FDG6308P MOSFET Equivalent & Substitute Parts

Part Overview

The FDG6308P is a dual P-channel MOSFET array manufactured by onsemi, designed for surface mount applications in the SC-88 (SOT-363) package. This device features logic level gate operation with a maximum drain-source voltage rating of 20V and continuous drain current capability of 600mA at 25°C. The FDG6308P is classified as obsolete product status, necessitating identification of functionally equivalent alternatives for ongoing design requirements and procurement needs.

Substiute Parts

FDG6308P
onsemiIn Stock: 26266FDG6308P Datasheet
FDG6308P
Current Part
NTJD4152PT1G
onsemiIn Stock: 75814NTJD4152PT1G Datasheet
NTJD4152PT1G
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Key Parameters

Parameter Value Unit
Configuration 2 P-Channel (Dual)
Drain to Source Voltage (Vdss) 20 V
Current - Continuous Drain (Id) @ 25°C 600 mA
Rds On (Max) @ Id, Vgs 400 mOhm @ 600mA, 4.5V
Vgs(th) (Max) @ Id 1.5 V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 2.5 nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds 153 pF @ 10V
Power - Max 300 mW
Operating Temperature Range -55 to 150 °C (TJ)
Package / Case 6-TSSOP, SC-88, SOT-363
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitution of the FDG6308P is determined by strict equivalence across the following critical parameters:

Mandatory Matching Criteria:

  • Configuration: Dual P-channel MOSFET array
  • Drain to Source Voltage (Vdss): 20V minimum rating
  • Package / Case: 6-TSSOP, SC-88, SOT-363 (identical physical footprint)
  • Mounting Type: Surface Mount
  • Operating Temperature Range: -55°C to 150°C (TJ)
  • FET Feature: Logic Level Gate operation

Performance Parameters for Substitution Assessment:

  • Continuous Drain Current (Id): Must meet or exceed 600mA at 25°C
  • On-State Resistance (Rds On): Lower values indicate improved performance
  • Gate Threshold Voltage (Vgs(th)): Logic level compatibility
  • Gate Charge (Qg): Switching speed characteristics
  • Input Capacitance (Ciss): Load characteristics on gate drive circuits
  • Maximum Power Dissipation: Must support application thermal requirements

The NTJD4152PT1G meets all mandatory matching criteria and demonstrates enhanced electrical performance across multiple parameters, qualifying it as a direct substitute for the obsolete FDG6308P.

Parameter Comparison

Parameter FDG6308P NTJD4152PT1G Unit
Manufacturer onsemi onsemi
Configuration 2 P-Channel (Dual) 2 P-Channel (Dual)
Drain to Source Voltage (Vdss) 20 20 V
Current - Continuous Drain (Id) @ 25°C 600 880 mA
Rds On (Max) @ Id, Vgs 400 @ 600mA, 4.5V 260 @ 880mA, 4.5V mOhm
Vgs(th) (Max) @ Id 1.5 @ 250µA 1.2 @ 250µA V
Gate Charge (Qg) (Max) @ Vgs 2.5 @ 4.5V 2.2 @ 4.5V nC
Input Capacitance (Ciss) (Max) @ Vds 153 @ 10V 155 @ 20V pF
Power - Max 300 272 mW
Operating Temperature Range -55 to 150 -55 to 150 °C (TJ)
Package / Case 6-TSSOP, SC-88, SOT-363 6-TSSOP, SC-88, SOT-363
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The NTJD4152PT1G is the qualified substitute for the obsolete FDG6308P based on the following engineering factors:

Product Status Alignment: The FDG6308P is classified as obsolete, while the NTJD4152PT1G maintains active product status with current manufacturing and distribution support. This transition ensures long-term component availability and supply chain continuity.

Regulatory and Compliance Equivalence: Both devices maintain identical compliance certifications: ROHS3 Compliant, REACH Unaffected, and Moisture Sensitivity Level 1 (Unlimited). Both are classified under ECCN EAR99 and HTSUS 8541.21.0095, ensuring equivalent regulatory treatment in procurement and export contexts.

Electrical Performance Enhancement: The NTJD4152PT1G demonstrates superior electrical characteristics across multiple parameters. The continuous drain current rating increases from 600mA to 880mA, on-state resistance decreases from 400mOhm to 260mOhm, and gate threshold voltage improves from 1.5V to 1.2V. These enhancements provide improved switching efficiency and reduced power dissipation in applications operating at or near the original device's current limits.

Package and Mechanical Compatibility: Both devices utilize identical 6-TSSOP, SC-88, SOT-363 surface mount packaging, ensuring direct footprint compatibility on existing printed circuit boards without layout modifications.

Thermal and Operating Range Equivalence: Both devices operate across the identical temperature range of -55°C to 150°C (TJ), maintaining thermal performance characteristics across all application environments.

Frequently Asked Questions (FAQ)

Q: Can the NTJD4152PT1G be used as a direct replacement for the FDG6308P without circuit modifications?

A: Yes. The NTJD4152PT1G is a direct substitute for the FDG6308P. Both devices share identical package geometry (6-TSSOP, SC-88, SOT-363), pin configuration (dual P-channel), voltage rating (20V Vdss), operating temperature range (-55°C to 150°C), and logic level gate operation. No circuit modifications are required for substitution.

Q: What are the key differences between these two devices?

A: The primary differences are product status and electrical performance. The FDG6308P is obsolete, while the NTJD4152PT1G is active. The NTJD4152PT1G provides higher continuous drain current (880mA versus 600mA), lower on-state resistance (260mOhm versus 400mOhm at their respective rated currents), lower gate threshold voltage (1.2V versus 1.5V), and reduced gate charge (2.2nC versus 2.5nC).

Q: Are there any thermal or power dissipation concerns when substituting the NTJD4152PT1G for the FDG6308P?

A: The NTJD4152PT1G has a maximum power rating of 272mW compared to the FDG6308P's 300mW. However, the lower on-state resistance of the NTJD4152PT1G results in reduced power dissipation during normal operation. Applications operating within the original FDG6308P's current and power specifications will experience equal or lower thermal loads with the substitute device.

Q: Do both devices meet the same regulatory and compliance requirements?

A: Yes. Both the FDG6308P and NTJD4152PT1G are ROHS3 Compliant, REACH Unaffected, and classified as Moisture Sensitivity Level 1 (Unlimited). Both carry identical ECCN (EAR99) and HTSUS (8541.21.0095) classifications, ensuring equivalent regulatory treatment.

Q: What is the packaging difference between the two devices?

A: Both devices are supplied in 6-TSSOP, SC-88, SOT-363 surface mount packages with identical physical dimensions and pin layouts. The FDG6308P is supplied in Tape & Reel (TR) packaging, while the NTJD4152PT1G is supplied in Cut Tape (CT) and Digi-Reel® packaging. These packaging format differences do not affect electrical compatibility or circuit performance.

Q: Can the NTJD4152PT1G be used in applications requiring the exact electrical specifications of the FDG6308P?

A: Yes. The NTJD4152PT1G meets or exceeds all electrical specifications of the FDG6308P. Applications designed for the FDG6308P will operate correctly with the NTJD4152PT1G. The enhanced performance characteristics of the substitute device provide additional design margin and improved efficiency.

Q: Is the NTJD4152PT1G available in sufficient quantities for production use?

A: Current inventory data indicates 75,757 pieces of the NTJD4152PT1G are in stock as new original components, compared to 26,200 pieces of the obsolete FDG6308P. The active product status of the NTJD4152PT1G ensures ongoing manufacturing and distribution support.

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