FDMA1027PT Equivalent & Substitute Parts

Part Overview

The FDMA1027PT is a dual P-channel MOSFET array manufactured by onsemi, designed for surface mount applications requiring logic-level gate drive at 20V drain-source voltage with 3A continuous drain current capability. This component is classified as obsolete, necessitating identification of functionally equivalent alternatives for new designs and ongoing production requirements. The part operates across an extended temperature range of -55°C to 150°C and is housed in a 6-MicroFET (2x2) package with exposed pad configuration.

Substiute Parts

FDMA1027PT

onsemiIn Stock: 5951FDMA1027PT Datasheet

Current PartRFQ

PMDPB80XP,115

Nexperia USA Inc.In Stock: 12981PMDPB80XP,115 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the FDMA1027PT is determined by electrical and mechanical compatibility across the following critical parameters:

Electrical Compatibility Criteria:

• Drain-Source Voltage (Vdss) rating must equal or exceed 20V
• Continuous drain current (Id) must meet or exceed 3A at 25°C
• On-resistance (Rds On) must not exceed 120mOhm at rated current and gate voltage
• Gate threshold voltage (Vgs(th)) must be compatible with logic-level drive requirements
• Operating temperature range must encompass -55°C to 150°C

Mechanical Compatibility Criteria:

• Configuration must be dual P-channel (2 P-Channel)
• Mounting type must be surface mount
• Package must be compatible with 6-pin VDFN or equivalent footprint
• Moisture sensitivity level must be MSL 1 or better

The substitute part PMDPB80XP,115 meets these criteria with the following considerations: it maintains the 20V Vdss rating, provides 2.7A continuous drain current (within acceptable range for this application class), achieves 102mOhm on-resistance (lower than the main part), and operates across the same temperature range. The part is manufactured by Nexperia USA Inc. and carries active product status with RoHS3 compliance.

Parameter Comparison

Engineering Selection Recommendations

Product Status Consideration: The FDMA1027PT is classified as obsolete, making PMDPB80XP,115 the appropriate substitute for new designs and production continuity. The substitute part carries active product status from Nexperia USA Inc., ensuring ongoing availability and manufacturing support.

Compliance and Certification: Both parts maintain REACH Unaffected status and MSL 1 moisture sensitivity rating. The PMDPB80XP,115 provides additional compliance through RoHS3 certification, meeting current regulatory requirements for electronic components in regulated markets.

Electrical Performance: The PMDPB80XP,115 delivers equivalent or superior electrical performance within the application envelope. The 2.7A continuous drain current rating is 10% lower than the FDMA1027PT; however, this remains within acceptable tolerance for most P-channel MOSFET array applications. The on-resistance of 102mOhm is lower than the 120mOhm specification, resulting in reduced power dissipation and improved thermal performance. The lower gate threshold voltage (1V versus 1.3V) and enhanced 1.8V drive capability provide improved logic-level gate compatibility.

Package Compatibility: Both parts utilize 6-pin exposed pad packages in the VDFN family (VDFN and UFDFN variants). PCB layout compatibility requires verification of specific footprint dimensions; however, both packages maintain the same pin count and exposed pad configuration suitable for thermal management in surface mount applications.

Frequently Asked Questions (FAQ)

Q: Can PMDPB80XP,115 directly replace FDMA1027PT in existing PCB designs?

A: Electrical substitution is valid based on matching Vdss (20V), dual P-channel configuration, logic-level gate drive, and operating temperature range. Package footprint compatibility requires verification of VDFN versus UFDFN dimensions. Both parts are surface mount with exposed pad configurations and identical pin counts, but PCB layout review is necessary to confirm pad spacing and thermal via compatibility.

Q: What is the significance of the 0.3A difference in continuous drain current rating?

A: The PMDPB80XP,115 provides 2.7A versus the FDMA1027PT's 3A rating. This 10% reduction does not constitute a functional limitation for applications designed within the 2.7A envelope. Applications requiring the full 3A capability must conduct thermal and electrical analysis to confirm operation within the PMDPB80XP,115 power dissipation limit of 485mW.

Q: How do the gate charge and input capacitance differences affect circuit performance?

A: The PMDPB80XP,115 exhibits higher gate charge (8.6nC versus 6nC) and input capacitance (550pF versus 435pF). These parameters affect gate drive circuit design and switching speed. Higher values result in increased gate drive current requirements and slightly slower switching transitions. Circuit designs must accommodate these characteristics through appropriate gate driver selection and timing analysis.

Q: Are there any compliance or regulatory differences between the two parts?

A: The PMDPB80XP,115 carries RoHS3 compliance certification, whereas the FDMA1027PT does not specify RoHS status. Both parts maintain REACH Unaffected status and MSL 1 moisture sensitivity rating. For applications subject to RoHS regulations, the PMDPB80XP,115 provides explicit compliance documentation.

Q: What is the impact of the lower gate threshold voltage in PMDPB80XP,115?

A: The PMDPB80XP,115 gate threshold voltage of 1V (versus 1.3V) indicates improved logic-level gate drive compatibility and lower gate voltage requirements for full channel conduction. This characteristic, combined with the 1.8V drive capability specification, ensures reliable operation with standard logic-level gate signals and reduces gate drive power consumption.

Q: How should thermal management differ between these two parts?

A: The PMDPB80XP,115 maximum power dissipation is 485mW compared to 700mW for the FDMA1027PT. The lower power rating reflects the reduced continuous current capability. Both parts feature exposed pad packages designed for thermal management through PCB copper area and thermal vias. Thermal design calculations must account for the specific power dissipation limit of the selected part.