FDMA6023PZT Equivalent & Substitute Parts

Part Overview

The FDMA6023PZT is a dual P-channel MOSFET array manufactured by onsemi, designed for surface mount applications in the 6-MicroFET (2x2) package. This component features a 20V drain-to-source voltage rating with 3.6A continuous drain current capability and logic level gate operation. The FDMA6023PZT is classified as obsolete, necessitating identification of active equivalent and substitute parts for new designs and ongoing production requirements. Substitute parts must maintain electrical compatibility across critical parameters including voltage rating, current capacity, on-resistance characteristics, and thermal performance while accommodating different package geometries.

Substiute Parts

FDMA6023PZT
onsemiIn Stock: 4896FDMA6023PZT Datasheet
FDMA6023PZT
Current Part
DMP2160UFDB-7
Diodes IncorporatedIn Stock: 110309DMP2160UFDB-7 Datasheet
DMP2160UFDB-7
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DMP2160UFDBQ-7
Diodes IncorporatedIn Stock: 17444DMP2160UFDBQ-7 Datasheet
DMP2160UFDBQ-7
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PMDPB58UPE,115
Nexperia USA Inc.In Stock: 3670PMDPB58UPE,115 Datasheet
PMDPB58UPE,115
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TSM500P02DCQ RFG
Taiwan Semiconductor CorporationIn Stock: 335821TSM500P02DCQ RFG Datasheet
TSM500P02DCQ RFG
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Key Parameters

Parameter Value Unit
Configuration 2 P-Channel (Dual)
Drain to Source Voltage (Vdss) 20 V
Current - Continuous Drain (Id) @ 25°C 3.6 A
Rds On (Max) @ Id, Vgs 60 mOhm @ 3.6A, 4.5V
Vgs(th) (Max) @ Id 1.5 V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 17 nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds 885 pF @ 10V
Power - Max 700 mW
Operating Temperature Range -55 to 150 °C (TJ)
Mounting Type Surface Mount
Package / Case 6-UDFN Exposed Pad
Technology MOSFET (Metal Oxide)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the FDMA6023PZT is determined by strict adherence to the following electrical and mechanical parameters:

Critical Matching Parameters:

  • Configuration: 2 P-Channel (Dual) MOSFET array
  • Drain to Source Voltage (Vdss): 20V minimum
  • Continuous Drain Current (Id): 3.6A or greater at 25°C
  • On-Resistance (Rds On): 70 mOhm or lower at rated conditions
  • Gate Threshold Voltage (Vgs(th)): Logic level operation (≤1.5V)
  • Operating Temperature Range: -55°C to 150°C minimum
  • Surface Mount configuration with exposed pad
  • RoHS3 compliance and MSL rating compatibility

Package Considerations: Substitute parts may utilize different 6-pin surface mount packages (6-UDFN, 6-HUSON, 6-TDFN) provided the electrical performance meets or exceeds the FDMA6023PZT specifications. Package geometry differences require PCB layout verification but do not preclude functional substitution.

The identified substitute parts (DMP2160UFDB-7, DMP2160UFDBQ-7, PMDPB58UPE,115, and TSM500P02DCQ RFG) satisfy these criteria with active product status and enhanced or equivalent electrical performance characteristics.

Parameter Comparison

Parameter FDMA6023PZT (Main) DMP2160UFDB-7 DMP2160UFDBQ-7 PMDPB58UPE,115 TSM500P02DCQ RFG
Manufacturer onsemi Diodes Incorporated Diodes Incorporated Nexperia USA Inc. Taiwan Semiconductor Corporation
Configuration 2 P-Channel (Dual) 2 P-Channel (Dual) 2 P-Channel (Dual) 2 P-Channel (Dual) 2 P-Channel (Dual)
Vdss 20V 20V 20V 20V 20V
Id @ 25°C 3.6A 3.8A 3.8A 3.6A 4.7A (Tc)
Rds On (Max) 60 mOhm @ 3.6A, 4.5V 70 mOhm @ 2.8A, 4.5V 70 mOhm @ 2.8A, 4.5V 67 mOhm @ 2A, 4.5V 50 mOhm @ 3A, 4.5V
Vgs(th) (Max) @ 250µA 1.5V 900mV 900mV 950mV 800mV
Gate Charge (Qg) @ 4.5V 17nC 6.5nC 6.5nC 9.5nC 9.6nC
Input Capacitance (Ciss) @ 10V 885pF 536pF 536pF 804pF 1230pF
Power - Max 700mW 1.4W 1.4W 515mW 620mW
Operating Temperature -55 to 150°C (TJ) -55 to 150°C (TJ) -55 to 150°C (TJ) -55 to 150°C (TJ) -50 to 150°C (TJ)
Package / Case 6-UDFN Exposed Pad 6-UDFN Exposed Pad 6-UDFN Exposed Pad 6-UFDFN Exposed Pad 6-VDFN Exposed Pad
Product Status Obsolete Active Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 3 (168 Hours)

Engineering Selection Recommendations

Primary Substitutes (Diodes Incorporated DMP2160 Series):

The DMP2160UFDB-7 and DMP2160UFDBQ-7 represent the most direct electrical equivalents to the FDMA6023PZT. Both variants feature identical electrical specifications with 3.8A continuous drain current, 20V Vdss rating, and 70 mOhm on-resistance. These parts maintain active product status with unlimited MSL rating and ROHS3 compliance. The DMP2160 series demonstrates superior gate charge characteristics (6.5nC versus 17nC) and lower input capacitance (536pF versus 885pF), resulting in improved switching performance. Both DMP2160 variants are packaged in 6-UDFN format, maintaining geometric compatibility with the original FDMA6023PZT footprint. Inventory availability exceeds 100,000 units across both variants.

Secondary Substitute (Nexperia PMDPB58UPE,115):

The PMDPB58UPE,115 provides functional equivalence with matched 3.6A continuous drain current and 20V Vdss rating. This part features 67 mOhm on-resistance and 950mV gate threshold voltage, maintaining logic level gate operation. The PMDPB58 series offers active product status with unlimited MSL rating and ROHS3 compliance. Package geometry differs (6-HUSON versus 6-MicroFET), requiring PCB layout modification. Gate charge (9.5nC) and input capacitance (804pF) fall between the main part and DMP2160 series, providing intermediate switching characteristics. Inventory availability is 3,572 units.

Tertiary Substitute (Taiwan Semiconductor TSM500P02DCQ RFG):

The TSM500P02DCQ RFG delivers enhanced electrical performance with 4.7A continuous drain current and superior 50 mOhm on-resistance at 3A, 4.5V. The 20V Vdss rating and 800mV gate threshold voltage maintain compatibility with logic level gate applications. This part maintains active product status with ROHS3 compliance. The MSL rating of 3 (168 hours) requires controlled moisture exposure during storage and handling compared to the unlimited MSL of other substitutes. Operating temperature minimum of -50°C (versus -55°C) represents a minor deviation. Package geometry (6-TDFN) differs from the original, necessitating PCB layout verification. Inventory availability is 335,733 units, the highest among all substitutes.

Selection Criteria:

For direct footprint compatibility and minimal design modification, select DMP2160UFDB-7 or DMP2160UFDBQ-7. For enhanced thermal performance and lower on-resistance in applications with higher current demands, select TSM500P02DCQ RFG with PCB layout adjustment. For intermediate performance with alternative package geometry, select PMDPB58UPE,115. All substitutes maintain the critical dual P-channel configuration, 20V voltage rating, and logic level gate operation required for functional replacement of the obsolete FDMA6023PZT.

Frequently Asked Questions (FAQ)

Q: Can the DMP2160UFDB-7 and DMP2160UFDBQ-7 be used interchangeably with the FDMA6023PZT?

A: Yes. Both DMP2160 variants meet or exceed all critical electrical parameters of the FDMA6023PZT, including 20V Vdss, 3.8A continuous drain current, and logic level gate operation. The 6-UDFN package maintains footprint compatibility with the original 6-MicroFET design. Both variants are active products with unlimited MSL rating and ROHS3 compliance.

Q: What are the package differences between substitute parts?

A: The FDMA6023PZT uses a 6-MicroFET (2x2) package. The DMP2160 series uses 6-UDFN (identical footprint), the PMDPB58UPE,115 uses 6-HUSON, and the TSM500P02DCQ RFG uses 6-TDFN. While all are 6-pin surface mount packages with exposed pads, the HUSON and TDFN variants require PCB layout verification to confirm pad alignment and thermal performance.

Q: Which substitute offers the best thermal performance?

A: The TSM500P02DCQ RFG provides the lowest on-resistance (50 mOhm @ 3A, 4.5V) and highest power dissipation rating (620mW), resulting in superior thermal characteristics. However, this part requires PCB layout modification due to different package geometry and has an MSL rating of 3 (168 hours) versus unlimited MSL for other substitutes.

Q: Are all substitutes RoHS3 compliant?

A: Yes. All identified substitute parts (DMP2160UFDB-7, DMP2160UFDBQ-7, PMDPB58UPE,115, and TSM500P02DCQ RFG) are ROHS3 compliant and REACH unaffected, matching the compliance status of the FDMA6023PZT.

Q: What is the significance of the MSL rating difference for TSM500P02DCQ RFG?

A: The TSM500P02DCQ RFG has an MSL rating of 3 (168 hours), compared to unlimited MSL for other substitutes. This requires controlled moisture exposure during storage and handling. Parts must be stored in dry conditions and used within 168 hours of opening the moisture barrier bag. Other substitutes have unlimited MSL, allowing indefinite storage without moisture control.

Q: How do gate charge differences affect circuit performance?

A: The FDMA6023PZT has 17nC gate charge, while DMP2160 variants have 6.5nC. Lower gate charge reduces switching losses and improves switching speed in gate driver circuits. The PMDPB58UPE,115 (9.5nC) and TSM500P02DCQ RFG (9.6nC) provide intermediate gate charge characteristics. Selection depends on gate driver capability and switching frequency requirements.

Q: Can the PMDPB58UPE,115 be used as a direct replacement without PCB modification?

A: No. The PMDPB58UPE,115 uses a 6-HUSON package, which differs from the 6-MicroFET footprint of the FDMA6023PZT. PCB layout modification is required to accommodate the different pad geometry and spacing. Electrical performance is equivalent, but physical placement differs.

Q: What is the minimum operating temperature for each substitute?

A: The FDMA6023PZT, DMP2160UFDB-7, DMP2160UFDBQ-7, and PMDPB58UPE,115 all operate from -55°C. The TSM500P02DCQ RFG operates from -50°C, a 5°C higher minimum. For applications requiring -55°C operation, the TSM500 variant is not suitable.

Q: Which substitute has the highest continuous drain current rating?

A: The TSM500P02DCQ RFG provides 4.7A continuous drain current (Tc), compared to 3.8A for DMP2160 variants and 3.6A for both the FDMA6023PZT and PMDPB58UPE,115. Higher current rating provides additional design margin in high-current applications.

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