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FDMC8588 N-Channel MOSFET Equivalent & Substitute Parts
Part Overview
The FDMC8588 is an N-Channel 25V power MOSFET manufactured by onsemi, part of the PowerTrench® series. This device is rated for 16.5A continuous drain current (Ta) and 40A (Tc) with a maximum drain-to-source voltage of 25V. The FDMC8588 is classified as obsolete, necessitating identification of equivalent and substitute components for ongoing design requirements and production continuity. Substitute parts must maintain compatibility with the original electrical specifications and surface mount packaging requirements.
Substiute Parts
Key Parameters
| Parameter | FDMC8588 Specification |
|---|---|
| Drain-to-Source Voltage (Vdss) | 25V |
| Continuous Drain Current (Id) @ 25°C | 16.5A (Ta), 40A (Tc) |
| RDS(on) Max @ Id, Vgs | 5mOhm @ 17A, 10V |
| Gate Threshold Voltage (Vgs(th)) Max @ Id | 1.8V @ 250µA |
| Gate Charge (Qg) Max @ Vgs | 12nC @ 4.5V |
| Input Capacitance (Ciss) Max @ Vds | 1228pF @ 13V |
| Power Dissipation (Max) | 2.4W (Ta), 26W (Tc) |
| Operating Temperature Range | -55°C to 150°C (TJ) |
| Mounting Type | Surface Mount |
| Package | 8-PowerTDFN |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution of the FDMC8588 is determined by the following critical electrical parameters:
Primary Substitution Criteria:
- Drain-to-Source Voltage (Vdss) rating of 25V or higher
- Continuous drain current capability meeting or exceeding 16.5A (Ta) and 40A (Tc)
- RDS(on) characteristics compatible with the original 5mOhm specification
- Gate threshold voltage within acceptable operating range
- Surface mount packaging with compatible footprint
Secondary Compatibility Factors:
- Operating temperature range of -55°C to 150°C
- RoHS3 compliance and MSL 1 rating
- N-Channel MOSFET technology (Metal Oxide)
The substitute parts identified (CSD16323Q3, CSD16327Q3, CSD16340Q3, CSD16406Q3, and FDMC8651) meet these criteria with varying performance characteristics. The FDMC8651 is an onsemi alternative within the same PowerTrench® series. The Texas Instruments NexFET™ devices (CSD series) provide equivalent or superior electrical performance with different packaging configurations.
Parameter Comparison
| Parameter | FDMC8588 | FDMC8651 | CSD16323Q3 | CSD16327Q3 | CSD16340Q3 | CSD16406Q3 |
|---|---|---|---|---|---|---|
| Manufacturer | onsemi | onsemi | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Vdss (V) | 25 | 30 | 25 | 25 | 25 | 25 |
| Id (Ta) (A) | 16.5 | 15 | 21 | — | 21 | 19 |
| Id (Tc) (A) | 40 | 20 | 60 | 60 | 60 | 60 |
| RDS(on) Max (mOhm) | 5 @ 17A, 10V | 6.1 @ 15A, 4.5V | 4.5 @ 24A, 8V | 4 @ 24A, 8V | 4.5 @ 20A, 8V | 5.3 @ 20A, 10V |
| Vgs(th) Max (V) @ Id | 1.8 @ 250µA | 1.5 @ 250µA | 1.4 @ 250µA | 1.4 @ 250µA | 1.1 @ 250µA | 2.2 @ 250µA |
| Qg Max (nC) @ Vgs | 12 @ 4.5V | 27.2 @ 4.5V | 8.4 @ 4.5V | 8.4 @ 4.5V | 9.2 @ 4.5V | 8.1 @ 4.5V |
| Ciss Max (pF) @ Vds | 1228 @ 13V | 3365 @ 15V | 1300 @ 12.5V | 1300 @ 12.5V | 1350 @ 12.5V | 1100 @ 12.5V |
| Power Dissipation Max (W) | 2.4 (Ta), 26 (Tc) | 2.3 (Ta), 41 (Tc) | 3 (Ta) | 3 (Ta) | 3 (Ta) | 2.7 (Ta) |
| Operating Temperature (°C) | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 |
| Package | 8-PowerTDFN | 8-PowerTDFN | 8-VSON-CLIP (3.3x3.3) | 8-VSON-CLIP (3.3x3.3) | 8-VSON-CLIP (3.3x3.3) | 8-VSON-CLIP (3.3x3.3) |
| Product Status | Obsolete | Active | Active | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| MSL Rating | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
FDMC8651 (onsemi PowerTrench®)
The FDMC8651 is the direct onsemi alternative within the PowerTrench® series. It maintains the same 8-PowerTDFN package and surface mount configuration. The FDMC8651 features a higher Vdss rating of 30V, providing additional voltage margin. Continuous drain current is rated at 15A (Ta) and 20A (Tc), which is lower than the FDMC8588. This device is suitable for applications where the reduced current rating is acceptable and the higher voltage rating provides design flexibility. The FDMC8651 is in active production status with full RoHS3 compliance and MSL 1 rating.
CSD16323Q3 and CSD16340Q3 (Texas Instruments NexFET™)
Both CSD16323Q3 and CSD16340Q3 are Texas Instruments NexFET™ devices rated for 25V with 21A (Ta) and 60A (Tc) continuous drain current. These devices exceed the FDMC8588 current specifications and feature lower RDS(on) values (4.5mOhm). The CSD16340Q3 offers a lower gate threshold voltage (1.1V) compared to the FDMC8588 (1.8V), enabling faster switching response. Both devices use the 8-VSON-CLIP (3.3x3.3) package, which differs from the original 8-PowerTDFN footprint and requires PCB layout verification. Both are in active production with RoHS3 compliance and MSL 1 rating.
CSD16327Q3 (Texas Instruments NexFET™)
The CSD16327Q3 is a high-performance NexFET™ device rated for 25V with 60A (Tc) continuous drain current. This device features the lowest RDS(on) specification (4mOhm @ 24A, 8V) among the substitute options, providing superior efficiency. The CSD16327Q3 uses the 8-VSON-CLIP (3.3x3.3) package and is in active production with full RoHS3 compliance and MSL 1 rating.
CSD16406Q3 (Texas Instruments NexFET™)
The CSD16406Q3 is a NexFET™ device rated for 25V with 19A (Ta) and 60A (Tc) continuous drain current. This device closely matches the FDMC8588 continuous drain current specification at Ta rating. The RDS(on) specification is 5.3mOhm, comparable to the original device. The CSD16406Q3 features a higher gate threshold voltage (2.2V) and higher maximum gate voltage rating (±16V/-12V). The 8-VSON-CLIP (3.3x3.3) package requires PCB layout verification. The device is in active production with RoHS3 compliance and MSL 1 rating.
All substitute parts maintain the required operating temperature range (-55°C to 150°C), RoHS3 compliance, and MSL 1 rating. Selection should be based on specific application requirements regarding current capacity, RDS(on) performance, and package compatibility.
Frequently Asked Questions (FAQ)
Q: Can the FDMC8651 be used as a direct replacement for the FDMC8588?
A: The FDMC8651 maintains the same 8-PowerTDFN package and surface mount configuration, enabling direct PCB placement. However, the FDMC8651 has a lower continuous drain current rating (15A Ta, 20A Tc) compared to the FDMC8588 (16.5A Ta, 40A Tc). Applications requiring the full current capacity of the FDMC8588 must evaluate whether the reduced rating is acceptable. The higher Vdss rating (30V vs 25V) provides additional voltage margin.
Q: What is the primary difference between the onsemi and Texas Instruments substitute options?
A: The FDMC8651 maintains the original 8-PowerTDFN package footprint, simplifying PCB integration. The Texas Instruments CSD series devices use the 8-VSON-CLIP (3.3x3.3) package, which differs in physical dimensions and pin configuration. The CSD series devices generally offer higher current ratings (60A Tc) and lower RDS(on) values, providing improved performance but requiring PCB layout modifications.
Q: Are the Texas Instruments CSD devices pin-compatible with the FDMC8588?
A: The CSD series devices use the 8-VSON-CLIP package, which differs from the FDMC8588 8-PowerTDFN package. While both are 8-pin surface mount packages, the physical dimensions and pin layouts are not identical. PCB layout verification is required before substitution.
Q: Which substitute part offers the best RDS(on) performance?
A: The CSD16327Q3 features the lowest RDS(on) specification at 4mOhm (@ 24A, 8V), followed by the CSD16323Q3 and CSD16340Q3 at 4.5mOhm. The FDMC8588 and CSD16406Q3 are specified at 5mOhm and 5.3mOhm respectively. Lower RDS(on) values reduce power dissipation and heat generation in switching applications.
Q: Do all substitute parts meet the same compliance requirements as the FDMC8588?
A: All identified substitute parts are RoHS3 compliant and rated MSL 1 (Unlimited moisture sensitivity level), matching the FDMC8588 compliance profile. All devices operate across the -55°C to 150°C temperature range. Compliance documentation should be verified with the respective manufacturers for specific applications.
Q: What is the significance of gate charge (Qg) differences among the substitute parts?
A: Gate charge affects switching speed and driver circuit requirements. The FDMC8588 is specified at 12nC (@ 4.5V). The CSD16327Q3 and CSD16406Q3 feature lower gate charge (8.4nC and 8.1nC respectively), enabling faster switching transitions. The FDMC8651 has significantly higher gate charge (27.2nC), which may require driver circuit adjustments.
Q: Can the FDMC8651 be used in high-current applications requiring 40A (Tc)?
A: The FDMC8651 is rated for 20A (Tc) continuous drain current, which is insufficient for applications requiring the full 40A (Tc) capability of the FDMC8588. For high-current applications, the Texas Instruments CSD series devices (rated 60A Tc) are more suitable alternatives.
Q: What packaging considerations should be evaluated before selecting a substitute?
A: The FDMC8588 uses the 8-PowerTDFN package. The FDMC8651 maintains this package, allowing direct PCB substitution. The Texas Instruments CSD series devices use the 8-VSON-CLIP (3.3x3.3) package, requiring PCB layout modifications including trace routing, thermal vias, and component placement verification. Mechanical clearance and thermal management characteristics must be evaluated for each package type.
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