FDMC8026S N-Channel 30V 19A/21A MOSFET Equivalent & Substitute Parts

Part Overview

The FDMC8026S is an N-Channel MOSFET manufactured by onsemi, rated for 30V drain-to-source voltage with continuous drain current of 19A (Ta) and 21A (Tc). The device is housed in an 8-MLP (3.3x3.3) surface mount package and is part of the PowerTrench® and SyncFET™ series. This part is currently marked as obsolete, necessitating identification of equivalent and substitute components for ongoing design support and production requirements.

Key Parameters

Parameter	Value	Unit
Drain-to-Source Voltage (Vdss)	30	V
Continuous Drain Current @ 25°C (Ta)	19	A
Continuous Drain Current @ 25°C (Tc)	21	A
RDS(on) Max @ 19A, 10V	4.4	mOhm
Gate Threshold Voltage (Vgs(th)) @ 1mA	3	V
Gate Charge (Qg) @ 10V	52	nC
Input Capacitance (Ciss) @ 15V	3165	pF
Power Dissipation (Ta)	2.4	W
Power Dissipation (Tc)	36	W
Operating Temperature Range	-55 to 150	°C
Package Type	8-MLP (3.3x3.3)	Surface Mount
RoHS Status	ROHS3 Compliant	—

Substitute Part Grouping Explanation

Substitution of the FDMC8026S is determined by the following critical parameters:

Electrical Compatibility Requirements:

Drain-to-Source Voltage (Vdss) must equal or exceed 30V
Continuous drain current must support minimum 19A (Ta) operation
RDS(on) characteristics must be compatible with circuit switching requirements
Gate threshold voltage and gate charge must be within acceptable control circuit tolerances
Operating temperature range must encompass -55°C to 150°C

Mechanical Compatibility Requirements:

Surface mount package type (8-pin configurations acceptable)
Package footprint compatibility with PCB layout constraints
Moisture sensitivity level and thermal characteristics suitable for application environment

Compliance Requirements:

RoHS3 compliance mandatory
REACH unaffected status required
EAR99 export classification maintained

Substitute parts are grouped into two categories: parametric equivalents (matching electrical specifications within tolerance) and functional alternatives (meeting electrical requirements with acceptable performance trade-offs).

Parameter Comparison

Parameter	FDMC8026S	FDMC0310AS-F127-L701	NTTFS4C06NTAG	AON7534	AON7530	CSD17577Q3AT	RQ3E180GNTB
Manufacturer	onsemi	onsemi	onsemi	Alpha & Omega	Alpha & Omega	Texas Instruments	Rohm Semiconductor
Vdss (V)	30	30	30	30	30	30	30
Id @ 25°C Ta (A)	19	19	11	20	24	35	18
Id @ 25°C Tc (A)	21	21	67	30	30	—	39
RDS(on) Max @ 10V (mOhm)	4.4	4.4	4.2	5	4.7	4.8	4.3
Vgs(th) @ Id (V)	3 @ 1mA	3 @ 1mA	2.2 @ 250µA	2.2 @ 250µA	2.2 @ 250µA	1.8 @ 250µA	2.5 @ 1mA
Qg @ 10V (nC)	52	52	36	22	18.8	35	22.4
Ciss @ 15V (pF)	3165	3165	3366	1037	1320	2310	1520
Power Dissipation Ta (W)	2.4	2.4	0.81	3	24	2.8	2
Power Dissipation Tc (W)	36	36	31	23	24	53	20
Operating Temp Range (°C)	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150	-55 to 150
Package Type	8-MLP (3.3x3.3)	8-WDFN (3.3x3.3)	8-WDFN (3.3x3.3)	8-DFN-EP (3x3)	8-DFN-EP (3x3)	8-VSONP (3x3.3)	8-HSMT (3.2x3)
Product Status	Obsolete	Last Time Buy	Active	Not For New Designs	Active	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

Parametric Equivalent (Direct Replacement):

The FDMC0310AS-F127-L701 is a parametric equivalent to the FDMC8026S. Both devices share identical electrical specifications including 30V Vdss, 19A (Ta) / 21A (Tc) continuous drain current, 4.4 mOhm RDS(on), and 52 nC gate charge. The primary difference is the package variant: FDMC0310AS-F127-L701 uses 8-WDFN (3.3x3.3) versus the original 8-MLP (3.3x3.3). Both packages maintain identical footprint dimensions (3.3x3.3mm), enabling direct PCB substitution. FDMC0310AS-F127-L701 carries Last Time Buy status, indicating limited availability. ROHS3 compliance and operating temperature range (-55°C to 150°C) are maintained.

Active Substitute Options:

NTTFS4C06NTAG (onsemi, Active status) meets the 30V Vdss requirement with 11A (Ta) / 67A (Tc) continuous drain current. RDS(on) is 4.2 mOhm at 10V, slightly lower than the original. Gate charge is reduced to 36 nC, and input capacitance is marginally higher at 3366 pF. This device is suitable for applications where the 11A (Ta) rating is sufficient and lower gate charge is beneficial for switching speed. Package is 8-WDFN (3.3x3.3), maintaining footprint compatibility.

AON7534 (Alpha & Omega Semiconductor, Not For New Designs status) provides 30V Vdss with 20A (Ta) / 30A (Tc) continuous drain current. RDS(on) is 5 mOhm, slightly higher than the original. Gate charge is significantly reduced to 22 nC. Input capacitance is substantially lower at 1037 pF. Package is 8-DFN-EP (3x3), requiring PCB layout verification due to different footprint dimensions. This device is not recommended for new designs but remains available for legacy system support.

AON7530 (Alpha & Omega Semiconductor, Active status) offers 30V Vdss with 24A (Ta) / 30A (Tc) continuous drain current, exceeding the original current rating. RDS(on) is 4.7 mOhm at 10V. Gate charge is 18.8 nC, and input capacitance is 1320 pF. Package is 8-DFN-EP (3x3), requiring PCB layout verification. This device provides higher current capability with lower gate charge, suitable for applications requiring enhanced performance.

CSD17577Q3AT (Texas Instruments, Active status, NexFET™ series) provides 30V Vdss with 35A (Ta) continuous drain current. RDS(on) is 4.8 mOhm at 10V. Gate charge is 35 nC, and input capacitance is 2310 pF. Package is 8-VSONP (3x3.3), maintaining similar footprint dimensions. This device offers significantly higher current capability and is actively supported by the manufacturer.

RQ3E180GNTB (Rohm Semiconductor, Active status) meets 30V Vdss with 18A (Ta) / 39A (Tc) continuous drain current, closely matching the original Ta rating. RDS(on) is 4.3 mOhm at 10V. Gate charge is 22.4 nC, and input capacitance is 1520 pF. Package is 8-HSMT (3.2x3), requiring PCB layout verification due to different footprint dimensions (3.2x3 versus 3.3x3.3). This device provides near-equivalent performance with active manufacturer support.

Compliance and Availability:

All substitute parts maintain ROHS3 compliance, REACH unaffected status, and EAR99 export classification. Selection should prioritize parts with Active product status for long-term supply chain stability. FDMC0310AS-F127-L701 is recommended as the primary replacement due to parametric equivalence, though Last Time Buy status requires expedited procurement planning. For new designs, NTTFS4C06NTAG, AON7530, CSD17577Q3AT, or RQ3E180GNTB are recommended based on specific application current and switching requirements.

Frequently Asked Questions (FAQ)

Q: Can FDMC0310AS-F127-L701 be used as a direct replacement for FDMC8026S?

A: Yes. FDMC0310AS-F127-L701 is a parametric equivalent with identical electrical specifications (30V Vdss, 19A Ta / 21A Tc, 4.4 mOhm RDS(on), 52 nC gate charge). Both devices use 8-pin surface mount packages with identical 3.3x3.3mm footprints, enabling direct PCB substitution without circuit modification. The primary difference is package designation (8-WDFN versus 8-MLP), which does not affect electrical performance or mechanical compatibility.

Q: Why is FDMC8026S marked as obsolete?

A: FDMC8026S is obsolete due to manufacturer discontinuation. onsemi has transitioned to equivalent devices such as FDMC0310AS-F127-L701 (Last Time Buy status) and NTTFS4C06NTAG (Active status). Obsolescence is common in semiconductor manufacturing as product lines are consolidated and improved versions are released.

Q: What is the difference between Ta and Tc current ratings?

A: Ta represents continuous drain current at ambient temperature (25°C), while Tc represents continuous drain current at case temperature (25°C). Tc ratings are typically higher because they reflect thermal management through the device package and PCB. Circuit design should use the Ta rating for conservative thermal calculations unless active cooling is implemented.

Q: Can I use AON7534 or AON7530 as substitutes?

A: AON7534 and AON7530 meet the 30V Vdss requirement and provide comparable or higher current ratings. However, both use 8-DFN-EP (3x3) packages, which have different footprint dimensions than the original 8-MLP (3.3x3.3). PCB layout verification is required to confirm mechanical compatibility. AON7534 carries Not For New Designs status, limiting its suitability for new applications. AON7530 is Active and recommended for applications requiring higher current capability.

Q: What are the key electrical differences between substitute parts?

A: Substitute parts vary primarily in gate charge (Qg), input capacitance (Ciss), and continuous drain current ratings. Lower gate charge (18.8 to 36 nC versus 52 nC) enables faster switching speeds, beneficial for high-frequency applications. Lower input capacitance reduces gate drive circuit complexity. Higher continuous drain current ratings (24A to 35A) provide design margin for thermal management. RDS(on) values remain within 4.2 to 5 mOhm, maintaining similar conduction losses.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All substitute parts listed (FDMC0310AS-F127-L701, NTTFS4C06NTAG, AON7534, AON7530, CSD17577Q3AT, RQ3E180GNTB) are RoHS3 compliant and REACH unaffected. Compliance status is maintained across all alternatives.

Q: Which substitute part is recommended for new designs?

A: For new designs, NTTFS4C06NTAG, AON7530, CSD17577Q3AT, or RQ3E180GNTB are recommended due to Active product status and ongoing manufacturer support. NTTFS4C06NTAG maintains the same manufacturer (onsemi) and package footprint (8-WDFN 3.3x3.3). CSD17577Q3AT offers the highest current rating (35A) and active support from Texas Instruments. AON7530 provides balanced performance with higher current capability. Selection depends on specific application requirements for current, switching frequency, and thermal management.

Q: What package compatibility issues should I consider?

A: The original FDMC8026S uses 8-MLP (3.3x3.3). FDMC0310AS-F127-L701 and NTTFS4C06NTAG use 8-WDFN (3.3x3.3), maintaining identical footprint dimensions and enabling direct substitution. CSD17577Q3AT uses 8-VSONP (3x3.3), which is compatible with similar footprint spacing. AON7534 and AON7530 use 8-DFN-EP (3x3), and RQ3E180GNTB uses 8-HSMT (3.2x3), both requiring PCB layout verification due to different footprint dimensions. Consult package datasheets and PCB design files before substitution.

Q: What is the operating temperature range for all substitute parts?

A: All substitute parts operate across -55°C to 150°C junction temperature range, matching the original FDMC8026S specification. This range is suitable for industrial and automotive applications requiring extended temperature operation.

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