FDMC7200S Equivalent & Substitute Parts

Part Overview

The FDMC7200S is an active dual N-channel MOSFET array manufactured by onsemi, designed for surface mount applications in the PowerTrench® series. This component features a 30V drain-to-source voltage rating with continuous drain current capabilities of 7A and 13A, housed in an 8-Power33 (3x3) package. The device operates across a temperature range of -55°C to 150°C and is RoHS3 compliant with unlimited moisture sensitivity level rating.

Equivalent and substitute parts are identified when alternative components meet or exceed the electrical and mechanical specifications of the FDMC7200S while maintaining compatibility with the same package footprint and mounting requirements. Substitutes are necessary to address supply chain availability, inventory levels, or design flexibility across multiple qualified component sources.

Substiute Parts

FDMC7200S

onsemiIn Stock: 2406FDMC7200S Datasheet

Current PartRFQ

TSM200N03DPQ33 RGG

Taiwan Semiconductor CorporationIn Stock: 15742TSM200N03DPQ33 RGG Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The TSM200N03DPQ33 RGG from Taiwan Semiconductor Corporation qualifies as a substitute for the FDMC7200S based on the following substitution criteria:

Matching Parameters:

• Drain to Source Voltage (Vdss): 30V (identical)
• Configuration: 2 N-Channel (Dual) (identical)
• Mounting Type: Surface Mount (identical)
• Package / Case: 8-PowerWDFN (identical)
• Supplier Device Package: 8-PDFN (3x3) (compatible footprint)
• Operating Temperature Range: -55°C to 150°C (identical)
• RoHS Status: ROHS3 Compliant (identical)
• Moisture Sensitivity Level (MSL): 1 (Unlimited) (identical)
• REACH Status: REACH Unaffected (identical)
• ECCN: EAR99 (identical)
• HTSUS: 8541.29.0095 (identical)

Performance Advantages:

• Current - Continuous Drain (Id): 20A (Tc) exceeds FDMC7200S ratings of 7A and 13A
• Rds On (Max): 20mOhm @ 10A, 10V is lower than FDMC7200S 22mOhm @ 6A, 10V
• Power - Max: 20W exceeds FDMC7200S ratings of 700mW and 1W
• Gate Charge (Qg): 4nC @ 4.5V is lower than FDMC7200S 10nC @ 10V
• Input Capacitance (Ciss): 345pF @ 25V is lower than FDMC7200S 660pF @ 15V

The TSM200N03DPQ33 RGG maintains electrical compatibility while providing enhanced performance characteristics across current handling, thermal dissipation, and switching speed parameters.

Parameter Comparison

Engineering Selection Recommendations

Both the FDMC7200S and TSM200N03DPQ33 RGG are active products with identical regulatory compliance status. Both components are RoHS3 compliant, REACH unaffected, and classified under ECCN EAR99 with matching HTSUS codes. Both maintain unlimited moisture sensitivity level ratings and operate across the full industrial temperature range of -55°C to 150°C.

The TSM200N03DPQ33 RGG provides superior electrical performance in continuous drain current capacity, on-resistance characteristics, and thermal dissipation capability. The substitute component exhibits lower gate charge and input capacitance values, which result in faster switching characteristics and reduced driver requirements.

Component selection between the FDMC7200S and TSM200N03DPQ33 RGG should be based on supply chain availability, inventory levels, and design margin requirements. Both components are suitable for direct substitution in applications where the FDMC7200S specifications are met or exceeded.

Frequently Asked Questions (FAQ)

Q: Can the TSM200N03DPQ33 RGG be used as a direct replacement for the FDMC7200S?

A: Yes. Both components share identical drain-to-source voltage ratings (30V), dual N-channel configuration, surface mount mounting type, and 8-PowerWDFN package footprint. The TSM200N03DPQ33 RGG exceeds the electrical specifications of the FDMC7200S across current handling, on-resistance, and thermal dissipation parameters.

Q: Are there any package compatibility concerns between these two parts?

A: Both components use the 8-PowerWDFN package type with 3x3mm footprints. The TSM200N03DPQ33 RGG is specified as 8-PDFN (3x3) while the FDMC7200S is specified as 8-Power33 (3x3). These package designations are compatible for PCB layout and assembly purposes.

Q: What are the key electrical differences between these components?

A: The TSM200N03DPQ33 RGG provides higher continuous drain current (20A versus 7A/13A), lower on-resistance (20mOhm versus 22mOhm), lower gate charge (4nC versus 10nC), and lower input capacitance (345pF versus 660pF). These characteristics result in improved thermal performance and faster switching speed.

Q: Do both components meet the same regulatory requirements?

A: Yes. Both the FDMC7200S and TSM200N03DPQ33 RGG are RoHS3 compliant, REACH unaffected, and classified under ECCN EAR99. Both components carry unlimited moisture sensitivity level ratings and operate across identical temperature ranges.

Q: What is the operating temperature range for both components?

A: Both the FDMC7200S and TSM200N03DPQ33 RGG operate across a junction temperature range of -55°C to 150°C, suitable for industrial and automotive applications.

Q: Are there differences in gate threshold voltage between these components?

A: The TSM200N03DPQ33 RGG has a lower maximum gate threshold voltage of 2.5V @ 250µA compared to the FDMC7200S at 3V @ 250µA. This difference may affect gate driver design considerations in applications with marginal gate drive voltage levels.