ 10V	80	nC
Input Capacitance (Ciss) @ 15V	5725	pF
Power Dissipation (Ta)	3.3	W
Power Dissipation (Tc)	89	W
Operating Temperature Range	-55 to 150	°C (TJ)
Package Type	8-PowerTDFN	Surface Mount
Product Status	Obsolete

Substitute Part Grouping Explanation

Substitution of the FDMS3006SDC is determined by strict alignment of the following electrical and mechanical parameters:

Primary Substitution Criteria:

Drain to Source Voltage (Vdss): 30V (exact match required)
Continuous Drain Current (Id) @ 25°C: minimum 34A at Ta, or equivalent thermal performance at Tc
RDS(on) @ 30A, 10V: 1.9 mOhm or lower
Gate Charge (Qg) @ 10V: comparable or lower values preferred for switching efficiency
Input Capacitance (Ciss) @ 15V: comparable values for circuit compatibility
Operating Temperature Range: -55°C to 150°C (TJ) minimum
Package Type: 8-PowerTDFN surface mount configuration
Mounting Type: Surface Mount

Secondary Considerations:

Product Status: Active status preferred for long-term availability
RoHS Compliance: ROHS3 Compliant preferred
Moisture Sensitivity Level: MSL 1 (Unlimited) preferred

Substitute parts are grouped based on their ability to meet or exceed the primary electrical specifications while maintaining package compatibility. Parts with lower continuous drain current at Ta but higher thermal performance at Tc are included where overall thermal dissipation capability remains adequate.

Parameter Comparison

Part Number	Manufacturer	Vdss (V)	Id @ 25°C Ta (A)	RDS(on) @ 30A, 10V (mOhm)	Qg @ 10V (nC)	Ciss @ 15V (pF)	Pd Ta (W)	Pd Tc (W)	Package	Status
FDMS3006SDC	onsemi	30	34	1.9	80	5725	3.3	89	8-PowerTDFN	Obsolete
BSC020N03LSGATMA1	Infineon	30	28	2.0	93	7200	2.5	96	8-PowerTDFN	Active
BSC020N03MSGATMA1	Infineon	30	25	2.0	124	9600	2.5	96	8-PowerTDFN	Active
BSC025N03LSGATMA1	Infineon	30	25	2.5	74	6100	2.5	83	8-PowerTDFN	Not For New Designs
BSC025N03MSGATMA1	Infineon	30	23	2.5	98	7600	2.5	83	8-PowerTDFN	Active
BSC0501NSIATMA1	Infineon	30	29	1.9	33	2200	2.5	50	8-PowerTDFN	Active
BSC0502NSIATMA1	Infineon	30	26	2.3	26	1600	2.5	43	8-PowerTDFN	Active
BSC0901NSATMA1	Infineon	30	28	1.9	44	2800	2.5	69	8-PowerTDFN	Active
BSC0901NSIATMA1	Infineon	30	28	2.0	20	2600	2.5	69	8-PowerTDFN	Active
BSC0902NSATMA1	Infineon	30	24	2.6	26	1700	2.5	48	8-PowerTDFN	Active
BSZ019N03LSATMA1	Infineon	30	22	1.9	44	2800	2.1	69	8-PowerTDFN	Active

Engineering Selection Recommendations

Tier 1 Substitutes (Recommended for New Designs):

BSC0901NSATMA1 and BSC0901NSIATMA1 are the primary recommended substitutes. Both devices feature 28A continuous drain current at 25°C, matching the FDMS3006SDC performance envelope, with RDS(on) of 1.9-2.0 mOhm at 30A and 10V. These parts are manufactured by Infineon Technologies under the active OptiMOS™ series, carry ROHS3 compliance, and maintain MSL 1 (Unlimited) moisture sensitivity rating. The BSC0901NSATMA1 offers 69W thermal dissipation at Tc, providing thermal performance comparable to the original device.

Tier 2 Substitutes (Alternative Options):

BSC0501NSIATMA1 provides 29A continuous drain current with 1.9 mOhm RDS(on), the lowest on-resistance among available substitutes. This part is active and ROHS3 compliant. However, thermal dissipation at Tc is limited to 50W, requiring thermal management evaluation for applications demanding the full 89W dissipation capability of the original part.

BSC020N03LSGATMA1 delivers 28A continuous drain current with 2.0 mOhm RDS(on) and 96W thermal dissipation at Tc, exceeding the original device's thermal performance. This part is active and ROHS3 compliant, suitable for applications with elevated thermal requirements.

Not Recommended for New Designs:

BSC025N03LSGATMA1 carries a "Not For New Designs" status and should be avoided for new product development, despite meeting electrical specifications.

Product Status Consideration:

All recommended substitutes maintain active product status with established supply chains and long-term availability assurance. The original FDMS3006SDC obsolete status necessitates transition to active alternatives for production continuity.

Frequently Asked Questions (FAQ)

Q: Can BSC020N03MSGATMA1 replace FDMS3006SDC in all applications?

A: BSC020N03MSGATMA1 meets the 30V Vdss requirement and provides 96W thermal dissipation at Tc. However, continuous drain current at 25°C is 25A, below the original 34A specification. This substitute is suitable for applications where the actual operating current does not exceed 25A at ambient temperature. Gate charge is higher at 124 nC versus 80 nC, affecting switching speed characteristics.

Q: What is the significance of RDS(on) differences between substitutes?

A: RDS(on) directly impacts power dissipation and thermal performance. The FDMS3006SDC specifies 1.9 mOhm at 30A and 10V. Substitutes with higher RDS(on) values (e.g., 2.5-2.6 mOhm) generate proportionally more heat at equivalent current levels. Selection should account for thermal budget constraints in the application circuit.

Q: Are all substitute parts compatible with the original 8-PQFN (5x6) footprint?

A: All listed substitutes use the 8-PowerTDFN package designation, which is mechanically and electrically compatible with the original 8-PQFN (5x6) footprint. PCB layout modifications are not required for package substitution.

Q: Why do some substitutes show lower gate charge (Qg) values?

A: Gate charge affects switching speed and driver circuit requirements. Lower Qg values (e.g., 20-26 nC in BSC0901NSIATMA1 and BSC0902NSATMA1) enable faster switching transitions and reduce driver power consumption. Higher Qg values require longer gate drive times but may offer improved noise immunity in certain circuit topologies.

Q: What does "Not For New Designs" status mean for BSC025N03LSGATMA1?

A: This designation indicates the manufacturer is transitioning the part to end-of-life status. While currently available, Infineon does not recommend this part for new product development. Long-term availability cannot be assured. Alternative active parts should be selected for new designs.

Q: How should thermal performance differences be evaluated?

A: Compare power dissipation ratings at both Ta (ambient) and Tc (case) conditions. The FDMS3006SDC specifies 3.3W at Ta and 89W at Tc. Substitutes with lower Tc ratings (e.g., 43-50W) require enhanced thermal management or are suitable only for lower-power applications. Thermal modeling should account for actual operating current, ambient temperature, and PCB thermal design.

Q: Are all substitutes RoHS3 compliant?

A: All listed Infineon substitutes carry ROHS3 Compliant certification. The original FDMS3006SDC does not specify RoHS status. Verification of RoHS compliance requirements for your application is recommended before final part selection.

Q: What is the difference between Cut Tape (CT) and Tape & Reel (TR) packaging?

A: Cut Tape packaging is supplied in individual strips suitable for manual assembly or small-volume production. Tape & Reel packaging is supplied on continuous reels for automated pick-and-place assembly. Both formats contain identical electronic components; packaging format selection depends on assembly process requirements and volume.

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