FDI030N06 Equivalent & Substitute Parts

Part Overview

The FDI030N06 is an N-Channel MOSFET rated for 60V drain-to-source voltage with 120A continuous drain current in a through-hole TO-262 (I2PAK) package. This device is manufactured by onsemi and belongs to the PowerTrench® series. The part is designated as Last Time Buy, indicating that finding equivalent or substitute components is necessary for ongoing design requirements and future procurement planning.

Substiute Parts

FDI030N06

onsemiIn Stock: 2067FDI030N06 Datasheet

Current PartRFQ

NTBGS2D5N06C

onsemiIn Stock: 1535NTBGS2D5N06C Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the FDI030N06 is based on the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

• Drain-to-Source Voltage (Vdss) must equal or exceed 60V
• N-Channel MOSFET technology type
• Operating temperature range of -55°C to 175°C (TJ)
• Gate voltage rating of ±20V maximum

Mechanical Compatibility Criteria:

• Package type and mounting configuration
• Lead configuration and thermal characteristics
• Power dissipation capability

The NTBGS2D5N06C qualifies as a substitute based on matching voltage rating (60V Vdss), N-Channel MOSFET technology, identical operating temperature range, and equivalent gate voltage specifications. However, this substitute differs in mounting type (Surface Mount vs. Through Hole) and package configuration (TO-263 D2PAK vs. TO-262 I2PAK), which affects circuit board integration requirements.

Parameter Comparison

Engineering Selection Recommendations

Electrical Equivalence: The NTBGS2D5N06C maintains electrical equivalence with the FDI030N06 across all critical voltage and temperature parameters. Both devices are rated for 60V Vdss, operate across the identical temperature range of -55°C to 175°C, and accept ±20V gate voltage. The substitute exhibits superior on-state resistance characteristics (2.5 mOhm vs. 3.2 mOhm) and lower gate charge (45.4 nC vs. 151 nC), resulting in improved switching efficiency and reduced gate drive requirements.

Compliance and Regulatory Status: Both the FDI030N06 and NTBGS2D5N06C carry ROHS3 compliance and REACH Unaffected status, ensuring regulatory alignment for applications subject to environmental restrictions. Both components are designated Last Time Buy, indicating that long-term availability planning is required for either selection.

Package and Mounting Considerations: The primary distinction between these components is the mounting configuration. The FDI030N06 uses through-hole TO-262 (I2PAK) packaging, while the NTBGS2D5N06C employs surface-mount TO-263 (D2PAK) packaging. This difference necessitates circuit board redesign if transitioning between these parts. The through-hole configuration of the FDI030N06 provides mechanical robustness for high-vibration environments, whereas the surface-mount NTBGS2D5N06C offers space efficiency and automated assembly compatibility.

Current Rating Differences: The NTBGS2D5N06C provides higher continuous drain current at case temperature (169A Tc vs. 120A Tc), offering additional thermal headroom in current-limited applications. However, the FDI030N06 delivers higher power dissipation capability (231W Tc vs. 136W Tc), making it more suitable for applications requiring sustained high-power operation.

Frequently Asked Questions (FAQ)

Q: Can the NTBGS2D5N06C directly replace the FDI030N06 in an existing circuit?

A: Electrical substitution is valid based on matching voltage ratings, temperature ranges, and gate voltage specifications. However, direct board-level replacement is not possible due to different package types (through-hole vs. surface-mount). Circuit board redesign is required to accommodate the different lead configuration and mounting method.

Q: What are the key electrical parameters that determine substitution eligibility?

A: The critical parameters are Drain-to-Source Voltage (Vdss), FET type (N-Channel), operating temperature range (-55°C to 175°C), and gate voltage rating (±20V). Both parts meet these criteria. Secondary considerations include on-state resistance, gate charge, and power dissipation, where the NTBGS2D5N06C demonstrates superior performance.

Q: Are there compliance or regulatory differences between these parts?

A: Both components carry identical regulatory status: ROHS3 Compliant and REACH Unaffected. No compliance barriers exist for substitution from a regulatory perspective.

Q: Why does the NTBGS2D5N06C have lower gate charge than the FDI030N06?

A: Gate charge differences result from different die designs and package configurations. The NTBGS2D5N06C's lower gate charge (45.4 nC vs. 151 nC) reduces gate drive power requirements and enables faster switching transitions, which is an advantage in high-frequency applications.

Q: What is the impact of different power dissipation ratings?

A: The FDI030N06 supports 231W (Tc) while the NTBGS2D5N06C supports 136W (Tc). In applications requiring sustained high-power operation with limited thermal management, the FDI030N06 provides greater thermal margin. For current-limited applications, the NTBGS2D5N06C's higher drain current rating (169A Tc) may be advantageous.

Q: Are both parts available for new designs?

A: Both components are designated Last Time Buy, indicating limited future availability. New design selection should account for long-term supply constraints and consider establishing qualified alternatives or stockpiling strategies.

Q: How do the package types affect thermal performance?

A: The TO-262 (I2PAK) through-hole package and TO-263 (D2PAK) surface-mount package have different thermal characteristics. Package selection depends on circuit board layout, thermal management infrastructure, and assembly process capabilities. Thermal modeling specific to the application is required to ensure adequate heat dissipation with either package type.