FDMC7692S N-Channel 30V MOSFET Equivalent & Substitute Parts

Part Overview

The FDMC7692S is an N-Channel 30V MOSFET manufactured by onsemi, featuring 12.5A continuous drain current (Ta) and 18A (Tc) in an 8-MLP surface mount package. This device operates within the PowerTrench® and SyncFET™ series and maintains Active product status with full RoHS3 compliance. The part is suitable for applications requiring efficient switching and power management in compact form factors.

Substitute parts are identified when equivalent electrical performance can be achieved within the specified voltage, current, and thermal operating ranges while maintaining compatible package footprints and compliance certifications.

Key Parameters

Parameter	FDMC7692S Value	Unit
Drain to Source Voltage (Vdss)	30	V
Continuous Drain Current @ 25°C (Ta)	12.5	A
Continuous Drain Current @ 25°C (Tc)	18	A
Rds On (Max) @ 12.5A, 10V	9.3	mOhm
Gate Charge (Qg) @ 10V	23	nC
Input Capacitance (Ciss) @ 15V	1385	pF
Power Dissipation (Ta)	2.3	W
Power Dissipation (Tc)	27	W
Operating Temperature Range	-55 to 150	°C
Package Type	8-MLP (3.3x3.3)	-
FET Type	N-Channel	-
Technology	MOSFET (Metal Oxide)	-
RoHS Status	ROHS3 Compliant	-
Product Status	Active	-

Substitute Part Grouping Explanation

Substitute parts are classified based on the following critical parameters that determine functional equivalence:

Primary Substitution Criteria:

Drain to Source Voltage (Vdss): Must equal 30V
FET Type: Must be N-Channel
Technology: Must be MOSFET (Metal Oxide)
Operating Temperature Range: Must support -55°C to 150°C
RoHS Status: Must be ROHS3 Compliant
Mounting Type: Must be Surface Mount

Secondary Compatibility Parameters:

Continuous Drain Current (Id @ Ta): Minimum 12.5A required
Rds On (Max): Should not exceed 10.4 mOhm to maintain switching efficiency
Gate Charge (Qg): Lower values preferred for faster switching
Package Footprint: 8-pin configurations with compatible pinouts

Substitutes are grouped into two categories: Direct Equivalents (matching current ratings and package dimensions) and Functional Alternatives (meeting electrical requirements with acceptable performance trade-offs).

Parameter Comparison

Part Number	Manufacturer	Vdss (V)	Id @ Ta (A)	Id @ Tc (A)	Rds On Max (mOhm)	Qg @ 10V (nC)	Ciss @ 15V (pF)	Package	Product Status
FDMC7692S	onsemi	30	12.5	18	9.3	23	1385	8-MLP (3.3x3.3)	Active
NTTFS4C13NTAG	onsemi	30	7.2	-	9.4	7.8	770	8-WDFN (3.3x3.3)	Active
BSZ088N03LSGATMA1	Infineon	30	12	40	8.8	21	1700	PG-TSDSON-8	Not For New Designs
BSZ100N03LSGATMA1	Infineon	30	12	40	10	17	1500	PG-TSDSON-8	Not For New Designs
BSZ100N03MSGATMA1	Infineon	30	10	40	9.1	23	1700	PG-TSDSON-8	Active
BSZ130N03LSGATMA1	Infineon	30	10	35	13	13	970	PG-TSDSON-8	Active
BSZ130N03MSGATMA1	Infineon	30	9	35	11.5	17	1300	PG-TSDSON-8	Active
CSD17308Q3	Texas Instruments	30	14	44	10.3	5.1	700	8-VSON-CLIP (3.3x3.3)	Active
CSD17579Q3A	Texas Instruments	30	20	-	10.2	15	998	8-VSONP (3x3.3)	Active
CSD17579Q3AT	Texas Instruments	30	20	-	10.2	15	998	8-VSONP (3x3.3)	Active
RQ3E100BNTB	Rohm Semiconductor	30	10	-	10.4	22	1100	8-HSMT (3.2x3)	Active

Engineering Selection Recommendations

Tier 1 - Direct Equivalents (Preferred for New Designs):

CSD17308Q3 and CSD17579Q3A from Texas Instruments represent the most suitable substitutes. Both maintain 30V Vdss rating, exceed the 12.5A continuous current requirement, and carry Active product status. CSD17308Q3 delivers 14A (Ta) with superior gate charge characteristics (5.1 nC), enabling faster switching transitions. CSD17579Q3A provides 20A (Ta) continuous current, offering increased thermal headroom for demanding applications. Both devices are RoHS3 compliant and support the full -55°C to 150°C operating range.

Tier 2 - Functional Alternatives (Active Status):

BSZ100N03MSGATMA1 and BSZ130N03LSGATMA1 from Infineon Technologies provide viable alternatives with Active product status. BSZ100N03MSGATMA1 delivers 10A (Ta) with 9.1 mOhm Rds On, suitable for applications where the 12.5A rating is not critical. BSZ130N03LSGATMA1 offers 10A (Ta) with lower gate charge (13 nC), beneficial for high-frequency switching circuits. Both maintain 30V Vdss and full temperature range support.

Tier 3 - Legacy Alternatives (Not Recommended for New Designs):

BSZ088N03LSGATMA1 and BSZ100N03LSGATMA1 carry "Not For New Designs" status and should be avoided in new product development. These parts remain available for legacy system maintenance and repair applications only.

Package Compatibility Considerations:

The FDMC7692S uses 8-MLP (3.3x3.3) packaging. Substitutes employ alternative 8-pin surface mount packages (8-WDFN, PG-TSDSON-8, 8-VSON-CLIP, 8-VSONP, 8-HSMT). PCB layout modifications are required when switching between package types due to different pin configurations and thermal pad geometries. Verify pinout compatibility and thermal management requirements before board redesign.

Frequently Asked Questions (FAQ)

Q: Can NTTFS4C13NTAG replace FDMC7692S in all applications?

A: NTTFS4C13NTAG is not a direct replacement. While it maintains 30V Vdss and Active status, its 7.2A continuous current rating falls below the FDMC7692S 12.5A specification. This part is suitable only for applications with lower current demands. The 8-WDFN package also differs from the 8-MLP footprint, requiring PCB redesign.

Q: What is the primary advantage of CSD17579Q3A over FDMC7692S?

A: CSD17579Q3A provides 20A continuous drain current compared to FDMC7692S at 12.5A, delivering 60% higher current capacity. This enables operation at lower junction temperatures in high-current applications, extending device lifetime and improving reliability. Gate charge is lower (15 nC vs. 23 nC), supporting faster switching frequencies. The trade-off is a different package footprint (8-VSONP vs. 8-MLP).

Q: Are Infineon BSZ series parts suitable for new product designs?

A: BSZ100N03MSGATMA1 and BSZ130N03LSGATMA1 carry Active product status and are suitable for new designs. However, BSZ088N03LSGATMA1 and BSZ100N03LSGATMA1 are marked "Not For New Designs" and should be reserved for legacy system support only. Verify the specific part number before design selection.

Q: How do package differences affect substitution?

A: The FDMC7692S 8-MLP (3.3x3.3) package differs from substitute packages in pin pitch, thermal pad size, and mounting footprint. CSD17308Q3 uses 8-VSON-CLIP, BSZ series use PG-TSDSON-8, and RQ3E100BNTB uses 8-HSMT. Direct PCB footprint compatibility does not exist. Schematic pinout verification and PCB layout redesign are mandatory before substitution.

Q: What is the significance of Rds On specifications in substitution?

A: Rds On (on-resistance) directly impacts power dissipation and switching efficiency. FDMC7692S specifies 9.3 mOhm maximum at 12.5A, 10V. Substitutes with lower Rds On (such as BSZ088N03LSGATMA1 at 8.8 mOhm) reduce conduction losses, improving thermal performance. Substitutes with higher Rds On (such as BSZ130N03LSGATMA1 at 13 mOhm) increase power dissipation and may require enhanced thermal management.

Q: Can gate charge differences affect circuit performance?

A: Yes. Gate charge (Qg) determines the energy required to switch the MOSFET on and off. FDMC7692S specifies 23 nC at 10V. CSD17308Q3 at 5.1 nC enables significantly faster switching with lower driver power consumption, beneficial for high-frequency applications. Conversely, higher gate charge values (such as RQ3E100BNTB at 22 nC) require more robust gate drive circuits but may offer improved noise immunity.

Q: What compliance certifications are critical for substitution?

A: All listed substitutes maintain RoHS3 compliance and REACH Unaffected status, matching FDMC7692S certifications. Moisture Sensitivity Level (MSL) is 1 (Unlimited) across all parts, eliminating moisture-related handling constraints. ECCN classification (EAR99) and HTSUS codes are identical, ensuring regulatory equivalence for export and procurement purposes.

Q: Is thermal performance equivalent across all substitutes?

A: No. Power dissipation ratings vary significantly. FDMC7692S dissipates 2.3W (Ta) and 27W (Tc). CSD17579Q3A matches at 3.2W (Ta) and 29W (Tc), while BSZ130N03LSGATMA1 dissipates 2.1W (Ta) and 25W (Tc). Applications with tight thermal budgets require detailed thermal analysis when substituting parts with different power dissipation profiles.

Request Quote (Ships tomorrow)

Part Number

Quantity

Company

Contact Name

E-mail

Message